®
BAS70J / BAS70W BAS70-04W /BAS70-05W / BAS70-06W
SMALL SIGNAL SCHOTTKY DIODE
FEATURES AND BENEFITS
n
NC K NC A K1 A K A K2
K2
n
n
n
VERY SMALL CONDUCTION LOSSES NEGLIGIBLE SWITCHING LOSSES LOW FORWARD VOLTAGE DROP SURFACE MOUNT DEVICE
A
K1
BAS70W DESCRIPTION Schottky barrier diodes encapsulated either in SOT-323 or SOD-323 small SMD packages. Single and double diodes with different pining are available.
K A2 A1 A1 K A2
A2 K1
BAS70-06W
K2 A2 K1
K2 A1
A1
BAS70-05W SOT-323
BAS70-04W
A
76
K
BAS70J SOD-323 ABSOLUTE RATINGS (limiting values) Symbol VRRM IF IFSM Ptot Tstg Tj TL Continuous forward current Surge non repetitive forward current Power dissipation (note 1) Tamb = 25°C Maximum storage temperature range Maximum operating junction temperature * Maximum temperature for soldering during 10s tp = 10 ms SOD-323 SOT-323 - 65 to +150 150 260 °C °C °C Parameter Repetitive peak reverse voltage Value 70 70 1 230 Unit V mA A mW
Note 1: for double diodes, Ptot is the total dissipation of both diodes.
*:
dPtot 1 < thermal runaway condition for a diode on its own heatsink dTj Rth( j − a )
1/5
May 2000 - Ed: 4B
BAS70J / BAS70W / BAS70-04W / BAS70-05W / BAS70-06W
THERMAL RESISTANCE Symbol Rth (j-a) Junction to ambient (*) Parameters SOD-323 SOT-323
(*) Mounted on epoxy board, with recommended pad layout.
Value 550
Unit °C/W °C/W
STATIC ELECTRICAL CHARACTERISTICS (per diode) Symbol VBR VF * IR **
Pulse test:
Test Conditions Tj = 25° C Tj = 25°C Tj = 25°C
* tp = 380µs, δ < 2% ** tp = 5 ms, δ < 2%
Min. 70
Typ.
Max.
Unit V
IR = 10µA IF = 1mA VR = 50V
410 100
mV nA
DYNAMIC CHARACTERISTICS Symbol C τ* Tj = 25° C F = 1MHz Test Conditions VR = 0V Min. Typ. Max. 2 100 Unit pF ps
Tj = 25°C IF = 5mA Krakauer Method
* Effective carrier life time.
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BAS70-05W / BAS70-06W
Fig. 1: Forward voltage drop versus forward current.
IFM(A) 7E-2
BAS70J / BAS70W / BAS70-04W /
Fig. 2: Reverse leakage current versus reverse voltage applied (typical values).
IR(µA) 1E+1
Tj=100°C Typical values
Tj=100 °C
1E-2
Tj=25°C Maximum values
1E+0 1E-1
Tj=25°C
1E-3
Tj=25°C Typical values
1E-2
VFM(V) 1E-4 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
VR(V) 1E-3 0 5 10 15 20 25 30 35 40 45 50 55 60 65 70
Fig. 3: Reverse leakage current versus junction temperature (typical values).
IR(µA) 5E+2
VR=70V
Fig. 4: Junction capacitance versus reverse voltage applied (typical values).
C(pF) 2.0 1.0
F=1MHz Tj=25°C
1E+2 1E+1 1E+0 1E-1 Tj(°C) 1E-2 0 25 50 75 100 125 150
0.1 1 VR(V) 10
100
Fig. 5: Relative variation of thermal impedance junction to ambient versus pulse duration (epoxy FR4 with recommended pad layout, S(Cu)=35µm).
Zth(j-a)/Rth(j-a) 1.00
δ = 0.5
Fig. 6: Thermal resistance junction to ambient versus copper surface under each lead (Epoxy printed circuit board FR4, copper thickness: 35 µ m).
Rth(j-a) (°C/W) 600 550 500 450
P=0.2W
δ = 0.2
0.10
δ = 0.1
T
Single pulse
400 350
tp
tp(s) 1E-1 1E+0
δ=tp/T
S(Cu) (mm ) 300 0 5 10 15 20 25 30 35 40 45 50
0.01 1E-3
1E-2
1E+1
1E+2
3/5
BAS70J / BAS70W / BAS70-04W / BAS70-05W / BAS70-06W
PACKAGE MECHANICAL DATA SOT-323 DIMENSIONS
A
REF.
A1 D
Millimeters Min. Typ. Max. Min. 1.1 0.1 0.4 2.0 1.25 0.65 1.8 0.1 0 2.1 0.2 2.4 0.3 30° 2.2 0.031 0.0 0.010 0.8 0.0 0.25 0.1 1.8 1.15
Inches Typ. Max. 0.043 0.004 0.016 0.010
A A1 b c
b
0.26 0.004
D E e H
E
0.071 0.079 0.086 0.026 0.071 0.083 0.094 0.004 0.008 0.012 0 30°
L
1.35 0.045 0.049 0.053
H
θ
c
L θ
e
4/5
BAS70-05W / BAS70-06W
PACKAGE MECHANICAL DATA SOD-323
BAS70J / BAS70W / BAS70-04W /
H b E
A1
DIMENSIONS REF. A A1 0 0.25 0.1 1.52 1.11 2.3 0.1 0.1 b c D Millimeters Min. Max. 1.17 0.1 0.44 0.25 1.8 1.45 2.7 0.46 0.41 0 0.01 0.004 0.06 0.044 0.09 0.004 0.004 Inches Min. Max. 0.046 0.004 0.017 0.01 0.071 0.057 0.106 0.02 0.016
D
A
c
Q1
E H L Q1
L
Ordering type BAS70W BAS70-04W BAS70-05W BAS70-06W BAS70J
n
Marking D28 D31 D30 D29 76
Package SOT-323 SOT-323 SOT-323 SOT-323 SOD-323
Weight 0.006g 0.006g 0.006g 0.006g 0.005g
Base qty 3000 3000 3000 3000 3000
Delivery mode Tape & reel Tape & reel Tape & reel Tape & reel Tape & reel
Epoxy meets UL94,V0
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5/5
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