BAT30F4

BAT30F4 Datasheet 30 V signal Schottky diode Features K A A 4 B • ECOPACK®2 and RoHS compliant • • • • • Reverse polarity protection Fingerprint module Camera module Bluetooth wireless earbud Biometric computer card Description B Bottom Top Very low conduction losses Negligible switching losses 0201 package Low capacitance diode Applications 0201 A • • • • Marking The BAT30F4 uses 30 V Schottky barrier diodes in a 0201 package. This device is intended to be used in smartphones, and is especially suited for rail to rail protection where its low forward voltage drop will help designers to get an efficient protection of their ICs. Product status link BAT30F4 Product summary VRRM 30 V Tj (max) 85 °C IF 300 mA DS10126 - Rev 7 - September 2018 For further information contact your local STMicroelectronics sales office. www.st.com BAT30F4 Characteristics 1 Characteristics Table 1. Absolute ratings (limiting values, at 25 °C, unless otherwise specified) Symbol VRRM IF Parameter Value Unit Repetitive peak reverse voltage 30 V Continuous forward current 300 mA 4 A 200 mW -55 to + 150 °C -40 to +85 °C IFSM Surge non repetitive forward current PD(1) Power dissipation Tstg Storage temperature range TOP Operating junction temperature range tp = 10 ms sinusoidal Tj Maximum junction temperature in DC forward mode 150 °C TL Maximum soldering temperature during 10 s 260 °C 1. On epoxy printed circuit board with minimum recommended footprint Table 2. Thermal resistance parameter Symbol Rth(j-a) Parameter Junction to ambient (1) Value (Typ.) Unit 450 °C/W 1. On epoxy printed circuit board with minimum recommended footprint Table 3. Static electrical characteristics Symbol Parameter Test conditions Tj = 25 °C IR(1) Reverse leakage current Tj = 85 °C Tj = 25 °C Tj = 85 °C Tj = 25 °C Tj = 85 °C Tj = 25 °C VF(2) Forward voltage drop Tj = 85 °C Tj = 25 °C Tj = 85 °C Tj = 25 °C Tj = 85 °C VR = 10 V VR = 30 V IF = 5 mA IF = 10 mA IF = 100 mA IF = 300 mA Min. Typ. Max. - 2.2 6.0 - 300 18 - 1600 - 0.285 - 0.205 - 0.27 - µA 0.31 0.24 0.39 Unit 0.44 V 0.40 0.55 0.625 0.64 1. Pulse test: tp = 5 ms, δ < 2% 2. Pulse test: tp = 380 µs, δ < 2% DS10126 - Rev 7 page 2/12 BAT30F4 Characteristics Table 4. Dynamic characteristics Symbol C DS10126 - Rev 7 Parameter Diode capacitance Test conditions VR = 1 V, F = 1 MHz Min. Typ. Max. Unit - 10 14 pF page 3/12 BAT30F4 Characteristics (curves) 1.1 Characteristics (curves) Figure 1. Reverse leakage current versus reverse applied voltage (typical values) 1.E+03 IR(µA) Figure 2. Forward voltage drop versus forward current (typical values) 1.E+00 IF(A) Tj = 85°C 1.E+01 Tj = 25°C 1.E-02 Tj = 25°C 1.E+00 1.E-03 VF(V) VR(V) 1.E-01 0 5 10 15 20 25 1.E-04 30 Figure 3. Relative variation of reverse leakage current versus junction temperature 1.E+02 Tj = 85°C 1.E-01 1.E+02 0.00 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45 0.50 0.55 Figure 4. Junction capacitance versus reverse applied voltage (typical values) C(pF) IR[Tj] / IR[Tj = 25 °C] 10 VR = VRRM F = 1 MHz V OSC = 30 mV RMS T j = 25°C 1.E+01 1.E+00 1.E-01 Tj(°C) 1.E-02 -40 1 -30 DS10126 - Rev 7 -20 -10 0 10 20 30 40 50 60 70 80 90 VR(V) 1 10 100 page 4/12 BAT30F4 Characteristics (curves) Figure 5. Continuous forward current versus ambient temperature 350 IF(mA) 300 250 200 150 100 50 Tamb (°C) 0 0 DS10126 - Rev 7 25 50 75 100 125 150 page 5/12 BAT30F4 Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 2.1 0201 package information Figure 6. 0201 package outline D E Top A Side fD D1 fE E1 Bottom b Table 5. 0201 package mechanical data Dimensions Millimeters Ref. Min. Typ. Max. Min. Typ. Max. A 0.28 0.30 0.32 0.0110 0.0118 0.0126 b 0.125 0.14 0.155 0.0049 0.0055 0.0061 D 0.57 0.60 0.63 0.0224 0.0236 0.0248 D1 DS10126 - Rev 7 Inches (for reference only) 0.35 0.0138 E 0.27 0.30 0.33 0.0106 0.0118 0.0130 E1 0.175 0.19 0.205 0.0069 0.0075 0.0081 fD 0.040 0.055 0.070 0.0015 0.0021 0.0027 fE 0.040 0.055 0.070 0.0015 0.0021 0.0027 page 6/12 BAT30F4 0201 package information Figure 7. Footprint in mm (inches) 0.656 (0.0258) 0.243 (0.0096) Figure 8. Marking 0.243 (0.0096) Pin2 4 Pin1 0.300 (0.0118) 0.170 (0.0067) Note: The marking codes can be rotated by 90° or 180° to differentiate assembly location. In no case should this product marking be used to orient the component for its placement on a PCB. Only pin 1 mark is to be used for this purpose. Figure 9. Tape and reel specification Bar indicates Pin1 Ø 1.5 ± 0.1 4.0 ± 0.1 1.75 ± 0.1 2.0 ± 0.05 3.5 ± 0.05 0.68 ± 0.03 8.0 + 0.03 - 0.01 0.22 4 0.36 ± 0.03 4 4 4 4 4 4 0.38 ± 0.03 2.0 ± 0.05 All dimensions in mm DS10126 - Rev 7 User direction of unreeling page 7/12 BAT30F4 Recommendation on PCB assembly 3 Recommendation on PCB assembly 3.1 Stencil opening design 1. General recommendation on stencil opening design a. Stencil opening dimensions: L (Length), W (Width), T (Thickness). Figure 10. Stencil opening recommendation L T b. General design rule ◦ Stencil thickness (T) = 75 ~ 125 μm ◦ ◦ 1. W W ≥ 1.5 T L  ×  W ≥ 0.66 2T L  + W Reference design a. Stencil opening thickness: 80 µm b. Other dimensions: see below figure. Figure 11. Recommended stencil window position, stencil opening thickness: 80 μm 0.230 (0.0091) 0.643 (0.0253) 0.183 (0.0072) 0.285 (0.0112) 0.008 (0.0003) 0.300 (0.0118) 0.008 (0.0003) 0.656 (0.0258) 0.007 0.007 (0.00027) (0.00027) 0.170 (0.0067) 0.243 (0.0096) mm (inches) Footprint DS10126 - Rev 7 Stencil window page 8/12 BAT30F4 Solder paste 3.2 Solder paste 1. 2. 3. 4. 3.3 Placement 1. 2. 3. 4. 5. 6. 3.4 Manual positioning is not recommended. It is recommended to use the lead recognition capabilities of the placement system, not the outline centering Standard tolerance of ±0.05 mm is recommended. 1.0 N placement force is recommended. Too much placement force can lead to squeezed out solder paste and cause solder joints to short. Too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. To improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool. For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools. PCB design preference 1. 2. 3.5 Halide-free flux qualification ROL0 according to ANSI/J-STD-004. “No clean” solder paste is recommended. Offers a high tack force to resist component displacement during PCB movement. Use solder paste with fine particles: Type 4 (powder particle size 20-48 μm per IPC J STD-005). To control the solder paste amount, the closed via is recommended instead of open vias. The position of tracks and open vias in the solder area should be well balanced. A symmetrical layout is recommended, to avoid any tilt phenomena caused by asymmetrical solder paste due to solder flow away. Reflow profile Figure 12. ST ECOPACK® recommended soldering reflow profile for PCB mounting 250 240-245 °C Temperature (°C) -2 °C/s 2 - 3 °C/s 60 sec (90 max) 200 -3 °C/s 150 -6 °C/s 100 0.9 °C/s 50 Time (s) 0 Note: DS10126 - Rev 7 30 60 90 120 150 180 210 240 270 300 Minimize air convection currents in the reflow oven to avoid component movement. page 9/12 BAT30F4 Ordering information 4 Ordering information Table 6. Ordering information Order code Marking Package Weight Base qty Delivery mode BAT30F4 4(1) Flat CSPS 0.116 mg 15000 Tape and reel 1. The marking codes can be rotated by 90° or 180° to differentiate assembly location DS10126 - Rev 7 page 10/12 BAT30F4 Revision history Table 7. Document revision history DS10126 - Rev 7 Date Revision Changes 13-May-2014 1 First issue 24-Nov-2014 2 Updated Table 2. 13-Apr-2015 3 Updated Features and Description. 11-Feb-2016 4 Updated Table 3 and Figure 4. 26-Feb-2016 5 Updated Table 2. Added Table 3, Table 5 and Figure 7. 05-Jun-2018 6 Updated Table 3. Static electrical characteristics, Table 5. 0201 package mechanical data and Table 6. Ordering information. 24-Sep-2018 7 Updated Table 3. Static electrical characteristics. page 11/12 BAT30F4 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2018 STMicroelectronics – All rights reserved DS10126 - Rev 7 page 12/12