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BAT41JFILM

BAT41JFILM

  • 厂商:

    STMICROELECTRONICS(意法半导体)

  • 封装:

    SC76

  • 描述:

    DIODE SCHOTTKY 100V 200MA SOD323

  • 数据手册
  • 价格&库存
BAT41JFILM 数据手册
BAT41 Series Low capacitance small signal Schottky diodes Main product characteristics IF VRRM C (typ) Tj (max) 200 mA 100 V 3 pF 150° C BAT41ZFILM (Single) SOD-123 Features and benefits ■ ■ ■ ■ ■ ■ BAT41JFILM (Single) SOD-323 Low leakage current losses Negligible switching losses Low forward and reverse recovery times Extremely fast switching Surface mount device Low capacitance diode BAT41KFILM (Single) SOD-523 Description The BAT41 series uses 100 V Schottky barrier diodes packaged in SOD-123, SOD-323, SOD523, SOT-323, or SOT-666. This series is specially suited for switching mode with low IR losses BAT41WFILM (Single) BAT41CWFILM (Common cathode) BAT41AWFILM (Common anode) SOT-323 Order codes Part Number BAT41ZFILM BAT41WFILM BAT41SWFILM BAT41CWFILM BAT41AWFILM BAT41JFILM BAT41KFILM BAT41-09P6FILM BAT41-07P6FILM Marking Z41 B41 S41 C41 A41 41 41 Q1 P1 BAT41SWFILM (Series) BAT41-07P6FILM (2 parallel diodes) SOT-666 BAT41-09P6FILM (2 opposite diodes) Configurations in top view August 2006 Rev 1 1/12 www.st.com Characteristics BAT41 Series 1 Table 1. Symbol VRRM IF IFSM Tstg Tj Characteristics Absolute ratings (limiting values at Tj = 25° C, unless otherwise specified) Parameter Repetitive peak reverse voltage Continuous forward current Surge non repetitive forward current Storage temperature range Maximum operating junction temperature tp = 10 ms Sinusoidal Value 100 200 1 -65 to +150 150 Unit V mA A °C °C Table 2. Symbol Thermal parameters Parameter SOD-123 Value 500 550 600 °C/W Unit Rth(j-a) Junction to ambient(1) SOT-323, SOD-323 SOD-523, SOT-666 1. Epoxy printed circuit board with recommended pad layout Table 3. Symbol IR(1) VF(2) Static electrical characteristics Parameter Reverse leakage current Test conditions Tj = 25° C Tj = 100° C Forward voltage drop Tj = 25° C VR = 50 V IF = 1 m A IF = 200 mA 400 Min. Typ Max. 0.1 µA 20 450 mV 1000 Unit 1. Pulse test: tp = 5 ms, δ < 2 % 2. Pulse test: tp = 380 µs, δ < 2 % Table 4. Symbol C Dynamic characteristics Parameter Diode capacitance Test conditions VR = 1 V, F = 1 MHz Min. Typ 3 Max. 10 Unit pF 2/12 BAT41 Series Characteristics Figure 1. P(W) 0.22 0.20 0.18 0.16 0.14 0.12 0.10 0.08 0.06 Average forward power dissipation Figure 2. versus average forward current IF(AV)(A) 0.22 Average forward current versus ambient temperature (δ = 1) δ = 0.05 δ = 0.1 δ = 0.2 δ = 0.5 0.20 0.18 δ=1 0.16 0.14 0.12 0.10 0.08 T 0.04 0.02 0.00 0.00 0.02 0.04 0.06 0.08 0.10 0.12 0.14 0.16 0.06 T 0.04 0.02 IF(AV)(A) δ=tp/T 0.18 0.20 0.22 tp 0.00 0.24 0 δ=tp/T 25 tp 50 Tamb(°C) 75 100 125 150 Figure 3. Reverse leakage current versus reverse applied voltage (typical values) Figure 4. Reverse leakage current versus junction temperature (typical values) IR(µA) 1.E+03 Tj=150°C IR(µA) 1.E+03 VR=50V 1.E+02 Tj=125°C 1.E+02 1.E+01 1.E+01 Tj=100°C 1.E+00 1.E+00 Tj=75°C Tj=50°C 1.E-01 1.E-01 Tj=25°C 1.E-02 1.E-02 0 20 40 VR(V) 60 80 100 Tj(°C) 1.E-03 0 25 50 75 100 125 150 Figure 5. Junction capacitance versus reverse applied voltage (typical values) F=1MHz VOSC=30mVRMS Tj=25°C Figure 6. Forward voltage drop versus forward current (typical values) C(pF) 10.0 1.E+00 IFM(A) 1.E-01 Tj=75°C 1.0 1.E-02 Tj=-40°C 1.E-03 VR(V) 0.1 1.0 10.0 100.0 1.E-04 0.0 0.1 0.2 0.3 0.4 0.5 VFM(V) 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 3/12 Characteristics BAT41 Series Figure 7. Forward voltage drop versus forward current (typical values) Figure 8. Variation of thermal impedance junction to ambient versus pulse duration (printed circuit board, epoxy FR4, eCU=35 µm, SOT323-6L) IFM(A) 1.E+00 1000 Zth(j-a)(°C/W) SOT323-6L 1.E-01 Tj=100°C Tj=125°C 1.E-02 Tj=25°C 100 Single pulse 1.E-03 VFM(V) 1.E-04 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 10 1.E-02 1.E-01 tp(s) 1.E+00 1.E+01 1.E+02 Figure 9. Relative variation of thermal impedance junction to ambient versus pulse duration (alumine substrate, SOT-23) (printed circuit board, epoxy FR4, eCU=35 µm, SOD-323) Figure 10. Relative variation of thermal impedance junction to ambient versus pulse duration (printed circuit board, epoxy FR4, eCU=35 µm, SOT-666 and SOD-523) Zth(j-a)/Rth(j-a) 1.00 Zth(j-a)/Rth(j-a) 1.00 SOT-23 Alumine substrate 10 x 8 x 0.5 mm SOD-523 Epoxy FR4 eCU = 35 µm SOD-323 Epoxy FR4 SCU = 2.25 mm2 eCU = 35 µm Single pulse 0.10 0.10 Single pulse SOT-666 Epoxy FR4 eCU = 35 µm tp(s) 0.01 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 0.01 1.E-03 1.E-02 tp(s) 1.E-01 1.E+00 1.E+01 Figure 11. Thermal resistance junction to ambient versus copper surface under each lead (printed circuit board, epoxy FR4, eCU=35 µm, SOD-323) Rth(j-a)(°C/W) 600 550 500 450 400 350 SCU(mm²) 300 0 5 10 15 20 25 30 35 40 45 50 4/12 BAT41 Series Ordering information scheme 2 Ordering information scheme BAT41 Signal Schottky diodes VRRM = 100 V Configuration No letter = Single diode A = Common anode C = Common cathode S = Series diodes 07 = Parallel diodes 09 = Opposite diodes Package J = SOD-323 W = SOT-323 K = SOD-523 P6 = SOT-666 Z = SOD-123 Packing FILM = Tape and reel xx xx FILM 5/12 Package information BAT41 Series 3 Package information Epoxy meets UL94, V0 Table 5. SOD-123 dimensions Dimensions Ref. H A2 A1 b E Millimeters Min. Max. 1.45 0 0.85 0.1 1.35 0 Inches Min. Max. 0.057 0.004 0.053 A A1 D A A2 b 0.033 0.55 Typ. 0.15 Typ. 2.55 1.4 0.25 3.55 3.95 2.85 1.7 0.022 Typ. 0.039 Typ. 0.1 0.055 0.01 0.14 0.156 0.112 0.067 c c D E G G H Figure 12. SOD-123 footprint (dimensions in mm) 4.45 0.65 0.97 2.51 0.97 6/12 BAT41 Series Table 6. SOD-323 dimensions Package information Dimensions H b E A1 Ref. Millimeters Min. Max. 1.17 0 0.25 0.1 1.52 1.11 2.3 0.1 0.1 0.1 0.44 0.25 1.8 1.45 2.7 0.46 0.41 0 Inches Min. Max. 0.046 0.004 0.017 0.01 0.071 0.057 0.106 0.02 0.016 A A1 D A b c 0.01 0.004 0.06 0.044 0.09 0.004 0.004 c Q1 D E H L L Q1 Figure 13. SOD-323 footprint (dimensions in mm) 3.20 0.54 1.06 1.08 1.06 7/12 Package information Table 7. SOD-523 dimensions BAT41 Series Dimensions E 0.15 M C A B E1 B Ref. Millimeters Min. Typ. 0.60 1.60 1.20 0.80 Max. 0.70 1.70 1.30 0.90 0.35 0.20 0.20 0.25 0.20 Min. Inches Typ. Max. 2xb D A E 0.50 1.50 1.10 0.70 0.25 0.07 0.15 0.10 0.020 0.024 0.028 0.059 0.063 0.067 0.043 0.047 0.051 0.028 0.031 0.035 0.010 0.003 0.014 0.008 0.20 M C A B A R0.1 8° E1 D A SEATING PLANE c C L 7° b c L1 L L1 0.006 0.008 0.010 0.004 0.008 Figure 14. SOD-523 footprint (dimensions in mm) 0.7 0.3 2 8/12 BAT41 Series Table 8. SOT-323 dimensions Package information Dimensions Ref. A E Millimeters Min. Typ. Max. 1.1 0.1 0.4 0.26 2.0 1.25 0.65 1.8 0.1 0 2.1 0.2 2.4 0.3 30° 0.071 0.004 0 2.2 1.35 Min. 0.031 0.0 0.010 0.004 0.071 0.045 Inches Typ. Max. 0.043 0.004 0.016 0.010 0.079 0.049 0.026 0.083 0.008 0.094 0.012 30° 0.086 0.053 A e b D 0.8 0.0 0.25 0.1 1.8 1.15 A1 b c A1 D E c θ H e L H L q Figure 15. SOT-323 footprint (dimensions in mm) 0.95 1.0 2.9 0.8 0.50 9/12 Package information Table 9. SOT-666 dimensions BAT41 Series Dimensions b1 L1 Ref. Millimeters Min. Typ. Max. Min. Inches Typ. Max. 0.024 0.007 0.013 L3 b A A3 b D E1 0.45 0.08 0.17 0.19 1.50 1.50 1.10 0.50 0.19 0.10 0.10 0.27 0.60 0.018 0.18 0.003 0.34 0.007 b1 D 0.34 0.007 0.011 0.013 1.70 0.059 1.70 0.059 1.30 0.043 0.020 0.007 0.30 0.004 0.004 0.012 0.067 0.067 0.051 A E L2 E A3 E1 e L1 L2 e L3 Figure 16. SOT-666 footprint (dimensions in mm) 0.50 0.62 2.60 0.99 0.30 In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 10/12 BAT41 Series Ordering information 4 Ordering information Part Number BAT41ZFILM BAT41WFILM BAT41SWFILM BAT41CWFILM BAT41AWFILM BAT41JFILM BAT41KFILM BAT41-09P6FILM BAT41-07P6FILM Marking Z41 B41 S41 C41 A41 41 41 Q1 P1 Package SOD-123 Single SOT-323 Single SOT-323 Series SOT-323 Common cathode SOT-323 Common anode SOD-323 Single SOD-523 Single SOT-666 Opposite SOT-666 Parallel Weight 10 mg 6 mg 6 mg 6 mg 6 mg 5 mg 1.4 mg 2.9 mg 2.9 mg Base qty 3000 3000 3000 3000 3000 3000 3000 3000 3000 Delivery mode Tape and reel Tape and reel Tape and reel Tape and reel Tape and reel Tape and reel Tape and reel Tape and reel Tape and reel 5 Revision history Date 08-Aug-2006 Revision 1 Initial release. Description of Changes 11/12 BAT41 Series Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2006 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 12/12
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