BAT48

BAT48 Series Small signal Schottky diodes Main product characteristics IF VRRM C (typ) Tj (max) 350 mA 40 V 18 pF 150° C BAT48ZFILM (Single) SOD-123 Features and benefits ■ ■ ■ ■ ■ ■ Low leakage current losses Negligible switching losses Low forward and reverse recovery times Extremely fast switching Surface mount device Low capacitance diode BAT48JFILM (Single) SOD-323 Configurations in top view Description The BAT48 series uses 40 V Schottky barrier diodes packaged in SOD-123 or SOD-323. This series is general purpose and features very low turn-on voltage and fast switching Table 1. Symbol VRRM IF IFSM Tstg Tj Repetitive peak reverse voltage Continuous forward current Surge non repetitive forward current Storage temperature range Maximum operating junction temperature Order codes Part Number BAT48ZFILM BAT48JFILM Marking Z48 48 Absolute ratings (limiting values at Tj = 25° C, unless otherwise specified) Parameter Value 40 350 tp = 10 ms Sinusoidal 2 -65 to +150 150 Unit V mA A °C °C August 2006 Rev 1 1/8 www.st.com Characteristics BAT48 Series 1 Table 2. Symbol Rth(j-a) Characteristics Thermal parameters Parameter Junction to ambient(1) SOD-123 SOD-323 Value 500 °C/W 550 Unit 1. Epoxy printed circuit board with recommended pad layout Table 3. Symbol VBR Static electrical characteristics Parameter Breakdown reverse voltage Test conditions Tj = 25° C Ir = 25 µA VR = 1.5 V Tj = 25° C VR = 10 V VR = 20 V VR = 40 V VR = 1.5 V Tj = 60° C VR = 10 V VR = 20 V VR = 40 V IF = 0.1 mA IF = 1 m A Min. 40 1 2 5 25 µA 10 15 25 50 0.25 0.3 0.4 V 0.5 0.75 0.9 Typ Max. Unit V IR(1) Reverse leakage current VF(2) Forward voltage drop Tj = 25° C IF = 10 mA IF = 50 mA IF = 200 mA IF = 500 mA 1. Pulse test: tp = 5 ms, δ < 2 % 2. Pulse test: tp = 380 µs, δ < 2 % Table 4. Symbol C Dynamic characteristics Parameter Diode capacitance Test conditions VR = 0 V, F = 1 MHz VR = 1 V, F = 1 MHz Min. Typ 30 pF 18 Max. Unit 2/8 BAT48 Series Characteristics Figure 1. P(W) 0.30 Average forward power dissipation Figure 2. versus average forward current IF(AV)(A) 0.40 Average forward current versus ambient temperature (δ = 1) 0.25 δ = 0.05 δ = 0.1 δ = 0.2 δ = 0.5 0.35 0.30 0.20 δ=1 0.25 0.20 0.15 0.15 0.10 T 0.05 0.10 0.05 T IF(AV)(A) 0.00 0.00 0.05 0.10 0.15 0.20 0.25 δ=tp/T 0.30 0.35 tp 0.00 0.40 0 δ=tp/T 25 tp 50 Tamb(°C) 75 100 125 150 Figure 3. Reverse leakage current versus reverse applied voltage (typical values) Figure 4. Reverse leakage current versus junction temperature (typical values) IR(µA) 1.E+04 IR(µA) 1.E+04 VR=40V 1.E+03 Tj=125°C 1.E+03 Tj=100°C 1.E+02 Tj=75°C 1.E+02 1.E+01 Tj=50°C 1.E+01 1.E+00 Tj=25°C 1.E+00 1.E-01 0 5 10 15 VR(V) 20 25 30 35 40 Tj(°C) 1.E-01 0 25 50 75 100 125 Figure 5. Junction capacitance versus reverse applied voltage (typical values) Figure 6. Forward voltage drop versus forward current (typical values) C(pF) 35 30 25 20 1.E-02 15 10 5 F=1MHz VOSC=30mVRMS Tj=25°C IFM(A) 1.E+00 1.E-01 Tj=125°C Tj=25°C 1.E-03 VR(V) 0 0 5 10 15 20 25 30 35 40 1.E-04 0.0 0.2 0.4 VFM(V) 0.6 0.8 1.0 3/8 Ordering information scheme BAT48 Series Figure 7. Relative variation of thermal impedance junction to ambient versus pulse duration (epoxy FR4 with recommended pad layout, eCU = 35 µm) (SOD-323) Figure 8. Thermal resistance junction to ambient versus copper surface under each lead (printed circuit board, epoxy FR4, eCU=35 µm, SOD-323) Zth(j-a)/Rth(j-a) 1.00 600 Rth(j-a)(°C/W) 550 SOD-323 Epoxy FR4 SCU = 2.25 mm2 eCU = 35 µm 500 0.10 Single pulse 450 400 350 tp(s) 0.01 1.E-02 300 SCU(mm²) 1.E+01 1.E+02 0 5 10 15 20 25 30 35 40 45 50 1.E-01 1.E+00 2 Ordering information scheme BAT48 Signal Schottky diodes VRRM = 40 V Configuration No letter = Single diode Package J = SOD-323 Z = SOD-123 Packing FILM = Tape and reel xx xx FILM 4/8 BAT48 Series Package information 3 Package information Epoxy meets UL94, V0 Table 5. SOD-123 dimensions Dimensions Ref. H A2 A1 b E Millimeters Min. Max. 1.45 0 0.85 0.1 1.35 0 Inches Min. Max. 0.057 0.004 0.053 A A1 D A A2 b 0.033 0.55 Typ. 0.15 Typ. 2.55 1.4 0.25 3.55 3.95 2.85 1.7 0.022 Typ. 0.039 Typ. 0.1 0.055 0.01 0.14 0.156 0.112 0.067 c c D E G G H Figure 9. SOD-123 footprint (dimensions in mm) 4.45 0.65 0.97 2.51 0.97 5/8 Package information Table 6. SOD-323 dimensions BAT48 Series Dimensions H b E A1 Ref. Millimeters Min. Max. 1.17 0 0.25 0.1 1.52 1.11 2.3 0.1 0.1 0.1 0.44 0.25 1.8 1.45 2.7 0.46 0.41 0 Inches Min. Max. 0.046 0.004 0.017 0.01 0.071 0.057 0.106 0.02 0.016 A A1 D A b c 0.01 0.004 0.06 0.044 0.09 0.004 0.004 c Q1 D E H L L Q1 Figure 10. SOD-323 footprint (dimensions in mm) 3.20 0.54 1.06 1.08 1.06 In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 6/8 BAT48 Series Ordering information 4 Ordering information Part Number BAT48ZFILM BAT48JFILM Marking Z48 48 Package SOD-123 Single SOD-323 Single Weight 10 mg 5 mg Base qty 3000 3000 Delivery mode Tape and reel Tape and reel 5 Revision history Date 08-Aug-2006 Revision 1 Initial release. Description of Changes 7/8 BAT48 Series Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. 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