BAT5409JFILM

BAT54 Series Small signal Schottky diodes Main product characteristics IF VRRM C (typ) Tj (max) 300 mA 40 V 7 pF 150° C SOD-323 SOD-123 BAT54ZFILM (Single) BAT54JFILM (Single) Features and benefits ■ ■ ■ ■ ■ ■ Low conduction and reverse losses Negligible switching losses Low forward and reverse recovery times Extremely fast switching Surface mount device Low capacitance diode SOT-23 SOD-523 BAT54KFILM (Single) BAT54FILM (Single) BAT54AFILM (Common anode) BAT54SFILM (Series) BAT54CFILM (Common cathode) Description The BAT54 series uses 40 V Schottky barrier diodes packaged in SOD- 23, SOD-323, SOD-523, SOT-23, SOT-323, or SOT-666. Order codes Part Number BAT54FILM BAT54SFILM BAT54CFILM BAT54AFILM BAT54WFILM BAT54SWFILM BAT54CWFILM BAT54AWFILM BAT54JFILM BAT54KFILM BAT54-07P6FILM BAT54-09P6FILM BAT54ZFILM Marking D86 D88 D87 D84 D73 D78 D77 D74 86 86 P4 Q4 D72 SOT-666 BAT54WFILM (Single) BAT54CWFILM (Common cathode) BAT54AWFILM (Common anode) BAT54SWFILM (Series) SOT-323 BAT54-07P6FILM (2 parallel diodes) BAT54-09P6FILM (2 opposite diodes) Configurations in top view July 2006 Rev 9 1/13 www.st.com Characteristics BAT54 Series 1 Table 1. Symbol VRRM IF IFSM Tstg Tj TL Characteristics Absolute ratings (limiting values at Tj = 25° C, unless otherwise specified) Parameter Repetitive peak reverse voltage Continuous forward current Surge non repetitive forward current Storage temperature range Operating junction temperature range Maximum soldering temperature tp = 10 ms Sinusoidal Value 40 300 1 -65 to +150 -40 to +150 260 Unit V mA A °C °C °C Table 2. Symbol Thermal parameters Parameter SOT-23, SOD-123 Value 500 °C/W SOT-323, SOD-323, SOD-523, SOT-666 550 600 Unit Rth(j-a) Junction to ambient(1) 1. Epoxy printed circuit board with recommended pad layout Table 3. Symbol IR(1) Static electrical characteristics Parameter Reverse leakage current Test conditions Tj = 25° C Tj = 100° C VR = 30 V IF = 0.1 mA IF = 1 m A Min. Typ Max. 1 µA 100 240 320 400 500 900 mV Unit VF(2) Forward voltage drop Tj = 25° C IF = 10 mA IF = 30 mA IF = 100 mA 1. Pulse test: tp = 5 ms, δ < 2 % 2. Pulse test: tp = 380 µs, δ < 2 % Table 4. Symbol C trr Dynamic characteristics Parameter Diode capacitance Reverse recovery time Test conditions VR = 1 V, F = 1 MHz IF = 10 mA, IR = 10 mA, Tj = 25° C Irr = 1 mA, RL = 100 Ω Min. Typ 7 Max. 10 5 Unit pF ns 2/13 BAT54 Series Characteristics Figure 1. Average forward power dissipation Figure 2. versus average forward current 0.35 δ=0.05 δ=0.2 δ=0.1 δ=0.5 δ=1 Average forward current versus ambient temperature (δ = 1) 0.35 0.30 0.25 0.20 0.15 0.10 0.05 P(W) IF(AV)(A) 0.30 0.25 0.20 0.15 T 0.10 0.05 tp T IF(AV)(A) δ=tp/T 0.20 0.25 0.30 δ=tp/T 0 25 tp T amb (°C) 0.00 0.00 0.00 0.05 0.10 0.15 0.35 50 75 100 125 150 Figure 3. Reverse leakage current versus reverse applied voltage (typical values) Figure 4. Reverse leakage current versus junction temperature 1.E+02 IR(µA) Tj=100°C IR[T j] / IR[T j=25°C] 1.E+04 VR=3V 1.E+01 1.E+03 1.E+02 1.E+00 Tj=50°C 1.E+01 1.E-01 Tj=25°C 1.E+00 VR(V) T j(°C) 1.E-01 1.E-02 0 5 10 15 20 25 30 0 25 50 75 100 125 150 Figure 5. Junction capacitance versus reverse applied voltage (typical values) F=1MHz VOSC=30mVRMS Tj=25°C Figure 6. Forward voltage drop versus forward current (typical values) 10 C(pF) 1.E+00 IFM(A) Tj=100°C 1.E-01 1.E-02 Tj=50°C Tj=25°C 1.E-03 VR(V) Tj=-40 °C 1 1 10 100 1.E-04 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 VFM(V) 3/13 Characteristics BAT54 Series Figure 7. Thermal resistance junction to ambient versus copper surface under each lead - epoxy FR4 with recommended pad layout, eCU = 35 µm (SOD-323) Epoxy FR4 eCU=35 µm Figure 8. Relative variation of thermal impedance junction to ambient versus pulse duration - epoxy FR4 with recommended pad layout, eCU = 35 µm (SOD-323) Single pulse SOD323 600 Rth(j-a) (°C/W) 1.E+00 Zth(j-a) /Rth(j-a) 500 1.E-01 400 1.E-02 300 SCU(mm²) Epoxy FR4 SCU=2.25 mm² eCU=35 µm tP(s) 200 0 5 10 15 20 25 30 35 40 45 50 1.E-03 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 Figure 9. Relative variation of thermal impedance junction to ambient versus pulse duration aluminium oxide substrate 10 mm x 8 mm x 0.5 mm (SOT-23) Single pulse SOT23 Figure 10. Relative variation of thermal impedance junction to ambient versus pulse duration - epoxy FR4 with recommended pad layout, eCU = 35 µm (SOD-523) 1.E+00 Zth(j-a) /Rth(j-a) Single pulse SOD523 1.E+00 Zth(j-a) /Rth(j-a) 1.E-01 1.E-01 1.E-02 Alumine substrate 10 x 8 x 0.5 mm tP(s) tP(s) Epoxy FR4 eCU=35 µm 1.E-02 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E-03 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 Figure 11. Relative variation of thermal impedance junction to ambient versus pulse duration - epoxy FR4 with recommended pad layout, eCU = 35 µm (SOT-666) 1.E+00 Zth(j-a) /Rth(j-a) Single pulse SOT666 1.E-01 tP(s) Epoxy FR4 eCU=35 µm 1.E-02 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 4/13 BAT54 Series Ordering information scheme 2 Ordering information scheme BAT54 Signal Schottky diodes VRRM = 40 V Configuration No letter = Single diode A = Common anode C = Common cathode S = Series diodes 07 = Parallel diodes 09 = Opposite diodes Package Blank = SOT-23 J = SOD-323 W = SOT-323 K = SOD-523 P6 = SOT-666 Z = SOD-123 Packing FILM = Tape and reel xx xx FILM 5/13 Package information BAT54 Series 3 Package information Epoxy meets UL94, V0 Table 5. SOD-123 dimensions Dimensions Ref. H A2 A1 b E Millimeters Min. Max. 1.45 0 0.85 0.1 1.35 0 Inches Min. Max. 0.057 0.004 0.053 A A1 D A A2 b 0.033 0.55 Typ. 0.15 Typ. 2.55 1.4 0.25 3.55 3.95 2.85 1.7 0.022 Typ. 0.039 Typ. 0.1 0.055 0.01 0.14 0.156 0.112 0.067 c c D E G G H Figure 12. SOD-123 footprint (dimensions in mm) 4.45 0.65 0.97 2.51 0.97 6/13 BAT54 Series Table 6. SOD-323 dimensions Package information Dimensions Ref. H b E A1 Millimeters Min. Max. 1.17 0 0.25 0.1 1.52 1.11 2.3 0.1 0.1 0.1 0.44 0.25 1.8 1.45 2.7 0.46 0.41 0 Inches Min. Max. 0.046 0.004 0.017 0.01 0.071 0.057 0.106 0.02 0.016 A A1 D A b c 0.01 0.004 0.06 0.044 0.09 0.004 0.004 c Q1 D E L H L Q1 Figure 13. SOD-323 footprint (dimensions in mm) 3.20 0.54 1.06 1.08 1.06 7/13 Package information Table 7. SOD-523 dimensions Dimensions E 0.15 M C A B E1 B BAT54 Series Ref. Millimeters Min. Typ. 0.60 1.60 1.20 0.80 Max. 0.70 1.70 1.30 0.90 0.35 0.20 0.20 0.25 0.20 Min. 0.020 0.059 0.043 0.028 0.010 0.003 0.006 0.004 Inches Typ. 0.024 0.063 0.047 0.031 Max. 0.028 0.067 0.051 0.035 0.014 0.008 0.008 0.010 0.008 2xb D A E 8° 0.50 1.50 1.10 0.70 0.25 0.07 0.15 0.10 0.20 M C A B A R0.1 E1 A SEATING PLANE c C L 7° D b c L1 L L1 Figure 14. SOD-523 footprint (dimensions in mm) 0.7 0.3 2 8/13 BAT54 Series Table 8. SOT-23 dimensions Package information Dimensions Ref. A E Millimeters Min. Max. 1.4 0.1 0.51 0.18 3.04 1.05 2.1 1.6 2.75 0.6 typ. 0.35 0.65 Inches Min. 0.035 0 0.012 0.003 0.108 0.033 0.067 0.047 0.083 Max. 0.055 0.004 0.02 0.007 0.12 0.041 0.083 0.063 0.108 A A1 e B e1 D 0.89 0 0.3 0.085 2.75 0.85 1.7 1.2 2.1 B c S A1 D e e1 L H c E H L S 0.024 typ. 0.014 0.026 Figure 15. SOT-23 footprint (dimensions in mm) 0.95 0.61 1.26 0.73 3.25 9/13 Package information Table 9. SOT-323 dimensions Dimensions A E BAT54 Series Ref. Millimeters Min. Typ. Max. 1.1 0.1 0.4 0.26 2.0 1.25 0.65 1.8 0.1 0 2.1 0.2 2.4 0.3 30° 0.071 0.004 0 2.2 1.35 Min. 0.031 0.0 0.010 0.004 0.071 0.045 Inches Typ. Max. 0.043 0.004 0.016 0.010 0.079 0.049 0.026 0.083 0.008 0.094 0.012 30° 0.086 0.053 A e b D 0.8 0.0 0.25 0.1 1.8 1.15 A1 b c A1 D E e c θ H L H L q Figure 16. SOT-323 footprint (dimensions in mm) 0.95 1.0 2.9 0.8 0.50 10/13 BAT54 Series Table 10. SOT-666 dimensions Package information Dimensions b1 L1 Ref. Millimeters Min. Typ. Max. Min. Inches Typ. Max. 0.024 0.007 0.013 L3 b A A3 b D E1 0.45 0.08 0.17 0.19 1.50 1.50 1.10 0.50 0.19 0.10 0.10 0.27 0.60 0.018 0.18 0.003 0.34 0.007 b1 D 0.34 0.007 0.011 0.013 1.70 0.059 1.70 0.059 1.30 0.043 0.020 0.007 0.30 0.004 0.004 0.012 0.067 0.067 0.051 A E L2 E A3 E1 e L1 L2 e L3 Figure 17. SOT-666 footprint (dimensions in mm) 0.50 0.62 2.60 0.99 0.30 In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 11/13 Ordering information BAT54 Series 4 Ordering information Part Number BAT54FILM BAT54SFILM BAT54CFILM BAT54AFILM BAT54WFILM BAT54SWFILM BAT54CWFILM BAT54AWFILM BAT54JFILM BAT54KFILM BAT54-07P6FILM BAT54-09P6FILM BAT54ZFILM Marking D86 D88 D87 D84 D73 D78 D77 D74 86 86 P4 Q4 D72 Package SOT-23 Single SOT-23 Serial SOT-23 Common cathode SOT-23 Common anode SOT-323 Single SOT-323 Serial SOT-323 Common cathode SOT-323 Common anode SOD-323 SOD-523 SOT-666 Parallel SOT-666 Opposite SOD-123 Weight 10 mg 10 mg 10 mg 10 mg 6 mg 6 mg 6 mg 6 mg 5 mg 1.4 mg 2.9 mg 2.9 mg 10 mg Base qty 3000 3000 3000 3000 3000 3000 3000 3000 3000 3000 3000 3000 3000 Delivery mode Tape and reel Tape and reel Tape and reel Tape and reel Tape and reel Tape and reel Tape and reel Tape and reel Tape and reel Tape and reel Tape and reel Tape and reel Tape and reel 5 Revision history Date Jun-1999 24-Jul-2006 Revision 8 9 Last update. BAT54, A, C, S and BAT54J / W / AW / CW /SW datasheets merged. ECOPACK statement added. SOD123, SOD-523 and SOT-666 packages added. Description of Changes 12/13 BAT54 Series Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. 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