®
BAT54J / W / AW / CW / SW
SMALL SIGNAL SCHOTTKY DIODE
FEATURES AND BENEFITS VERY SMALL CONDUCTION LOSSES NEGLIGIBLE SWITCHING LOSSES LOW FORWARD VOLTAGE DROP SURFACE MOUNT DEVICE
K NC A
NC K A K2 K1 A
K2
A
K1
BAT54W DESCRIPTION Schottky barrier diodes encapsulated either in SOT-323 or SOD-323 small SMD packages. Single and double diodes with different pining are available.
K A2 A1 A1 K A2
A2 K1
BAT54AW
K2
K2 A1
A2 K1
A1
BAT54CW SOT-323
BAT54SW
A
86
K
BAT54J SOD-323 ABSOLUTE RATINGS (limiting values) Symbol VRRM IF IFSM Ptot Tstg Tj TL Continuous forward current Surge non repetitive forward current Power dissipation (note 1) Tamb = 25°C Maximum storage temperature range Maximum operating junction temperature * Maximum temperaturefor soldering during 10s tp=10ms sinusoidal SOD-323 SOT-323 - 65 to +150 150 260 °C °C °C Parameter Repetitive peak reverse voltage Value 30 0.3 1 230 Unit V A A mW
Note 1: for double diodes, Ptot is the total dissipation of both diodes
*:
dPtot 1 thermal runaway condition for a diode on its own heatsink < dTj Rth(j−a)
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June 1999 - Ed: 2A
BAT54J / W / AW / CW / SW
THERMAL RESISTANCE Symbol Rth (j-a) Junction to ambient (*) Parameters SOD-323 SOT-323 (*) Mounted on epoxy board, with recommended pad layout. STATIC ELECTRICAL CHARACTERISTICS (per diode) Symbol VF * Parameters Forward voltage drop Tests conditions Tj = 25°C IF = 0.1 mA IF = 1 mA IF = 10 mA IF = 30 mA IF = 100 mA IR ** Reverse leakage current Tj = 25°C Tj = 100°C
Pulse test : * tp = 380 µs, δ < 2% ** tp = 5 ms, δ < 2%
Value 550
Unit °C/W °C/W
Min.
Typ.
Max. 240 320 400 500 900 1 100
Unit mV
VR = 30 V
µA
DYNAMIC CHARACTERISTICS (Tj = 25 °C) Symbol C trr Parameters Junction capacitance Reverse recovery time Tests conditions Tj = 25°C VR = 1 V F = 1 MHz Min. Typ. Max. 10 5 Unit pF ns
IF = 10 mA IR = 10 mA Tj = 25°C Irr = 1 mA RL = 100 Ω
Fig. 1-1: Forward voltage drop versus forward current (typical values, low level).
IFM(A) 2.00E-2 1.80E-2 Tj=100°C 1.60E-2 1.40E-2 Tj=25°C 1.20E-2 Tj=50°C 1.00E-2 8.00E-3 6.00E-3 4.00E-3 2.00E-3 VFM(V) 0.00E+0 0.00 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45 0.50
Fig. 1-2: Forward voltage drop versus forward current (typical values, high level).
IFM(A) 5E-1
Tj=100°C
1E-1
Tj=50°C
1E-2
Tj=25°C
VFM(V) 1E-3 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1
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BAT54J / W / AW / CW / SW
Fig. 2: Reverse leakage current versus reverse voltage applied (typical values).
IR(µA) 1E+2
Tj=100°C
Fig. 3: Reverse leakage current versus junction temperature.
IR(µ A) 1E+4
VR=30V
1E+3 1E+2
1E+1 1E+0 1E-1 1E-2
Tj=50°C
1E+1 1E+0
Tj=25°C
1E-1
VR(V) 0 5 10 15 20 25 30
1E-2
Tj(°C) 0 25 50 75 100 125 150
Fig. 4: Junction capacitance versus reverse voltage applied (typical values).
Fig. 5: Relative variation of thermal impedance junction to ambient versus pulse duration (epoxy FR4 with recommended pad layout, e(Cu)=35µm)
Zth(j-a)/Rth(j-a)
C(pF) 10
F=1MHz Tj=25°C
1.00
δ = 0.5
5
δ = 0.2
0.10
δ = 0.1
2
Single pulse
T
VR(V) 1 1 2 5 10 20 30
tp(s) 0.01 1E-3 1E-2 1E-1 1E+0
δ=tp/T
tp
1E+1
1E+2
Fig. 6: Thermal resistance junction to ambient versus copper surface under each lead (Epoxy printedcircuit board FR4, copper thickness: 35µm.)
Rth(j-a) (°C/W) 600 550 500 450 400 350 S(Cu) (mm ) 300 0 5 10 15 20 25 30 35 40 45 50
P=0.2W
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BAT54J / W / AW / CW / SW
PACKAGE MECHANICAL DATA SOT-323 DIMENSIONS
A
REF.
A1 D
Millimeters 0.8 0.0 0.25 0.1 1.8 1.15 1.8 0.1 0 2.0 1.25 0.65 2.1 0.2 2.4 0.3 30° 1.1 0.1 0.4 2.2 0.031 0.0 0.010
Inches 0.043 0.004 0.016 0.010
Min. Typ. Max. Min. Typ. Max. A A1 b c
b L
0.26 0.004
D E e H L θ
0.071 0.079 0.086 0.026 0.071 0.083 0.094 0.004 0.008 0.012 0 30°
1.35 0.045 0.049 0.053
H
E
θ
c
e
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BAT54J / W / AW / CW / SW
PACKAGE MECHANICAL DATA SOD-323 DIMENSIONS REF. Millimeters Min.
E
H b
A1
Inches Min. 0 0.01 0.004 0.06 0.044 0.09 0.004 0.004 Max. 0.046 0.004 0.017 0.01 0.071 0.057 0.106 0.02 0.016
Max. 1.17 0.1 0.44 0.25 1.8 1.45 2.7 0.46 0.41
A A1
D A
0 0.25 0.1 1.52 1.11 2.3 0.1 0.1
b c D
c
Q1
E H L Q1
L
Ordering type BAT54W BAT54AW BAT54CW BAT54SW BAT54J
Marking D73 D74 D77 D78 86
Package SOT-323 SOT-323 SOT-323 SOT-323 SOD-323
Weight 0.006g 0.006g 0.006g 0.006g 0.005g
Base qty 3000 3000 3000 3000 3000
Delivery mode Tape & reel Tape & reel Tape & reel Tape & reel Tape & reel
Epoxy meets UL94,V0
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringementof patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics © 1999 STMicroelectronics - Printed in Italy - All rights reserved. STMicroelectronics GROUP OF COMPANIES Australia - Brazil - China - Finland - France - Germany - Hong Kong - India - Italy - Japan - Malaysia Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - U.S.A. http://www.st.com 5/5
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