BlueNRG-M0
Datasheet
Very low power network processor module for Bluetooth® low energy v4.2
Features
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Product status link
BlueNRG-M0
Product label
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Bluetooth v4.2 compliant
Supports master and slave modes
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Multiple roles supported simultaneously
Embedded Bluetooth low energy protocol stack
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GAP, GATT, SM, L2CAP, LL, RFPHY
Bluetooth low energy profiles provided separately
Embedded ST BlueNRG-MS network processor
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Up to +8 dBm available output power
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Down to -88 dBm Rx sensitivity
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Up to 96 dB link budget with excellent link reliability
Host interface
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SPI, IRQ, and RESET
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On-field stack upgrading available via SPI
AES security co-processor
Certification
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CE qualified
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FCC, IC modular approval certified
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TYPE qualified
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BQE qualified
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WPC certification (BlueNRG-M0L)
On-board chip antenna
Operating supply voltage: from 1.7 to 3.6 V
Operating temperature range: -40 °C to 85 °C
Applications
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Watches
Fitness, wellness and sports
Consumer medical
Security/proximity
Remote control
Home and industrial automation
Assisted living
Mobile phone peripherals
PC peripherals
Description
The BlueNRG-M0 is an easy to use Bluetooth® low energy master/slave network
processor module, compliant with Bluetooth v4.2. The BlueNRG-M0 module supports
multiple roles simultaneously, and can act at the same time as Bluetooth low energy
sensor and hub device.
DS13023 - Rev 6 - October 2021
For further information contact your local STMicroelectronics sales office.
www.st.com
BlueNRG-M0
The entire Bluetooth low energy stack and protocols are embedded into BlueNRGM0 module. The external host application processor, where the application resides, is
connected to the BlueNRG-M0 module through a standard SPI interface.
The BlueNRG-M0 module provides a complete RF platform in a tiny form factor.
Radio, antenna, high frequency and LPO oscillators are integrated to offer a certified
solution to optimize the time-to-market of the final applications.
The BlueNRG-M0 can be powered directly with a standard 3 V coin cell battery, a
pair of AAA batteries or any power source from 1.7 to 3.6 V.
DS13023 - Rev 6
page 2/27
BlueNRG-M0
General description
1
General description
The BlueNRG-M0 is a single-mode Bluetooth low energy master/slave network processor module compliant with
Bluetooth® v4.2.
The BlueNRG-M0 module has been designed around the ST BlueNRG-MS network processor, on which a
complete power-optimized stack for Bluetooth single mode protocol runs, providing
Master, slave role support
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GAP: central, peripheral, observer or broadcaster roles
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ATT/GATT: client and server
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SM: privacy, authentication and authorization
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L2CAP
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Link Layer: AES-128 encryption and decryption
The BlueNRG-MS radio embeds non-volatile Flash memory allows on-field stack upgrading. In addition,
according to the Bluetooth specification v4.2, the BlueNRG-M0 module provides:
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Multiple roles simultaneously support
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Support simultaneous advertising and scanning
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Support being slave of up to two masters simultaneously
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Privacy V1.1
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Low duty cycle directed advertising
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Connection parameters request procedure
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LE Ping
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32 bits UUIDs
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L2CAP connection oriented channels
The BlueNRG-M0 module is equipped with Bluetooth low energy profiles in C source code, available for the ST
radio BlueNRG-MS.
The external host application processor, where the application resides, is interfaced with the BlueNRG-M0 module
through an application controller interface protocol, which is based on a standard SPI interface.
The BlueNRG-M0 module enables wireless connectivity into electronic devices, not requiring any RF experience
or expertise for integration into the final product. The BlueNRG-M0 module provides a complete RF platform in a
tiny form factor and being a certified solution optimizes the time-to-market of the final applications.
The BlueNRG-M0 module allows applications to meet of the tight advisable peak current requirements imposed
with the use of standard coin cell batteries. Optimized results are obtained when the embedded high-efficiency
DC-DC step-down converter is used (BLUENRG-M0A). Instead, concerning the BLUENRG-M0L the best
performance in terms of power consumption is achieved using a 1.8V DC power supply.
The BlueNRG-M0 can be powered directly with a standard 3 V coin cell battery, a pair of AAA batteries or any
power source from 1.7 to 3.6 V.
ST may update the FW provided with the modules at any time. ST recommends that users regularly check for
documentation and the current FW version available at www.st.com/bluemodules.
DS13023 - Rev 6
page 3/27
BlueNRG-M0
Block diagram
2
Block diagram
Figure 1. HW block diagram for the BlueNRG-M0
DS13023 - Rev 6
page 4/27
BlueNRG-M0
Software architecture
3
Software architecture
3.1
Bluetooth firmware implementation
The BlueNRG-M0 modules have been designed to work with an external host processor. The external host
application processor, where the application resides, is interfaced with the BlueNRG-MS inside the BlueNRG-M0
modules through an application controller interface (ACI) protocol, which is based on a standard SPI slave
interface as transport layer, basing on five physical wires:
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2 control wires (Clock and “Chip Select")
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2 data wires with serial shift-out (MOSI and MISO) in full duplex
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1 wire to indicate data availability from the slave (IRQ)
All the SPI pins have an internal pull-down except for the CS that has a pull-up. All the SPI pins, except the CS,
are in high impedance state during the low-power states. The IRQ pin needs a pull-down external resistor.
Figure 2. BlueNRG-M0 application block diagram
DS13023 - Rev 6
page 5/27
BlueNRG-M0
General characteristics
4
General characteristics
4.1
Absolute maximum ratings
Ratings
Min.
Typ.
Max.
Unit
Storage temperature range
-40
-
+85
°C
Supply voltage, VIN
-0.3
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3.9
V
I/O pin Voltage (VIO five-volt tolerant pin)
-0.3
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3.9
V
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8
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dBm
RF saturation input power
VESD-HBM Electrostatic discharge voltage
4.2
±2.0
kV
Operating conditions
Table 1. Operating conditions
Ratings
Min.
Typ.
Max.
Unit
Storage temperature range
-40
-
+85
°C
Operating ambient temperature range
-40
-
+85
°C
Supply voltage, VIN
1.7
3.3
3.6
V
Signals & I/O pin voltage (according supply voltage)
1.7
-
3.6
V
2402
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2480
MHz
Frequency range
DS13023 - Rev 6
page 6/27
BlueNRG-M0
Electrical specifications
5
Electrical specifications
5.1
Electrical characteristics
Characteristic measured over recommended operating conditions unless otherwise specified. Typical values are
referred to VIN= 3.3 V, 25 °C, SMPS on, XO 32 kHz and 32 MHz.
Table 2. Electrical characteristics for the BLUENRG-M0A
Symbol
IDD
Parameter
Test conditions
Supply current
Min.
Typ.
Max.
Unit
Reset
5
nA
Standby
1.8
uA
Sleep mode: 32 kHz XO ON (12 KB retention
RAM)
1.7
Sleep mode: 32 kHz XO ON (24 KB retention
RAM)
2.2
Active mode
2.12
mA
RX
9.36
mA
TX +8 dBm
16.50
mA
TX +4 dBm
12.04
mA
TX +2 dBm
10.40
mA
TX -2 dBm
9.44
mA
TX -5 dBm
8.79
mA
TX -8 dBm
8.29
mA
TX -11 dBm
8.01
mA
TX -14 dBm
7.82
mA
μA
Characteristic measured over recommended operating condition unless otherwise specified. Typical values are
referred to VIN= 3.3 V, 25 °C, SMPS off, RO 32 kHz and 32 MHz.
Table 3. Electrical characteristics for the BLUENRG-M0L
Symbol
IDD
DS13023 - Rev 6
Parameter
Supply current
Test conditions
Min.
Typ.
Max.
Unit
Reset
5
nA
Standby
1.7
uA
Sleep mode: 32 kHz RO ON (12 kB retention
RAM)
2.8
Sleep mode: 32 kHz RO ON (24 kB retention
RAM)
3.2
Active mode
2.54
mA
RX
16.36
mA
TX +8 dBm
27.35
mA
TX +4 dBm
21.3
mA
TX +2 dBm
18.29
mA
TX -2 dBm
16.44
mA
μA
page 7/27
BlueNRG-M0
Digital I/O specifications
Symbol
IDD
5.2
Parameter
Test conditions
Supply current
Min.
Typ.
Max.
Unit
TX -5 dBm
15.18
mA
TX -8 dBm
14.19
mA
TX -11 dBm
13.61
mA
TX -14 dBm
13.25
mA
Digital I/O specifications
IO pins are directly connected to the embedded state of the art BlueNRG-MS chipset. For more details about the
digital I/I specification, please refer directly to the BlueNRG-MS datasheet available on www.st.com.
5.3
RF general characteristics
Characteristic measured over recommended operating conditions unless otherwise specified. Typical value are
referred to VIN= 3.3 V, 25 °C, DC/DC on, XO 32 kHz (BLUENRG-M0A only) and XO 32 MHz.
Table 4. RF general characteristics
Symbol
Parameter
FREQ
Test conditions
Min.
Typ.
Max.
Unit
Frequency range
2400
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2483.5
MHz
FCH
Channel spacing
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2
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MHz
RFch
RF channel center frequency
2402
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2480
MHz
Typ.
Max.
Unit
Table 5. BLUENRG-M0A RF characteristics
Symbol
Parameter
RPMAX(1)
Output
power(2)
Sensitivity(2)
RXSENS
Test conditions
Min.
Radiated
+6
dBm
Conducted
-85
dBm
1. PA-Level set to 0x07 and En-High_Power set to 0x01 (corresponding to +8 dBm in conducted mode).
2. Radiated power may be impacted by application board / housing / etc.
Table 6. BLUENRG-M0L RF characteristics
Symbol
Parameter
Test conditions
Min.
Typ.
Max.
Unit
RPMAX(1)
Radiated output power(2)
Radiated
+6
dBm
RXSENS
Sensitivity(2)
Conducted
-85
dBm
1. PA-Level set to 0x07 and En-High_Power set to 0x01 (corresponding to +8dBm in conducted mode)
2. Radiated power may be impacted by application board / housing / etc.
DS13023 - Rev 6
page 8/27
BlueNRG-M0
Pin assignment
5.4
Pin assignment
Figure 3. Pin connection
Table 7. Pin connection
Name
Type
Pin #
Description
V max. tolerant
SPI interface
SPI_IRQ
O
4
SPI IRQ (SLAVE has data for MASTER)
Vin
SPI_CLK
I
7
SPI CLOCK (Max. 8 MHz)
Vin
SPI_MISO
O
8
SPI MISO (MASTER in / SLAVE out)
Vin
SPI_MOSI
I
9
SPI MOSI (MASTER out SLAVE in)
Vin
SPI_CS
I
10
SPI “Chip select” (SPI slave select)
Vin
Power and ground
Vin
5
Vin
GND
6
GND
(1.7 V - 3.6 V max.)
Reset
Reset input (active low < 0.35 Vin)
BT_RESET
I
11
EXT_LPCLK
I
1
Not connected
GPIO2
I/O
2
Not connected
ANA TEST 0
I
3
Not connected
(1.7 V - 3.6 V max.)
LPO
DS13023 - Rev 6
page 9/27
BlueNRG-M0
Hardware design
6
Hardware design
The BlueNRG-M0 module supports SPI hardware interfaces.
Note:
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6.1
All unused pins should be left floating; do not ground
All GND pins must be well grounded
The area around the module should be free of any ground planes, power planes, trace routings, or metal
for 6 mm from the module antenna position, in all directions.
Traces should not be routed underneath the module
Reflow soldering
The BlueNRG-M0 is a high temperature strength surface mount Bluetooth® module supplied on a 11-pin, 4-layer
PCB. The final assembly recommended reflow profiles are indicated here below.
Soldering phase has to be executed with care: in order to avoid undesired melting phenomenon, particular
attention has to be taken on the set up of the peak temperature.
Here are some suggestions for the temperature profile based on the following recommendations.
Table 8. Soldering profile
Profile feature
PB-free assembly
Average ramp up rate (TSMAX to Tp)
3°C/ sec max
Preheat
temperature min (TS min.)
temperature max (TS max.)
time (tS min to tS max) (tS)
150 °C
200 °C
60-100 s
Time maintained above
Temperature TL
Time tL
217 °C
60-70 s
Peak temperature (TP)
240+0 °C
Time within 5 °C of peak temperature (TP -5°)
10-20 s
Ramp down rate
6 °C/s
Time from 25 °C to peak temperature
8 minutes max.
Figure 4. Soldering profiles
DS13023 - Rev 6
page 10/27
BlueNRG-M0
Regulatory compliance
7
Regulatory compliance
7.1
FCC certification
This module has been tested and found to comply with the FCC part 15 rules. These limits are designed to
provide reasonable protection against harmful interference in approved installations. This equipment generates,
uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions,
may cause harmful interference to radio communications.
However, there is no guarantee that interference may not occur in a particular installation.
This device complies with part 15 of the FCC rules. Operation is subject to the following two conditions:
this device may not cause harmfulinterference
1.
2.
this device must accept any interference received, including interference that may cause undesired
operation
Modifications or changes to this equipment not expressly approved by STMicroelectronics may render void the
user's authority to operate this equipment.
Modular approval
FCC ID: S9NBNRGM0AL
In accordance with FCC part 15, the BlueNRG-M0 is listed as a modular transmitter device.
This module is evaluated for stand-alone use only. Finished products incorporating multiple transmitters must
comply with collocation and RF exposure requirements in accordance with FCC multi-transmitter product
procedures. Collocated transmitters operating in portable RF Exposure conditions (e.g.