BTA08-700CWRG

BTA08, BTB08, T810 T835, T850 Datasheet Snubberless™, logic level and standard 8 A Triacs Features A2 G A1 A2 • On-state rms current, IT(RMS) 8 A • Repetitive peak off-state voltage, VDRM / VRRM 600 V to 800 V • Triggering gate current, IGT 5 to 50 mA Description G G A2 A2 A1 A1 TO-220AB TO-220AB Ins. A2 The Snubberless versions (BTA, BTB08_xxxxW and T8 series) are specially recommended for use on inductive loads, thanks to their high commutation performance. A2 G A1 D²PAK A2 A2 A2 G IPAK A2 A1 G A1 DPAK Available either in through-hole and surface-mount packages, these devices are suitable for general purpose AC switching. They can be used as an ON/OFF function in applications such as static relays, heating regulation, induction motor starting circuits or for phase control operation in light dimmers and motor speed controllers, etc. Logic level versions are designed to interface directly with low power drivers such as Microcontrollers. By using an internal ceramic pad, the BTA series provide voltage insulated tab (rated at 2500 VRMS) in compliance with UL standards (file ref.: E81734). Product status link BTA08 BTB08 T810 T835 T850 DS2114 - Rev 15 - August 2018 For further information contact your local STMicroelectronics sales office. www.st.com BTA08, BTB08, T810, T835, T850 Characteristics 1 Characteristics Table 1. Absolute maximum ratings (Tj = 25 °C unless otherwise stated) Symbol IT(RMS) ITSM I2t Parameter IPAK, DPAK,TO-220AB, D²PAK Tc = 110 °C RMS on-state current (full sine wave) Non repetitive surge peak on-state current (full cycle, Tj initial = 25 °C) Value Unit 8 A TO-220AB Ins. Tc = 100 °C f = 50 Hz t = 20 ms 80 f = 60 Hz tp = 16.7 ms 84 tp = 10 ms 36 A2s I2t value for fusing A dl/dt Critical rate of rise of on-state current IG = 2 x IGT, tr ≤ 100 ns f = 120 Hz Tj = 125 °C 50 A/µs IGM Peak gate current tp = 20 µs Tj = 125 °C 4 A Tj = 125 °C 1 W Storage junction temperature range -40 to +150 °C Operating junction temperature range -40 to +125 °C PG(AV) Tstg Tj Average gate power dissipation Table 2. Electrical characteristics (Tj = 25 °C, unless otherwise specified) Snubberless and logic level (3 quadrants) Parameter Symbol IGT (1) VGT VD = 12 V, RL = 30 Ω T8 Quadrant BTA08/BTB08 10 35 50 TW SW CW BW 10 35 50 5 10 35 50 Unit I - II - III Max. mA I - II - III Max. 1.2 V 0.2 V VGD VD = VDRM, RL = 3.3 kΩ, Tj = 125 °C I - II - III Min. IH (2) IT = 100 mA I - II - III Max. 15 35 75 10 15 35 50 IL IG = 1.2 x IGT I - III Max. 25 50 70 10 25 50 70 II Max. 30 60 110 15 30 60 80 VD = 67% VDRM, gate open, Tj = 125 °C Max. 40 400 1000 20 40 400 1000 (dV/dt)c = 0.1 V/µs, Tj = 125 °C Min. 5.4 3.5 5.4 (dV/dt)c = 10 V/µs, Tj = 125 °C Min. 2.8 1.5 2.98 Without snubber, Tj = 125 °C Min. dV/dt (2) (dl/dt)c (2) 4.5 7 mA mA V/µs A/ms 4.5 7 1. Minimum IGT is guaranteed at 5 % of IGT max. 2. For both polarities of A2 referenced to A1 DS2114 - Rev 15 page 2/21 BTA08, BTB08, T810, T835, T850 Characteristics Table 3. Standard (4 quadrants) Symbol Parameter I - II - III IGT (1) VD = 12 V, RL = 33 Ω IV VGT VGD IH VD = VDRM, RL = 33 kΩ, Tj = 125 °C (2) IT = 500 mA IL (dV/dt)c (2) Max. C B 25 50 50 100 Unit mA All Max. 1.3 V All Min. 0.2 V I - II - III Max. I - III - IV IG = 1.2 IGT dV/dt (2) BTA08/BTB08 Quadrant II Max. 25 50 40 50 80 100 mA mA VD = 67 % VDRM gate open, Tj = 125 °C Min. 200 400 V/µs (dI/dt)c = 3.5 A/ms, Tj = 125 °C Min. 5 10 V/µs 1. Minimum IGT is guaranteed at 5 % of IGT max. 2. For both polarities of A2 referenced to A1 Table 4. Static electrical characteristics Symbol VTM (1) VTO (1) RD (1) IDRM IRRM Test conditions Value Unit ITM = 11 A, tp = 380 µs Tj = 25 °C Max. 1.55 V threshold on-state voltage Tj = 125 °C Max. 0.85 V Dynamic resistance Tj = 125 °C Max. 50 mΩ Tj = 25 °C Max. 5 µA Tj = 125 °C Max. 1 mA VDRM = VRRM 1. For both polarities of A2 referenced to A1 Table 5. Thermal resistance Symbol Rth(j-c) Parameter Max. junction to case thermal resistance (AC) Junction to ambient (typ.) Rth(j-a) Junction to ambient (typ.) S = 2 cm² (1) S=1 cm²(1) Value IPAK / D2PAK / DPAK / TO-220AB 1.6 TO-220AB Insulated 2.5 D²PAK 45 DPAK 70 TO-220AB / TO-220AB Insulated 60 IPAK 100 Unit °C/W °C/W 1. S = Copper surface under tab. DS2114 - Rev 15 page 3/21 BTA08, BTB08, T810, T835, T850 Characteristics (curves) 1.1 Characteristics (curves) Figure 1. Maximum power dissipation versus on-state RMS current (full cycle) P(W) 10 Figure 2. RMS on-state current versus temperature (full cycle) 10 9 9 8 8 7 7 6 6 5 5 4 4 3 3 2 2 1 0 1 2 3 BTB/T8 BTA 1 IT(RMS)(A) 0 IT(RMS)(A) Tc(°C) 0 4 5 6 7 8 Figure 3. RMS on-state current versus ambient temperature (full cycle) 0 25 50 75 100 125 Figure 4. Relative variation of thermal impedance versus pulse duration IT(RMS)(A) K = [Zth/Rth] 3.5 1E+0 D²PAK (S = 1 cm²) 3.0 Zth(j-c) Printed circuit board FR4, copper thickness: 35 µm DPAK/IPAK Zth(j-a) 2.5 1E-1 2.0 TO-220AB/D²PAK Zth(j-a) 1.5 DPAK (S = 0.5 cm²) 1E-2 1.0 0.5 Tc(°C) 0.0 0 DS2114 - Rev 15 25 50 75 100 125 1E-3 1E-3 tp(s) 1E-2 1E-1 1E+0 1E+1 1E+2 5E+2 page 4/21 BTA08, BTB08, T810, T835, T850 Characteristics (curves) Figure 5. On-state characteristics (maximum values) Figure 6. Surge peak on-state current versus number of cycles ITM(A) 100 Tj max. Vto = 0.85 V Rd = 50 mΩ ITSM(A) 90 Tj = Tj max. 80 t = 16.66 ms 70 Non repetitive Tj initial = 25 °C 60 One cycle 50 10 Tj = 25 °C 40 30 Repetitive TC = 110 °C 20 10 VTM(V) 1 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Number of cycles 0 1 Figure 7. Non repetitive surge peak on-state current for a sinusoidal pulse (tp < 10 ms) 10 100 1000 Figure 8. Relative variation of gate trigger current IGT,IH,IL[Tj] / IGT,IH,IL[Tj = 25 °C] ITSM(A) 2.5 1000 Holding current and latching current versus junction temperature (typical values) Tj initial=25°C 2.0 IGT dI/dt limitation: 50A/µs 1.5 ITSM 360° 100 1.0 α 10 0.01 IH and IL 0.5 t p (ms) 0.10 1.00 Tj (°C) 0.0 -40 -20 0 20 40 60 80 100 120 140 10.00 Figure 9. Relative variation of critical rate of decrease of main current versus (dV/dt)c (typical values) Figure 10. Relative variation of critical rate of decrease of main current versus (dV/dt)c (typical values) (dl/dt)c [(dV/dt)c / specified (dl/dt)c (dl/dt)c [(dV/dt)c] / specified (dl/dt)c 2.0 2.2 2.0 TW Snubberless and logic level types Standard types 1.8 1.8 C 1.6 1.6 1.4 1.4 T835/T850/CW/SW/BW 1.2 1.0 0.8 T810/SW 0.6 1.2 B 1.0 0.8 0.4 0.2 0.6 (dV/dt)c (V/µs) 0.0 0.1 DS2114 - Rev 15 1.0 10.0 100.0 0.4 0.1 (dV/dt)c (V/µs) 1.0 10.0 100.0 page 5/21 BTA08, BTB08, T810, T835, T850 Characteristics (curves) Figure 11. Relative variation of critical rate of decrease of main current versus junction temperature Figure 12. DPAK and D2PAK thermal resistance junction to ambient versus copper surface under tab Rth(j-a)(°C/W) (dl/dt)c [Tj] / [Tj specified] 100 6 Printed circuit board FR4, copper thickness: 35 µm 90 5 80 70 4 60 DPAK 50 3 40 2 30 1 0 D²PAK 20 10 Tj(°C) 0 DS2114 - Rev 15 25 50 0 75 100 125 S(cm²) 0 4 8 12 16 20 24 28 32 36 40 page 6/21 BTA08, BTB08, T810, T835, T850 Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. DS2114 - Rev 15 page 7/21 BTA08, BTB08, T810, T835, T850 DPAK package information 2.1 DPAK package information • • • Epoxy meets UL94, V0 Lead-free package Recommended torque: 0.4 to 0.6 N·m A Figure 13. DPAK package outline E b4 H D D1 L2 c2 e L4 A1 b E1 c e1 A2 V2 L DS2114 - Rev 15 page 8/21 BTA08, BTB08, T810, T835, T850 DPAK package information Table 6. DPAK package mechanical data Dimensions Ref. Inches(1) Millimeters Min. Typ. Max. Min. Typ. Max. A 2.18 2.40 0.0858 0.0945 A1 0.90 1.10 0.0354 0.0433 A2 0.03 0.23 0.0012 0.0091 b 0.64 0.90 0.0252 0.354 b4 4.95 5.46 0.1949 0.2150 c 0.46 0.61 0.0181 0.0240 c2 0.46 0.60 0.0181 0.0236 D 5.97 6.22 0.2350 0.2449 D1 5.10 E 6.35 E1 4.32 0.2008 6.73 0.2500 0.2650 0.1701 e 2.29 0.0900 e1 4.57 0.1800 H 9.35 10.40 0.3681 0.4094 L 1.00 1.78 0.0394 0.0701 L2 1.27 0.0500 L4 0.60 1.02 0.0236 0.0402 V2 0° +8° 0° +8° 1. Dimensions in inches are given for reference only Note: This package drawing may slightly differ from the physical package. However, all the specified dimensions are guaranteed. Figure 14. DPAK recommended footprint (dimensions are in mm) 12.7 6.7 3.0 3.0 4.572 6.7 B The device must be positioned within DS2114 - Rev 15 A 1.6 0.05 A B page 9/21 BTA08, BTB08, T810, T835, T850 IPAK package information 2.2 IPAK package information Figure 15. IPAK package outline E b4 A c2 V1 L2 D L1 A1 e B5 b2 b e1 Note: DS2114 - Rev 15 H L c This package drawing may slightly differ from the physical package. However, all the specified dimensions are guaranteed. page 10/21 BTA08, BTB08, T810, T835, T850 IPAK package information Table 7. IPAK package mechanical data Dimensions Ref. Inches(1) Millimeters Min. Typ. Max. Min. Typ. Max. A 2.20 2.40 0.0866 0.0945 A1 0.90 1.10 0.0354 0.0433 b 0.64 0.90 0.0252 0.0354 b2 b4 0.95 5.20 B5 5.43 0.0374 0.2047 0.30 0.2138 0.0118 c 0.45 0.60 0.0177 0.0236 c2 0.46 0.60 0.0181 0.0236 D 6.00 6.20 0.2362 0.2441 E 6.40 6.65 0.2520 0.2618 e e1 2.28 4.40 H 0.0898 4.60 0.1732 16.10 0.1811 0.6339 L 9.00 9.60 0.3545 0.3780 L1 0.80 1.20 0.0315 0.0472 L2 0.80 V1 10° 1.25 0.0315 0.0492 10° 1. Inch dimensions are for reference only. DS2114 - Rev 15 page 11/21 BTA08, BTB08, T810, T835, T850 TO-220AB insulated package information 2.3 TO-220AB insulated package information Figure 16. TO-220AB insulated package outline C B b2 I Resin gate 0.5 mm max. protusion(1) L F A I4 l3 c2 a1 l2 a2 M b1 e Resin gate 0.5 mm max. protusion(1) c1 (1)Resin gate position accepted in one of the two positions or in the symmetrical opposites. DS2114 - Rev 15 page 12/21 BTA08, BTB08, T810, T835, T850 TO-220AB insulated package information Table 8. TO-220AB insulated package mechanical data Dimensions Ref. Millimeters Min. A Typ. 15.20 a1 Inches Max. Min. 15.90 0.5984 3.75 Typ. Max. 0.6260 0.1476 a2 13.00 14.00 0.5118 0.5512 B 10.00 10.40 0.3937 0.4094 b1 0.61 0.88 0.0240 0.0346 b2 1.23 1.32 0.0484 0.0520 C 4.40 4.60 0.1732 0.1811 c1 0.49 0.70 0.0193 0.0276 c2 2.40 2.72 0.0945 0.1071 e 2.40 2.70 0.0945 0.1063 F 6.20 6.60 0.2441 0.2598 I 3.73 3.88 0.1469 0.1528 L 2.65 2.95 0.1043 0.1161 I2 1.14 1.70 0.0449 0.0669 I3 1.14 1.70 0.0449 0.0669 I4 15.80 16.80 0.6220 M 16.40 2.6 0.6457 0.6614 0.1024 1. Inch dimensions are for reference only. DS2114 - Rev 15 page 13/21 BTA08, BTB08, T810, T835, T850 D²PAK package information 2.4 D²PAK package information Figure 17. D²PAK package outline A E E2 L3 D2 H D D1 L2 c2 E1 b2 b Resin gate 0.5 mm max. protrusion(1) e G A1 A2 A3 L R Gauge Plane V2 c (1) Resin gate position accepted in one of the two positions or in the symmetrical opposites DS2114 - Rev 15 page 14/21 BTA08, BTB08, T810, T835, T850 D²PAK package information Table 9. D²PAK package mechanical data Dimensions Ref. Millimeters Min. Typ. Inches Max. Min. Typ. Max. A 4.30 4.60 0.1693 0.1811 A1 2.49 2.69 0.0980 0.1059 A2 0.03 0.23 0.0012 0.0091 A3 0.25 0.0098 b 0.70 0.93 0.0276 0.0366 b2 1.25 1.7 0.0492 0.0669 c 0.45 0.60 0.0177 0.0236 c2 1.21 1.36 0.0476 0.0535 D 8.95 9.35 0.3524 0.3681 D1 7.50 8.00 0.2953 0.3150 D2 1.30 1.70 0.0512 0.0669 e 2.54 E 10.00 10.28 0.3937 0.4047 E1 8.30 8.70 0.3268 0.3425 E2 6.85 7.25 0.2697 0.2854 G 4.88 5.28 0.1921 0.2079 H 15 15.85 0.5906 0.6240 L 1.78 2.28 0.0701 0.0898 L2 1.27 1.40 0.0500 0.0551 L3 1.40 1.75 0.0551 0.0689 R V2 0.1 0.40 0° 0.0157 8° 0° 8° 1. Dimensions in inches are given for reference only DS2114 - Rev 15 page 15/21 BTA08, BTB08, T810, T835, T850 D²PAK package information Figure 18. D²PAK recommended footprint (dimensions are in mm) 16.90 10.30 5.08 1.30 8.90 DS2114 - Rev 15 3.70 page 16/21 BTA08, BTB08, T810, T835, T850 Ordering information 3 Ordering information Figure 19. Ordering information scheme (BTA08 and BTB08 series) BT A 08 - 600 BW (RG) Triac Insulation A = Insulated B = Non-insulated Current 08 = 8A Voltage 600 = 600 V 800 = 800 V Sensitivity and type B = 50 mA BW = 50 mA Snubberless™ C = 25 mA standard CW = 35 mA Snubberless™ SW = 10 mA logic level TW = 5 mA logic level Packing mode RG = Tube Figure 20. Ordering information scheme (T8 series) T 8 10 - 600 B (-TR) Triac series Current 08 = 8A Sensitivity 10 = 10 mA 35 = 35 mA 50 = 50 mA Voltage 600 = 600 V 800 = 800 V Package B = DPAK H = IPAK G = D²PAK Packing mode Blank = Tube TR = Tape and reel DS2114 - Rev 15 page 17/21 BTA08, BTB08, T810, T835, T850 Ordering information Table 10. Product selector Part Number DS2114 - Rev 15 Voltage (xxx) Sensitivity Type Package 10 mA Logic Level DPAK X 35 mA Snubberless™ IPAK T810-xxxG X 10 mA Logic Level D2PAK T835-xxxG X X 35 mA Snubberless™ D2PAK T850-xxxG X X 50 mA Snubberless™ D2PAK BTA08-xxxS X 10 mA Logic Level TO-220AB Ins. BTA08-xxxC X 35 mA Standard TO-220AB Ins. BTA08-xxxB X 50 mA Standard TO-220AB Ins. BTA08-xxxTW X 5 mA Logic Level TO-220AB Ins. BTA08-xxxSW X 10 mA Logic Level TO-220AB Ins. BTA08-xxxCW X 35 mA Snubberless™ TO-220AB Ins. BTA08-xxxBW X 50 mA Snubberless™ TO-220AB Ins. BTB08-xxxS X 10 mA Logic Level TO-220AB BTB08-xxxC X 35 mA Standard TO-220AB BTB08-xxxB X 50 mA Standard TO-220AB BTB08-xxxTW X 5 mA Logic Level TO-220AB BTB08-xxxSW X 10 mA Logic Level TO-220AB BTB08-xxxCW X 35 mA Snubberless™ TO-220AB BTB08-xxxBW X 50 mA Snubberless™ TO-220AB 600 800 T810-xxxB X X T835-xxxH X X X X page 18/21 BTA08, BTB08, T810, T835, T850 Ordering information Table 11. Ordering information DS2114 - Rev 15 Order code Marking T810-600B T8 1060 T835-600B T8 3560 T835-800B T8 3580 T810-600B-TR T8 1060 T810-800B-TR T8 1080 T835-600B-TR T8 3560 T835-800B-TR T8 3580 T835-600H T8 3560 T835-600G T835-600G T835-8G T835-8G T850-6G T850-6G T850-8G T850-8G T810-600G-TR T810-600G T835-600G-TR T835-600G T835-8G-TR T835-8G T850-6G-TR T850-6G T850-8G-TR T850-8G BTA08-600SRG BTA08-600S BTA08-600BRG BTA08-600B BTA08-600CRG BTA08-600C BTA08-800CRG BTA08-800C BTA08-600BWRG BTA08-600BW BTA08-600CWRG BTA08-600CW BTA08-600SWRG BTA08-600SW BTA08-600TWRG BTA08-600TW BTA08-800BWRG BTA08-800BW BTB08-600BRG BTB08-600B BTB08-600CRG BTB08-600C BTB08-600SRG BTB08-600S BTB08-600BWRG BTB08-600BW BTB08-600CWRG BTB08-600CW BTB08-600SWRG BTB08-600SW BTB08-600TWRG BTB08-600TW BTB08-800CWRG BTB08-800CW BTB08-800TWRG BTB08-800TW Package DPAK IPAK D2PAK Weight Base qty. Delivery mode 75 Tube 2500 Tape&Reel 13" 75 Tube 50 Tube 1000 Tape&Reel 13" 50 Tube 0.30 0.40 1.50 TO-220AB Ins. 2.30 TO-220AB page 19/21 BTA08, BTB08, T810, T835, T850 Table 12. Document revision history DS2114 - Rev 15 Date Revision Changes Apr-2002 5A 13-Feb-2006 6 TO-220AB delivery mode changed from bulk to tube. ECOPACK statement added. 10-Mar-2010 7 Updated ECOPACK statement and Figure 26 02-Jun-2014 8 Updated DPAK and IPAK package information and reformatted to current standard. 07-Nov-2016 9 Updated Table 1 and reformatted to current standard. 06-Jan-2017 10 Updated Figure 20: "Ordering information scheme (T8 series)", Table 10: "Product selector" and Table 11: "Ordering information". 09-Feb-2017 11 Added T850 package information. 24-Apr-2017 12 Last update. Updated Figure 6.. Minor text changes to improve readability. 14-Mar-2018 13 Updated Table 2. Electrical characteristics (Tj = 25 °C, unless otherwise specified) Snubberless and logic level (3 quadrants), cover image, Figure 9. Relative variation of critical rate of decrease of main current versus (dV/dt)c (typical values) and Figure 20. Ordering information scheme (T8 series). 14-May-2018 14 Updated product status links. 09-Aug-2018 15 Updated Table 3. Standard (4 quadrants). page 20/21 BTA08, BTB08, T810, T835, T850 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2018 STMicroelectronics – All rights reserved DS2114 - Rev 15 page 21/21