BTA16-800BWRG

® BTA16, BTB16 and T16 Series 16A TRIACS A2 SNUBBERLESS™, LOGIC LEVEL & STANDARD Table 1: Main Features Symbol IT(RMS) VDRM/VRRM IGT (Q1) Value 16 600, 700 and 800 10 to 50 Unit A V mA A1 A2 G G A1 A2 DESCRIPTION Available either in through-hole or surface-mount packages, the BTA16, BTB16 and T16 triac series is suitable for general purpose AC switching. They can be used as an ON/OFF function in applications such as static relays, heating regulation, induction motor starting circuits... or for phase control operation in light dimmers, motor speed controllers, ... The snubberless versions (BTA/BTB...W and T16 series) are specially recommended for use on inductive loads, thanks to their high commutation performances. By using an internal ceramic pad, the BTA series provides voltage insulated tab (rated at 2500VRMS) complying with UL standards (File ref.: E81734). D2PAK (T16-G) A2 A1 A2 G A1 A2 G TO-220AB Insulated (BTA16) TO-220AB (BTB16) Table 2: Order Codes Part Number BTA16-xxxxxRG BTB16-xxxxxRG T16xx-xxxG Marking See page table 8 on page 8 February 2006 REV. 7 1/9 BTA16, BTB16 and T16 Series Table 3: Absolute Maximum Ratings Symbol IT(RMS) Parameter RMS on-state current (full sine wave) D2PAK / TO-220AB TO-220AB Ins. ITSM I²t dI/dt Non repetitive surge peak on-state F = 50 Hz current (full cycle, Tj initial = 25°C) F = 60 Hz I²t Value for fusing Critical rate of rise of on-state current IG = 2 x IGT , tr ≤ 100 ns tp = 10 ms F = 120 Hz Tj = 125°C Tj = 25°C Tj = 125°C Tj = 125°C Tc = 100°C Tc = 15°C t = 20 ms t = 16.7 ms 160 168 144 50 VDSM/VRSM + 100 4 1 - 40 to + 150 - 40 to + 125 A A ²s A/µs V A W °C Value 16 Unit A VDSM/VRSM Non repetitive surge peak off-state tp = 10 ms voltage IGM PG(AV) Tstg Tj Peak gate current Average gate power dissipation Storage junction temperature range Operating junction temperature range tp = 20 µs Tables 4: Electrical Characteristics (Tj = 25°C, unless otherwise specified) ■ SNUBBERLESS and Logic Level (3 quadrants) Symbol IGT (1) VGT VGD IH (2) IL dV/dt (2) Test Conditions VD = 12 V RL = 33 Ω VD = VDRM RL = 3.3 kΩ Tj = 125°C IT = 500 mA IG = 1.2 IGT VD = 67 %VDRM gate open (dV/dt)c = 0.1 V/µs I - III II Quadrant I - II - III I - II - III I - II - III MAX. MAX. MIN. MAX. MAX. 35 50 60 500 8.5 15 25 30 40 8.5 3.0 T16 T1635 35 BTA16 / BTB16 SW 10 1.3 0.2 35 50 60 500 8.5 50 70 80 1000 14 A/ms CW 35 BW 50 Unit mA V V mA mA V/µs Tj = 125°C MIN. Tj = 125°C Tj = 125°C MIN. Tj = 125°C (dI/dt)c (2) (dV/dt)c = 10 V/µs Without snubber 2/9 BTA16, BTB16 and T16 Series ■ Standard (4 quadrants) Symbol IGT (1) VGT VGD IH (2) IL dV/dt (2) VD = VDRM RL = 3.3 kΩ Tj = 125°C IT = 500 mA IG = 1.2 IGT VD = 67 %VDRM gate open I - III - IV II Tj = 125°C Tj = 125°C Test Conditions Quadrant I - II - III IV ALL ALL MAX. MAX. MIN. MAX. MAX. MIN. MIN. 25 40 80 200 5 BTA16 / BTB16 C 25 50 1.3 0.2 50 60 120 400 10 B 50 100 Unit mA V V mA mA V/µs V/µs VD = 12 V RL = 33 Ω (dV/dt)c (2) (dI/dt)c = 7 A/ms Table 5: Static Characteristics Symbol VT (2) Vto (2) Rd (2) IDRM IRRM ITM = 22.5 A Test Conditions tp = 380 µs Tj = 25°C Tj = 125°C Tj = 125°C Tj = 25°C Tj = 125°C MAX. MAX. MAX. MAX. Value 1.55 0.85 25 5 2 Unit V V mΩ µA mA Threshold voltage Dynamic resistance VDRM = VRRM Note 1: minimum IGT is guaranted at 5% of IGT max. Note 2: for both polarities of A2 referenced to A1. Table 6: Thermal resistance Symbol Rth(j-c) Junction to case (AC) S = 1 cm² Parameter D2PAK / TO-220AB TO-220AB Insulated Junction to ambient D2PAK TO-220AB / TO-220AB Insulated Value 1.2 2.1 45 60 °C/W Unit °C/W Rth(j-a) S = Copper surface under tab. 3/9 BTA16, BTB16 and T16 Series Figure 1: Maximum power dissipation versus RMS on-state current (full cycle) P(W) 20 18 16 14 12 10 8 6 4 2 0 0 2 4 6 8 10 12 14 16 8 6 4 18 16 14 BTA BTB / T16 Figure 2: RMS on-state current versus case temperature (full cycle) IT(RMS)(A) 12 10 IT(RMS)(A) 2 0 0 25 50 TC(°C) 75 100 125 Figure 3: RMS on-state current versus ambient temperature (printed circuit board FR4, copper thickness: 35µm) (full cycle) IT(RMS)(A) 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 0 25 50 D PAK (S=1cm2) 2 Figure 4: Relative variation of thermal impedance versus pulse duration K=[Zth/Rth] 1E+0 Zth(j-c) Zth(j-a) 1E-1 TC(°C) 75 100 125 1E-2 1E-3 1E-2 1E-1 tp(s) 1E+0 1E+1 1E+2 5E+2 Figure 5: On-state characteristics (maximum values) ITM(A) 200 100 Tj max. Vto = 0.85V Rd = 25 mΩ Figure 6: Surge peak on-state current versus number of cycles ITSM(A) 180 160 140 t=20ms Tj = Tj max. 120 100 Tj = 25°C. Non repetitive Tj initial=25°C One cycle 10 80 60 40 Repetitive TC=85°C VTM(V) 1 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 20 0 1 10 Number of cycles 100 1000 4/9 BTA16, BTB16 and T16 Series Figure 7: Non-repetitive surge peak on-state current for a sinusoidal pulse with width tp < 10 ms and corresponding value of I2t ITSM(A), I2t (A2s) 3000 Tj initial=25°C dI/dt limitation: 50A/µs Figure 8: Relative variation of gate trigger current, holding current and latching current versus junction temperature (typical values) IGT,IH,IL[Tj] / IGT,IH,IL[Tj=25°C] 2.5 2.0 IGT ITSM 1000 1.5 IH & IL 1.0 I2t 0.5 tp(ms) 100 0.01 0.10 1.00 10.00 Tj(°C) 0.0 -40 -20 0 20 40 60 80 100 120 140 Figure 9: Relative variation of critical rate of decrease of main current versus (dV/dt)c (typical values) (Snubberless & Logic level types) (dI/dt)c [(dV/dt)c] / Specified (dI/dt)c 2.0 1.8 1.6 B C SW Figure 10: Relative variation of critical rate of decrease of main current versus (dV/dt)c (typical values) (Standard types) (dI/dt)c [Tj] / (dI/dt)c [Tj specified] 6 5 4 3 2 1 1.4 1.2 1.0 0.8 0.6 T1635/CW/BW (dV/dt)c (V/µs) 0.4 0.1 1.0 10.0 100.0 0 0 25 50 Tj(°C) 75 100 125 Figure 11: D2PAK Thermal resistance junction to ambient versus copper surface under tab (printed circuit board FR4, copper thickness: 35 µm) Rth(j-a)(°C/W) 80 70 60 50 D2PAK 40 30 20 10 S(cm²) 0 0 4 8 12 16 20 24 28 32 36 40 5/9 BTA16, BTB16 and T16 Series Figure 12: Ordering Information Scheme (BTA16 and BTB16 series) BT A 16 - 600 BW RG Triac series Insulation A = insulated B = non insulated Current 16 = 16A Voltage 600 = 600V 700 = 700V 800 = 800V Sensitivity and type B = 50mA Standard C = 25mA Standard SW = 10mA Logic Level Packing mode RG = Tube BW = 50mA Snubberless CW = 35mA Snubberless Figure 13: Ordering Information Scheme (T16 series) T 16 35 - 600 G (-TR) Triac series Current 16 = 16A Sensitivity 35 = 35mA Voltage 600 = 600V 800 = 800V Package G = D2PAK Packing mode Blanck = Tube -TR = Tape & Reel Table 7: Product Selector Part Numbers BTA/BTB16-xxxB BTA/BTB16-xxxBW BTA/BTB16-xxxC BTA/BTB16-xxxCW BTA/BTB16-xxxSW T1635-xxxG Voltage (xxx) 600 V X X X X X X 700 V X X X X X 800 V X X X X X X Sensitivity 50 mA 50 mA 25 mA 35 mA 10 mA 35 mA Type Standard Snubberless Standard Snubberless Logic level Snubberless Package TO-220AB TO-220AB TO-220AB TO-220AB TO-220AB D2PAK BTB: non insulated TO-220AB package 6/9 BTA16, BTB16 and T16 Series Figure 14: D2PAK Package Mechanical Data DIMENSIONS REF. A E L2 C2 Millimeters Min. Typ. Max. Min. 4.30 2.49 0.03 0.70 1.25 0.45 1.21 8.95 10.00 4.88 15.00 1.27 1.40 0.40 0° 8° 0° 1.40 4.60 0.169 2.69 0.098 0.23 0.001 0.93 0.027 Inches Typ. Max. 0.181 0.106 0.009 0.037 0.024 0.054 0.368 0.405 0.208 0.624 0.055 0.069 0.016 8° A A1 A2 D B B2 C C2 L L3 A1 B2 B G A2 2mm min. FLAT ZONE R 0.048 0.055 0.60 0.017 1.36 0.047 9.35 0.352 10.28 0.393 5.28 0.192 15.85 0.590 1.40 0.050 1.75 0.055 C D E G L L2 L3 R V2 V2 Figure 15: D2PAK Foot Print Dimensions (in millimeters) 16.90 10.30 1.30 5.08 3.70 8.90 7/9 BTA16, BTB16 and T16 Series Figure 16: TO-220AB Package Mechanical Data DIMENSIONS Millimeters Inches Min. Typ. Max. Min. Typ. 15.20 15.90 0.598 3.75 0.147 13.00 14.00 0.511 10.00 10.40 0.393 0.61 0.88 0.024 1.23 1.32 0.048 4.40 4.60 0.173 0.49 0.70 0.019 2.40 2.72 0.094 2.40 2.70 0.094 6.20 6.60 0.244 3.75 3.85 0.147 15.80 16.40 16.80 0.622 0.646 2.65 2.95 0.104 1.14 1.70 0.044 1.14 1.70 0.044 2.60 0.102 REF. B ØI L F A I4 l3 a1 l2 c2 b2 C a2 M b1 e c1 A a1 a2 B b1 b2 C c1 c2 e F ØI I4 L l2 l3 M Max. 0.625 0.551 0.409 0.034 0.051 0.181 0.027 0.107 0.106 0.259 0.151 0.661 0.116 0.066 0.066 In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Table 8: Ordering Information Ordering type BTA/BTB16-xxxyzRG T1635-xxxG T1635-xxxG-TR Marking BTA/BTB16xxxyz T1635xxxG T1635xxxG Package TO-220AB D2PAK Weight 2.3 g 1.5 g Base qty 50 50 1000 Delivery mode Tube Tube Tape & reel Note: xxx = voltage, yy = sensitivity, z = type Table 9: Revision History Date Oct-2002 13-Feb-2006 Revision 6A 7 Last update. TO-220AB delivery mode changed from bulk to tube. ECOPACK statement added. Description of Changes 8/9 BTA16, BTB16 and T16 Series Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics. 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