BTA24-800BWRG

BTA24, BTB24, BTA25 BTA26, BTB26, T25 25 A standard and Snubberless™ triacs Features A2 ■ High current triac Low thermal resistance with clip bonding ■ High commutation (4 quadrant) or very high commutation (3 quadrant) capability ■ BTA series UL1557 certified (File ref: 81734) ■ Packages are RoHS (2002/95/EC) compliant ■ G A1 A2 A1 A2 G A1 A2 G TO-220AB Insulated (BTA24) Applications Applications include the ON/OFF function in applications such as static relays, heating regulation, induction motor starting circuits, etc., or for phase control operation in light dimmers, motor speed controllers, and silmilar. TO-220AB (BTB24) A1 A2 G A1 A2 The snubberless versions (BTA/BTB...W and T25 series) are especially recommended for use on inductive loads, due to their high commutation performances. The BTA series provides an insulated tab (rated at 2500 VRMS). RD91 (BTA25) G TOP3 Insulated (BTA26) A2 A2 A1 A2 Description A1 G A2 Available either in through-hole or surface-mount packages, the BTA24, BTB24, BTA25, BTA26, BTB26 and T25 triac series is suitable for general purpose mains power AC switching. Table 1. D2PAK G TOP3 (BTB26) (T25) Device summary Symbol Parameter BTA24(1) BTB24 BTA25(1) BTA26(1) BTB26 T25 Unit 25 25 25 25 25 25 A 600 600 / 800 V IT(RMS) RMS on-state current VDRM/VRRM Repetitive peak off-state voltage IGT (Snubberless) Triggering gate current 35 / 50 35 / 50 50 35 / 50 - 35 mA IGT (Standard) Triggering gate current - 50 50 50 50 - mA 600 / 800 600 / 800 600 / 800 600(2) / 800 1. Insulated packages 2. 600 V version available only with IGT = 50 mA (Snubberless and Standard) TM: Snubberless is a trademark of STMicroelectronics July 2007 Rev 10 1/12 www.st.com 12 Characteristics BTA24, BTB24, BTA25, BTA26, BTB26, T25 1 Characteristics Table 2. Absolute maximum ratings Symbol Parameter D2 ITSM I²t dI/dt VDSM/VRSM IGM PG(AV) Tstg Tj RD91 Ins/ TOP3 Ins. Tc = 100° C TO-220AB Ins. Tc = 75° C Non repetitive surge peak on-state current (full cycle, Tj initial = 25° C) F = 50 Hz t = 20 ms 250 F = 60 Hz t = 16.7 ms 260 I²t Value for fusing tp = 10 ms Critical rate of rise of on-state current IG = 2 x IGT , tr ≤ 100 ns F = 120 Hz Non repetitive surge peak off-state voltage Peak gate current RMS on-state current (full sine wave) A 340 A²s Tj = 125° C 50 A/µs tp = 10 ms Tj = 25° C VDRM/VRRM + 100 V tp = 20 µs Tj = 125° C 4 A Tj = 125° C 1 W - 40 to + 150 - 40 to + 125 °C Average gate power dissipation Electrical characteristics (Tj = 25° C, unless otherwise specified), Snubberless and logic level (3 quadrants) T25, BTA/BTB24...W, BTA25...W, BTA26...W T25 IGT(1) VGT Test Conditions VD = 12 V RL = 33 Ω VGD VD = VDRM RL = 3.3 kΩ Tj = 125° C IH(2) IT = 500 mA IL IG = 1.2 IGT dV/dt (2) (2) BTA/BTB Quadrant Unit T2535 CW BW 35 35 50 I - II - III MAX. I - II - III MAX. 1.3 V I - II - III MIN. 0.2 V MAX. I - III 50 50 75 70 70 80 80 80 100 MAX. II mA mA mA VD = 67 %VDRM gate open Tj = 125° C MIN. 500 500 1000 V/µs Without snubber Tj = 125° C MIN. 13 13 22 A/ms 1. minimum IGT is guaranted at 5% of IGT max. 2. for both polarities of A2 referenced to A1. 2/12 A Tc = 100° C Symbol (dI/dt)c 25 PAK / TO-220AB Storage junction temperature range Operating junction temperature range Table 3. Unit Tc = 105° C TOP3 IT(RMS) Value BTA24, BTB24, BTA25, BTA26, BTB26, T25 Table 4. Characteristics Electrical characteristics (Tj = 25° C, unless otherwise specified), standard (4 quadrants), BTB24...B, BTA25...B, BTA26...B, BTB26...B Symbol Test Conditions Quadrant Value I - II - III IGT (1) VD = 12 V 50 MAX. RL = 33 Ω IV VGT VGD VD = VDRM RL = 3.3 kΩ Tj = 125° C IH(2)) IT = 500 mA IL IG = 1.2 IGT (dV/dt)c (2) mA 100 ALL MAX. 1.3 V ALL MIN. 0.2 V MAX. 80 mA I - III - IV dV/dt(2) Unit 70 MAX. II mA 160 VD = 67 %VDRM gate open Tj = 125° C MIN. 500 V/µs (dI/dt)c = 13.3 A/ms Tj = 125° C MIN. 10 V/µs Value Unit 1. minimum IGT is guaranted at 5% of IGT max. 2. for both polarities of A2 referenced to A1. Table 5. Static characteristics Symbol VTM (1) Test Conditions Tj = 25° C MAX. 1.55 V Threshold voltage Tj = 125° C MAX. 0.85 V Rd (1) Dynamic resistance Tj = 125° C MAX. 16 mΩ IDRM IRRM 5 µA VDRM = VRRM 3 mA Vt0 (1) ITM = 35 A tp = 380 µs Tj = 25° C MAX. Tj = 125° C 1. for both polarities of A2 referenced to A1. Table 6. Thermal resistance Symbol Rth(j-c) Parameter TOP 3 0.6 D2PAK / TO-220AB 0.8 RD91 Insulated / TOP3 Insulated 0.9 TO-220AB Insulated 1.7 Junction to case (AC) S = 1 cm Junction to ambient Unit ° C/W (1) Rth(j-a) Value ² 2 D PAK 45 TOP3 / TOP3 Insulated 50 TO-220AB / TO-220AB Insulated 60 ° C/W 1. S = Copper surface under tab. 3/12 Characteristics Figure 1. BTA24, BTB24, BTA25, BTA26, BTB26, T25 Maximum power dissipation versus Figure 2. RMS on-state current (full cycle) P(W) IT(RMS)(A) 30 30 RMS on-state current versus case temperature (full cycle) BTB26 25 25 BTA24 20 20 15 15 10 10 5 BTB24 / T25xx / BTA25 / BTA26 5 IT(RMS)(A) TC(°C) 0 0 0 5 10 15 20 25 0 25 D2PAK RMS on-state current versus Figure 4. ambient temperature (printed circuit board FR4, copper thickness: 35µm) (full cycle) Figure 3. IT(RMS)(A) 50 75 100 125 Relative variation of thermal impedance versus pulse duration K=[Zth/Rth] 4.0 1E+0 D2PAK (S=1cm2) 3.5 Zth(j-c) 3.0 Zth(j-a) BTA / BTB24 / T25 1E-1 2.5 2.0 1.5 1E-2 Zth(j-a) BTA26 1.0 0.5 tp(s) Tamb(°C) 1E-3 0.0 0 25 Figure 5. 50 75 100 1E-3 125 On-state characteristics (maximum values) Figure 6. ITM(A) 1E-2 1E-1 1E+0 1E+1 1E+2 5E+2 Surge peak on-state current versus number of cycles ITSM(A) 300 300 Tj max. Vto = 0.85V Rd = 16 mΩ 100 Tj = Tj max. 250 t=20ms One cycle 200 Non repetitive Tj initial=25°C 150 10 Repetitive TC=75°C Tj = 25°C. 100 50 1 0.5 4/12 Number of cycles VTM(V) 1.0 1.5 2.0 2.5 0 3.0 3.5 4.0 4.5 1 10 100 1000 BTA24, BTB24, BTA25, BTA26, BTB26, T25 Figure 7. Characteristics Non-repetitive surge peak on-state Figure 8. current for a sinusoidal pulse with width tp < 10 ms and corresponding value of I2t Relative variation of gate trigger current, holding current and latching current versus junction temperature (typical values) IGT,IH,IL[Tj] / IGT,IH,IL[Tj=25°C] ITSM(A), I2t (A2s) 2.5 3000 Tj initial=25°C dI/dt limitation: 50A/µs 2.0 IGT 1000 1.5 ITSM IH & IL 1.0 I2t 0.5 Tj(°C) tp(ms) 0.0 100 0.01 0.10 Figure 9. 1.00 -40 10.00 Relative variation of critical rate of decrease of main current versus (dV/dt)c (typical values) -20 0 20 40 60 80 100 120 140 Figure 10. Relative variation of critical rate of decrease of main current versus Tj (dI/dt)c [Tj] / (dI/dt)c [Tj specified] (dI/dt)c [(dV/dt)c] / Specified (dI/dt)c 6 2.4 2.2 5 2.0 1.8 4 1.6 T2535/CW/BW 1.4 3 B 1.2 2 1.0 0.8 1 0.6 (dV/dt)c (V/µs) Tj(°C) 0.4 0 0.1 1.0 10.0 100.0 0 25 50 75 100 125 Figure 11. D2PAK thermal resistance junction to ambient versus copper surface under tab (printed circuit board FR4, copper thickness: 35 µm) Rth(j-a)(°C/W) 80 70 D2PAK 60 50 40 30 20 10 S(cm²) 0 0 4 8 12 16 20 24 28 32 36 40 5/12 Ordering information scheme 2 BTA24, BTB24, BTA25, BTA26, BTB26, T25 Ordering information scheme Figure 12. BTA and BTB series BT A 24 - 600 BW RG Triac series Insulation A = insulated B = non insulated Current 24 = 25 A in TO-220AB 25 = 25 A in RD91 26 = 25 A in TOP3 Voltage 600 = 600 V 800 = 800 V Sensitivity and type B = 50 mA Standard BW = 50 mA Snubberless CW = 35 mA Snubberless Packing mode RG = Tube Figure 13. T25 series T 25 35 - 600 G (-TR) Triac series Current 25 = 25 A Sensitivity 35 = 35 mA Voltage 600 = 600 V 800 = 800 V Package G = D2PAK Packing mode Blank = Tube -TR = Tape and Reel 6/12 BTA24, BTB24, BTA25, BTA26, BTB26, T25 3 Package information Package information ● Epoxy meets UL94,V0 ● Cooling method: C ● Recommended torque value: 0.4 - 0.5 Nm (TO-220AB), 0.9 - 1.2 Nm (TOP3 and RD91) ● Maximum torque value for BTB24 is 0.5 Nm Table 7. D2PAK dimensions DIMENSIONS REF. Millimeters Min. A E C2 L2 D L L3 A1 B2 R C Typ. Inches Max. Min. Typ. Max. A 4.30 4.60 0.169 0.181 A1 2.49 2.69 0.098 0.106 A2 0.03 0.23 0.001 0.009 B 0.70 0.93 0.027 0.037 B2 1.25 C 0.45 0.60 0.017 0.024 C2 1.21 1.36 0.047 0.054 D 8.95 9.35 0.352 0.368 E 10.00 10.28 0.393 0.405 G 4.88 5.28 0.192 0.208 L 15.00 15.85 0.590 0.624 L2 1.27 1.40 0.050 0.055 L3 1.40 1.75 0.055 0.069 1.40 0.048 0.055 B G A2 2mm min. FLAT ZONE V2 R V2 0.40 0° 0.016 8° 0° 8° Figure 14. D2PAK footprint dimensions (in millimeters) 16.90 10.30 5.08 1.30 8.90 3.70 7/12 Package information Table 8. BTA24, BTB24, BTA25, BTA26, BTB26, T25 RD91 dimensions DIMENSIONS REF. Millimeters Min. A A2 L2 L1 A1 B2 Min. 40.00 29.90 30.30 Max. 1.575 1.177 1.193 A2 22.00 0.867 B 27.00 1.063 B1 C B1 C2 C1 A1 N1 N2 B F E3 I A 8/12 Max. Inches 13.50 16.50 0.531 0.650 B2 24.00 0.945 C 14.00 0.551 C1 3.50 0.138 C2 1.95 3.00 0.077 0.118 E3 0.70 0.90 0.027 0.035 F 4.00 4.50 0.157 0.177 I 11.20 13.60 0.441 0.535 L1 3.10 3.50 0.122 0.138 L2 1.70 1.90 0.067 0.075 N1 33° 43° 33° 43° N2 28° 38° 28° 38° BTA24, BTB24, BTA25, BTA26, BTB26, T25 Table 9. Package information TOP3 (insulated and non_insulated) dimensions DIMENSIONS REF. Millimeters Min. H R A B ØL Typ. Inches Max. Min. Typ. Max. A 4.4 4.6 0.173 0.181 B 1.45 1.55 0.057 0.061 C 14.35 15.60 0.565 0.614 D 0.5 0.7 0.020 0.028 E 2.7 2.9 0.106 0.114 F 15.8 16.5 0.622 0.650 G 20.4 21.1 0.815 0.831 H 15.1 15.5 0.594 0.610 J 5.4 5.65 0.213 0.222 K 3.4 3.65 0.134 0.144 ØL 4.08 4.17 0.161 0.164 P 1.20 1.40 0.047 0.055 K F P G C J J D E R 4.60 0.181 9/12 Package information Table 10. BTA24, BTB24, BTA25, BTA26, BTB26, T25 TO-220AB (insulated and non-insulated) dimensions DIMENSIONS REF. Millimeters Min. A 15.20 a1 C B ØI b2 Typ. Max. Inches Min. Typ. 15.90 0.598 3.75 Max. 0.625 0.147 a2 13.00 14.00 0.511 0.551 B 10.00 10.40 0.393 0.409 b1 0.61 0.88 0.024 0.034 b2 1.23 1.32 0.048 0.051 C 4.40 4.60 0.173 0.181 c1 0.49 0.70 0.019 0.027 c2 2.40 2.72 0.094 0.107 e 2.40 2.70 0.094 0.106 F 6.20 6.60 0.244 0.259 ØI 3.75 3.85 0.147 0.151 I4 15.80 16.40 16.80 0.622 0.646 0.661 L 2.65 2.95 0.104 0.116 l2 1.14 1.70 0.044 0.066 l3 1.14 1.70 0.044 0.066 L F A I4 l3 c2 a1 l2 a2 M b1 c1 e M 2.60 0.102 In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 10/12 BTA24, BTB24, BTA25, BTA26, BTB26, T25 4 Ordering information Ordering information Table 11. Ordering information Ordering type Marking Package Weight BTA/BTB24-xxxyzRG BTA/BTB24 xxxyz TO-220AB 2.3 g 50 Tube BTA25-xxxyz BTA25xxxyz RD91 20 g 25 Bulk BTA26-xxxyRG BTA26xxxyz TOP3 Ins. 4.5 g 30 Tube BTB26-600BRG BTB26600B TOP3 4.5 g 30 Tube T2535-xxxG T2535 xxxG D2PAK 50 Tube 1.5 g 1000 Tape and reel T2535-xxxG-TR T2535 xxxG Base qty Delivery mode Note: xxx = voltage, y = sensitivity, z = type 5 Revision history Table 12. Revision history Date Revision Oct-2002 6A 13-Feb-2006 7 TO-220AB delivery mode changed from bulk to tube. ECOPACK statement added. 31-May-2006 8 Reformatted to current standard. Tc in figure 3 changed to Tamb 31-Jul-2006 9 Typing error corrected on page 1 (BTB124 instead of BTB24) 10 Added BTB26-600BRG. Restructured cover page and section 2: Ordering information scheme on page 6 to simplify product selection. Thermal resistance values updated in Table 6 and Figure 2. Graphic for I2t updated in Figure 7. 05-Jul-2007 Description of changes Previous update. 11/12 BTA24, BTB24, BTA25, BTA26, BTB26, T25 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. 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