BTA26-600BRG

BTA24, BTB24, BTA25 BTA26, BTB26, T25 25 A standard and Snubberless™ triacs Features ■ ■ A2 High current triac Low thermal resistance with clip bonding ■ High commutation (4 quadrant) or very high commutation (3 quadrant) capability ■ BTA series UL1557 certified (File ref: 81734) ■ Packages are RoHS (2002/95/EC) compliant G A1 A2 A1 A2 G A1 A2 G Applications Applications include the ON/OFF function in applications such as static relays, heating regulation, induction motor starting circuits, etc., or for phase control operation in light dimmers, motor speed controllers, and silmilar. The snubberless versions (BTA/BTB...W and T25 series) are especially recommended for use on inductive loads, due to their high commutation performances. The BTA series provides an insulated tab (rated at 2500 VRMS). TO-220AB Insulated (BTA24) A1 G A2 TO-220AB (BTB24) A1 A2 G RD91 (BTA25) A2 TOP3 Insulated (BTA26) A2 Description Available either in through-hole or surface-mount packages, the BTA24, BTB24, BTA25, BTA26, BTB26 and T25 triac series is suitable for general purpose mains power AC switching. Table 1. Symbol IT(RMS) VDRM/VRRM IGT (Snubberless) IGT (Standard) A1 A2 G A1 A2 G D2PAK (T25) TOP3 (BTB26) Device summary Parameter RMS on-state current Repetitive peak off-state voltage Triggering gate current Triggering gate current BTA24(1) 25 BTB24 25 BTA25(1) 25 BTA26(1) 25 BTB26 25 600 50 T25 25 600 / 800 35 Unit A V mA mA 600 / 800 600 / 800 600 / 800 600(2) / 800 35 / 50 35 / 50 50 50 50 35 / 50 50 1. Insulated packages 2. 600 V version available only with IGT = 50 mA (Snubberless and Standard) TM: Snubberless is a trademark of STMicroelectronics July 2007 Rev 10 1/12 www.st.com 12 Characteristics BTA24, BTB24, BTA25, BTA26, BTB26, T25 1 Table 2. Symbol Characteristics Absolute maximum ratings Parameter TOP3 PAK / TO-220AB IT(RMS) RMS on-state current (full sine wave) RD91 Ins/ TOP3 Ins. TO-220AB Ins. ITSM I²t dI/dt Non repetitive surge peak on-state current (full cycle, Tj initial = 25° C) I²t Value for fusing Critical rate of rise of on-state current IG = 2 x IGT , tr ≤ 100 ns Non repetitive surge peak off-state voltage Peak gate current Average gate power dissipation Storage junction temperature range Operating junction temperature range F = 50 Hz F = 60 Hz tp = 10 ms F = 120 Hz tp = 10 ms tp = 20 µs Tj = 125° C Tj = 25° C Tj = 125° C Tj = 125° C Tc = 100° C Tc = 75° C t = 20 ms t = 16.7 ms 250 A 260 340 50 VDRM/VRRM + 100 4 1 - 40 to + 150 - 40 to + 125 A²s A/µs V A W °C D2 Tc = 105° C Tc = 100° C 25 A Value Unit VDSM/VRSM IGM PG(AV) Tstg Tj Table 3. Electrical characteristics (Tj = 25° C, unless otherwise specified), Snubberless and logic level (3 quadrants) T25, BTA/BTB24...W, BTA25...W, BTA26...W T25 BTA/BTB Unit T2535 CW 35 1.3 0.2 50 70 MAX. II Tj = 125° C Tj = 125° C MIN. MIN. 80 500 13 80 500 13 100 1000 22 V/µs A/ms 50 70 75 80 mA BW 50 mA V V mA MAX. MAX. MIN. MAX. I - III 35 Test Conditions Quadrant I - II - III I - II - III I - II - III Symbol IGT(1) VGT VGD IH(2) IL dV/dt (2) (dI/dt)c (2) VD = 12 V RL = 33 Ω VD = VDRM RL = 3.3 kΩ Tj = 125° C IT = 500 mA IG = 1.2 IGT VD = 67 %VDRM gate open Without snubber 1. minimum IGT is guaranted at 5% of IGT max. 2. for both polarities of A2 referenced to A1. 2/12 BTA24, BTB24, BTA25, BTA26, BTB26, T25 Table 4. Symbol IGT (1) VGT VGD IH(2)) IL dV/dt(2) (dV/dt)c (2) Characteristics Electrical characteristics (Tj = 25° C, unless otherwise specified), standard (4 quadrants), BTB24...B, BTA25...B, BTA26...B, BTB26...B Test Conditions Quadrant I - II - III VD = 12 V RL = 33 Ω MAX. IV ALL VD = VDRM RL = 3.3 kΩ Tj = 125° C IT = 500 mA I - III - IV IG = 1.2 IGT VD = 67 %VDRM gate open (dI/dt)c = 13.3 A/ms MAX. II Tj = 125° C Tj = 125° C MIN. MIN. 160 500 10 V/µs V/µs ALL MAX. MIN. MAX. 100 1.3 0.2 80 70 mA V V mA Value 50 mA Unit 1. minimum IGT is guaranted at 5% of IGT max. 2. for both polarities of A2 referenced to A1. Table 5. Symbol VTM (1) Vt0 (1) Static characteristics Test Conditions ITM = 35 A tp = 380 µs Tj = 25° C Tj = 125° C Tj = 125° C Tj = 25° C Tj = 125° C MAX. MAX. MAX. MAX. 3 mA Value 1.55 0.85 16 5 Unit V V mΩ µA Threshold voltage Dynamic resistance VDRM = VRRM Rd (1) IDRM IRRM 1. for both polarities of A2 referenced to A1. Table 6. Symbol Thermal resistance Parameter TOP 3 D2PAK / TO-220AB Value 0.6 0.8 ° C/W RD91 Insulated / TOP3 Insulated TO-220AB Insulated (1) Unit Rth(j-c) Junction to case (AC) 0.9 1.7 45 50 60 S = 1 cm ² D PAK TOP3 / TOP3 Insulated TO-220AB / TO-220AB Insulated 2 Rth(j-a) Junction to ambient ° C/W 1. S = Copper surface under tab. 3/12 Characteristics BTA24, BTB24, BTA25, BTA26, BTB26, T25 Figure 1. Maximum power dissipation versus Figure 2. RMS on-state current (full cycle) 30 RMS on-state current versus case temperature (full cycle) P(W) 30 25 20 15 10 5 IT(RMS)(A) BTB26 25 BTA24 20 15 BTB24 / T25xx / BTA25 / BTA26 10 5 IT(RMS)(A) 0 0 5 10 15 20 25 0 0 25 50 TC(°C) 75 100 125 Figure 3. D2PAK RMS on-state current versus Figure 4. ambient temperature (printed circuit board FR4, copper thickness: 35µm) (full cycle) 1E+0 D2PAK (S=1cm2) Relative variation of thermal impedance versus pulse duration IT(RMS)(A) 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 0 25 50 75 100 125 1E-2 1E-1 K=[Zth/Rth] Zth(j-c) Zth(j-a) BTA / BTB24 / T25 Zth(j-a) BTA26 Tamb(°C) tp(s) 1E-3 1E-3 1E-2 1E-1 1E+0 1E+1 1E+2 5E+2 Figure 5. On-state characteristics (maximum values) Figure 6. Surge peak on-state current versus number of cycles ITM(A) 300 Tj max. Vto = 0.85V Rd = 16 mΩ Tj = Tj max. ITSM(A) 300 250 t=20ms 100 200 Non repetitive Tj initial=25°C One cycle 150 10 Tj = 25°C. 100 50 1 0.5 1.0 1.5 2.0 Repetitive TC=75°C VTM(V) 2.5 3.0 3.5 4.0 4.5 Number of cycles 0 1 10 100 1000 4/12 BTA24, BTB24, BTA25, BTA26, BTB26, T25 Characteristics Figure 7. Non-repetitive surge peak on-state Figure 8. current for a sinusoidal pulse with width tp < 10 ms and corresponding value of I2t 2.5 Tj initial=25°C Relative variation of gate trigger current, holding current and latching current versus junction temperature (typical values) ITSM(A), I2t (A2s) 3000 dI/dt limitation: 50A/µs IGT,IH,IL[Tj] / IGT,IH,IL[Tj=25°C] 2.0 IGT ITSM 1000 1.5 IH & IL I2t 1.0 0.5 tp(ms) 100 0.01 0.10 1.00 10.00 0.0 -40 -20 0 20 Tj(°C) 40 60 80 100 120 140 Figure 9. Relative variation of critical rate of decrease of main current versus (dV/dt)c (typical values) Figure 10. Relative variation of critical rate of decrease of main current versus Tj (dI/dt)c [(dV/dt)c] / Specified (dI/dt)c 2.4 2.2 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.1 1.0 10.0 100.0 T2535/CW/BW B (dI/dt)c [Tj] / (dI/dt)c [Tj specified] 6 5 4 3 2 1 (dV/dt)c (V/µs) 0 0 25 50 Tj(°C) 75 100 125 Figure 11. D2PAK thermal resistance junction to ambient versus copper surface under tab (printed circuit board FR4, copper thickness: 35 µm) Rth(j-a)(°C/W) 80 70 60 50 40 30 20 10 0 0 4 8 12 16 20 24 28 32 36 40 D2PAK S(cm²) 5/12 Ordering information scheme BTA24, BTB24, BTA25, BTA26, BTB26, T25 2 Ordering information scheme Figure 12. BTA and BTB series BT A 24 - 600 BW RG Triac series Insulation A = insulated B = non insulated Current 24 = 25 A in TO-220AB 25 = 25 A in RD91 26 = 25 A in TOP3 Voltage 600 = 600 V 800 = 800 V Sensitivity and type B = 50 mA Standard BW = 50 mA Snubberless CW = 35 mA Snubberless Packing mode RG = Tube Figure 13. T25 series T 25 35 - 600 G (-TR) Triac series Current 25 = 25 A Sensitivity 35 = 35 mA Voltage 600 = 600 V 800 = 800 V Package G = D2PAK Packing mode Blank = Tube -TR = Tape and Reel 6/12 BTA24, BTB24, BTA25, BTA26, BTB26, T25 Package information 3 Package information ● ● ● ● Epoxy meets UL94,V0 Cooling method: C Recommended torque value: 0.4 - 0.5 Nm (TO-220AB), 0.9 - 1.2 Nm (TOP3 and RD91) Maximum torque value for BTB24 is 0.5 Nm D2PAK dimensions DIMENSIONS REF. Millimeters Min. A E L2 C2 Table 7. Inches Min. 0.169 0.098 0.001 0.027 0.048 0.055 Typ. Max. 0.181 0.106 0.009 0.037 Typ. Max. 4.60 2.69 0.23 0.93 A A1 A2 D 4.30 2.49 0.03 0.70 1.25 0.45 1.21 8.95 10.00 4.88 15.00 1.27 1.40 0.40 0° 1.40 B B2 L L3 A1 B2 B R C C 0.60 1.36 9.35 0.017 0.047 0.352 0.024 0.054 0.368 0.405 0.208 0.624 0.055 0.069 0.016 C2 D G E A2 2mm min. FLAT ZONE 10.28 0.393 5.28 0.192 G L V2 15.85 0.590 1.40 1.75 0.050 0.055 L2 L3 R V2 8° 0° 8° Figure 14. D2PAK footprint dimensions (in millimeters) 16.90 10.30 1.30 5.08 8.90 3.70 7/12 Package information Table 8. RD91 dimensions BTA24, BTB24, BTA25, BTA26, BTB26, T25 DIMENSIONS REF. Millimeters Min. A2 L2 L1 Inches Min. Max. 1.575 1.177 1.193 0.867 1.063 0.531 0.650 0.945 0.551 0.138 0.077 0.027 0.157 0.441 0.122 0.067 33° 28° 0.118 0.035 0.177 0.535 0.138 0.075 43° 38° Max. 40.00 A A1 A2 29.90 30.30 22.00 27.00 B2 C B1 B B1 C2 A1 C1 13.50 16.50 24.00 14.00 3.50 B2 C N2 N1 B F C1 C2 E3 F I L1 L2 N1 N2 1.95 0.70 4.00 11.20 3.10 1.70 33° 28° 3.00 0.90 4.50 13.60 3.50 1.90 43° 38° E3 I A 8/12 BTA24, BTB24, BTA25, BTA26, BTB26, T25 Table 9. TOP3 (insulated and non_insulated) dimensions Package information DIMENSIONS REF. Millimeters Min. H R B A Inches Min. 0.173 Typ. Max. 0.181 0.061 0.614 0.028 0.114 0.650 0.831 0.610 0.222 0.144 0.164 0.055 0.181 Typ. Max. 4.6 A B C 4.4 1.45 14.35 0.5 2.7 15.8 20.4 15.1 5.4 3.4 4.08 1.20 4.60 ØL 1.55 0.057 15.60 0.565 0.7 2.9 0.020 0.106 K D F G E F P 16.5 0.622 21.1 0.815 15.5 0.594 5.65 0.213 3.65 0.134 4.17 0.161 1.40 0.047 G C H J J D E J K ØL P R 9/12 Package information Table 10. BTA24, BTB24, BTA25, BTA26, BTB26, T25 TO-220AB (insulated and non-insulated) dimensions DIMENSIONS REF. Millimeters Min. A a1 B ØI L F A b2 C Inches Min. Typ. Max. 0.625 0.147 Typ. Max. 15.20 3.75 13.00 10.00 0.61 1.23 4.40 0.49 2.40 2.40 6.20 3.75 15.90 0.598 a2 B b1 b2 C 14.00 0.511 10.40 0.393 0.88 1.32 4.60 0.70 2.72 2.70 6.60 3.85 0.024 0.048 0.173 0.019 0.094 0.094 0.244 0.147 0.551 0.409 0.034 0.051 0.181 0.027 0.107 0.106 0.259 0.151 I4 l3 a1 l2 c2 c1 c2 e a2 M b1 e c1 F ØI I4 L l2 l3 M 15.80 16.40 16.80 0.622 0.646 0.661 2.65 1.14 1.14 2.60 2.95 1.70 1.70 0.104 0.044 0.044 0.102 0.116 0.066 0.066 In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 10/12 BTA24, BTB24, BTA25, BTA26, BTB26, T25 Ordering information 4 Ordering information Table 11. Ordering information Marking BTA/BTB24 xxxyz BTA25xxxyz BTA26xxxyz BTB26600B T2535 xxxG T2535 xxxG Package TO-220AB RD91 TOP3 Ins. TOP3 D2PAK Weight 2.3 g 20 g 4.5 g 4.5 g 1.5 g 1000 Tape and reel Base qty Delivery mode 50 25 30 30 50 Tube Bulk Tube Tube Tube Ordering type BTA/BTB24-xxxyzRG BTA25-xxxyz BTA26-xxxyRG BTB26-600BRG T2535-xxxG T2535-xxxG-TR Note: xxx = voltage, y = sensitivity, z = type 5 Revision history Table 12. Date Oct-2002 13-Feb-2006 31-May-2006 31-Jul-2006 Revision history Revision 6A 7 8 9 Previous update. TO-220AB delivery mode changed from bulk to tube. ECOPACK statement added. Reformatted to current standard. Tc in figure 3 changed to Tamb Typing error corrected on page 1 (BTB124 instead of BTB24) Added BTB26-600BRG. Restructured cover page and section 2: Ordering information scheme on page 6 to simplify product selection. Thermal resistance values updated in Table 6 and Figure 2. Graphic for I2t updated in Figure 7. Description of changes 05-Jul-2007 10 11/12 BTA24, BTB24, BTA25, BTA26, BTB26, T25 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2007 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 12/12