BTB08-XXXBW

® BTA08, BTB08 and T8 Series 8A TRIACS A2 SNUBBERLESS™, LOGIC LEVEL & STANDARD Table 1: Main Features Symbol IT(RMS) VDRM/VRRM IGT (Q1) Value 8 600 and 800 5 to 50 Unit A V mA A1 A2 G A2 G A1 A2 DESCRIPTION Available either in through-hole or surface-mount packages, the BTA08, BTB08 and T8 triac series is suitable for general purpose AC switching. They can be used as an ON/OFF function in applications such as static relays, heating regulation, induction motor starting circuits... or for phase control operation in light dimmers, motor speed controllers,... The snubberless versions (BTA/BTB...W and T8 series) are specially recommended for use on inductive loads, thanks to their high commutation performances. Logic level versions are designed to interface directly with low power drivers such as microcontrollers. By using an internal ceramic pad, the BTA series provides voltage insulated tab (rated at 2500VRMS) complying with UL standards (file ref.: E81734). A1 A2 G D2PAK (T8-G) A2 IPAK (T8-H) A1 A2 G DPAK (T8-B) A2 A1 A2 G A1 A2 G TO-220AB Insulated (BTA08) TO-220AB (BTB08) Table 2: Order Codes Part Number BTA08-xxxxxRG BTB08-xxxxxRG T8xx-xxxG T8xx-xxxH T8xx-xxxB Marking See page table 8 on page 10 February 2006 REV. 6 1/11 BTA08, BTB08 and T8 Series Table 3: Absolute Maximum Ratings Symbol IT(RMS) Parameter RMS on-state current (full sine wave) IPAK/D2PAK/ T = 110°C DPAK/TO-220AB c TO-220AB Ins. ITSM I²t dI/dt IGM PG(AV) Tstg Tj Non repetitive surge peak on-state F = 50 Hz current (full cycle, Tj initial = 25°C) F = 60 Hz I²t Value for fusing Critical rate of rise of on-state current IG = 2 x IGT , tr ≤ 100 ns Peak gate current Average gate power dissipation Storage junction temperature range Operating junction temperature range tp = 10 ms F = 120 Hz tp = 20 µs Tj = 125°C Tj = 125°C Tj = 125°C Tc = 100°C t = 20 ms t = 16.7 ms 80 84 36 50 4 1 - 40 to + 150 - 40 to + 125 A A ²s A/µs A W °C Value 8 Unit A Tables 4: Electrical Characteristics (Tj = 25°C, unless otherwise specified) ■ SNUBBERLESS and Logic Level (3 quadrants) Symbol IGT (1) VGT VGD IH (2) IL dV/dt (2) Test Conditions VD = 12 V RL = 30 Ω Quadrant I - II - III MAX. I - II - III MAX. MIN. MAX. I - III II MAX. MIN. 15 25 30 40 5.4 MIN. 2.8 35 50 60 400 4.5 10 10 15 20 3.5 1.5 T8 T810 T835 10 35 TW 5 1.3 0.2 15 25 30 40 5.4 2.98 35 50 60 400 4.5 50 70 80 BTA08 / BTB08 SW 10 CW 35 BW 50 Unit mA V V mA mA VD = VDRM RL = 3.3 kΩ I - II - III Tj = 125°C IT = 100 mA IG = 1.2 IGT VD = 67 %VDRM gate open Tj = 125°C (dV/dt)c = 0.1 V/µs Tj = 125°C Tj = 125°C Tj = 125°C 1000 V/µs 7 A/ms (dI/dt)c (2) (dV/dt)c = 10 V/µs Without snubber 2/11 BTA08, BTB08 and T8 Series ■ Standard (4 quadrants) Symbol IGT (1) VGT VGD IH (2) IL dV/dt (2) VD = VDRM RL = 3.3 kΩ Tj = 125°C IT = 500 mA IG = 1.2 IGT VD = 67 %VDRM gate open Tj = 125°C Tj = 125°C I - III - IV II Test Conditions Quadrant I - II - III IV ALL ALL MAX. MAX. MIN. MAX. MAX. MIN. MIN. 25 40 80 200 5 BTA08 / BTB08 C 25 50 1.3 0.2 50 50 100 400 10 B 50 100 Unit mA V V mA mA V/µs V/µs VD = 12 V RL = 30 Ω (dV/dt)c (2) (dI/dt)c = 5.3 A/ms Table 5: Static Characteristics Symbol VT (2) Vto (2) Rd (2) IDRM IRRM ITM = 11 A Test Conditions tp = 380 µs Tj = 25°C Tj = 125°C Tj = 125°C Tj = 25°C Tj = 125°C MAX. MAX. MAX. MAX. Value 1.55 0.85 50 5 1 Unit V V mΩ µA mA Threshold voltage Dynamic resistance VDRM = VRRM Note 1: minimum IGT is guaranted at 5% of IGT max. Note 2: for both polarities of A2 referenced to A1. Table 6: Thermal resistance Symbol Rth(j-c) Junction to case (AC) S = 1 cm² Rth(j-a) Junction to ambient S = 0.5 cm² Parameter IPAK / D2PAK / DPAK / TO-220AB TO-220AB Insulated D2PAK DPAK TO-220AB / TO-220AB Insulated IPAK S = Copper surface under tab. Value 1.6 2.5 45 70 60 100 Unit °C/W °C/W 3/11 BTA08, BTB08 and T8 Series Figure 1: Maximum power dissipation versus RMS on-state current (full cycle) P(W) 10 9 8 7 6 5 4 3 2 1 0 0 1 2 3 4 5 6 7 8 Figure 2: RMS on-state current versus case temperature (full cycle) IT(RMS)(A) 10 9 8 7 6 5 4 3 2 BTA BTB / T8 IT(RMS)(A) 1 0 0 25 50 TC(°C) 75 100 125 Figure 3: RMS on-state current versus ambient temperature (printed circuit board FR4, copper thickness: 35µm) (full cycle) IT(RMS)(A) 3.5 3.0 2.5 D2PAK (S=1CM2) Figure 4: Relative variation of thermal impedance versus pulse duration K=[Zth/Rth] 1E+0 Zth(j-c) DPAK/IPAK Zth(j-a) 1E-1 2.0 1.5 1.0 0.5 DPAK (S=0.5CM2) TO-220AB/D2PAK Zth(j-a) 1E-2 TC(°C) 0.0 0 25 50 75 100 125 tp(s) 1E-3 1E-3 1E-2 1E-1 1E+0 1E+1 1E+2 5E+2 Figure 5: On-state characteristics (maximum values) ITM(A) 100 Tj max. Vto = 0.85V Rd = 50 mΩ Tj = Tj max. Figure 6: Surge peak on-state current versus number of cycles ITSM(A) 90 80 70 60 50 Non repetitive Tj initial=25°C Repetitive TC=110°C t=20ms One cycle 10 Tj = 25°C. 40 30 20 VTM(V) 1 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 10 0 1 10 Number of cycles 100 1000 4/11 BTA08, BTB08 and T8 Series Figure 7: Non-repetitive surge peak on-state current for a sinusoidal pulse with width tp < 10 ms and corresponding value of I2t ITSM(A), I t (A s) 1000 Tj initial=25°C 2 2 Figure 8: Relative variation of gate trigger current, holding current and latching current versus junction temperature (typical values) IGT,IH,IL[Tj] / IGT,IH,IL[Tj=25°C] 2.5 2.0 IGT dI/dt limitation: 50A/µs ITSM 1.5 1.0 IH & IL 100 I2t 0.5 10 0.01 0.10 tp(ms) 1.00 10.00 Tj(°C) 0.0 -40 -20 0 20 40 60 80 100 120 140 Figure 9: Relative variation of critical rate of decrease of main current versus (dV/dt)c (typical values) (Snubberless & Logic level types) (dI/dt)c [(dV/dt)c] / Specified (dI/dt)c 2.2 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 0.1 1.0 10.0 100.0 T810/SW T835/CW/BW TW Figure 10: Relative variation of critical rate of decrease of main current versus (dV/dt)c (typical values) (Standard types) (dI/dt)c [(dV/dt)c] / Specified (dI/dt)c 2.0 1.8 1.6 C 1.4 1.2 1.0 0.8 B (dV/dt)c (V/µs) 0.6 0.4 0.1 1.0 (dV/dt)c (V/µs) 10.0 100.0 Figure 11: Relative variation of critical rate of decrease of main current versus junction temperature Figure 12: DPAK and D2PAK Thermal resistance junction to ambient versus copper surface under tab (printed circuit board FR4, copper thickness: 35 µm) Rth(j-a)(°C/W) 100 90 80 70 60 50 40 30 20 D2PAK DPAK (dI/dt)c [Tj] / (dI/dt)c [Tj specified] 6 5 4 3 2 1 Tj(°C) 0 0 25 50 75 100 125 10 0 0 4 8 12 16 S(cm²) 20 24 28 32 36 40 5/11 BTA08, BTB08 and T8 Series Figure 13: Ordering Information Scheme (BTA08 and BTB08 series) BT A 08 - 600 BW (RG) Triac series Insulation A = insulated B = non insulated Current 08 = 8A Voltage 600 = 600V 800 = 800V Sensitivity and type B = 50mA Standard C = 25mA Standard SW = 10mA Logic Level Packing mode RG = Tube BW = 50mA Snubberless CW = 35mA Snubberless TW = 5mA Logic Level Figure 14: Ordering Information Scheme (T8 series) T 8 10 - 600 B (-TR) Triac series Current 8 = 8A Sensitivity 10 = 10mA 35 = 35mA Voltage 600 = 600V 800 = 800V Package B = DPAK G = D2PAK R = I2PAK Packing mode Blanck = Tube -TR = Tape & Reel Table 7: Product Selector Part Number BTA/BTB08-xxxB BTA/BTB08-xxxBW BTA/BTB08-xxxC BTA/BTB08-xxxCW BTA/BTB08-xxxSW BTA/BTB08-xxxTW T810-xxxG T810-xxxH T835-xxxB T835-xxxG T835-xxxH BTB: non insulated TO-220AB package Voltage (xxx) 600 V X X X X X X X X X X X 800 V X X X X X X X X X X X Sensitivity 50 mA 50 mA 25 mA 35 mA 10 mA 5 mA 10 mA 10 mA 35 mA 35 mA 35 mA Type Standard Snubberless Standard Snubberless Logic level Logic Level Logic Level Logic Level Snubberless Snubberless Snubberless Package TO-220AB TO-220AB TO-220AB TO-220AB TO-220AB TO-220AB D2PAK IPAK DPAK D2PAK IPAK 6/11 BTA08, BTB08 and T8 Series Figure 15: D2PAK Package Mechanical Data DIMENSIONS REF. A E L2 C2 Millimeters Min. Typ. Max. Min. 4.30 2.49 0.03 0.70 1.25 0.45 1.21 8.95 10.00 4.88 15.00 1.27 1.40 0.40 0° 8° 0° 1.40 4.60 0.169 2.69 0.098 0.23 0.001 0.93 0.027 Inches Typ. Max. 0.181 0.106 0.009 0.037 0.024 0.054 0.368 0.405 0.208 0.624 0.055 0.069 0.016 8° A A1 A2 D B B2 C C2 L L3 A1 B2 B G A2 2mm min. FLAT ZONE R 0.048 0.055 0.60 0.017 1.36 0.047 9.35 0.352 10.28 0.393 5.28 0.192 15.85 0.590 1.40 0.050 1.75 0.055 C D E G L L2 L3 R V2 V2 Figure 16: D2PAK Foot Print Dimensions (in millimeters) 16.90 10.30 1.30 5.08 3.70 8.90 7/11 BTA08, BTB08 and T8 Series Figure 17: DPAK Package Mechanical Data DIMENSIONS REF. E B2 L2 C2 Millimeters Min. Max 2.40 1.10 0.23 0.90 5.40 0.60 0.60 6.20 6.60 4.60 10.10 1.00 8° 2.20 0.90 0.03 0.64 5.20 0.45 0.48 6.00 6.40 4.40 9.35 0.60 0° Inches Min. 0.086 0.035 0.001 0.025 0.204 0.017 0.018 0.236 0.251 0.173 0.368 0.023 0° Max. 0.094 0.043 0.009 0.035 0.212 0.023 0.023 0.244 0.259 0.181 0.397 0.039 8° A A A1 A2 B B2 D H L4 B G A1 R C C2 D E G H L2 L4 R C A2 0.60 MIN. 0.80 typ. 0.031 typ. V2 V2 Figure 18: DPAK Foot Print Dimensions (in millimeters) 6.7 3 3 1.6 2.3 6.7 2.3 1.6 8/11 BTA08, BTB08 and T8 Series Figure 19: TO-220AB Package Mechanical Data DIMENSIONS Millimeters Inches Min. Typ. Max. Min. Typ. 15.20 15.90 0.598 3.75 0.147 13.00 14.00 0.511 10.00 10.40 0.393 0.61 0.88 0.024 1.23 1.32 0.048 4.40 4.60 0.173 0.49 0.70 0.019 2.40 2.72 0.094 2.40 2.70 0.094 6.20 6.60 0.244 3.75 3.85 0.147 15.80 16.40 16.80 0.622 0.646 2.65 2.95 0.104 1.14 1.70 0.044 1.14 1.70 0.044 2.60 0.102 REF. B ØI L F A I4 l3 a1 l2 c2 b2 C a2 M b1 e c1 A a1 a2 B b1 b2 C c1 c2 e F ØI I4 L l2 l3 M Max. 0.625 0.551 0.409 0.034 0.051 0.181 0.027 0.107 0.106 0.259 0.151 0.661 0.116 0.066 0.066 Figure 20: IPAK Package Mechanical Data REF. A E B2 L2 C2 D H L L1 B3 B V1 A1 e G B5 C A3 A A1 A3 B B2 B3 B5 C C2 D E e G H L L1 L2 V1 DIMENSIONS Millimeters Inches Min. Typ. Max. Min. Typ. 2.20 2.40 0.086 0.90 1.10 0.035 0.70 1.30 0.027 0.64 0.90 0.025 5.20 5.40 0.204 0.95 0.30 0.035 0.45 0.60 0.017 0.48 0.60 0.019 6 6.20 0.236 6.40 6.60 0.252 2.28 0.090 4.40 4.60 0.173 16.10 0.634 9 9.40 0.354 0.8 1.20 0.031 0.80 1 0.031 10° 10° Max. 0.094 0.043 0.051 0.035 0.212 0.037 0.023 0.023 0.244 0.260 0.181 0.370 0.047 0.039 9/11 BTA08, BTB08 and T8 Series In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Table 8: Ordering Information Ordering type BTA/BTB08-xxxyzRG T8yy-xxxG T8yy-xxxG-TR T8yy-xxxB T8yy-xxxB-TR T8yy-xxxH Marking BTA/BTB08-xxxyz T8yyxx T8yyxx T8yyxx T8yyxx T8yyxx Package TO-220AB D2PAK DPAK IPAK Weight 2.3 g 1.5 g Base qty 50 50 1000 75 2500 75 Delivery mode Tube Tube Tape & reel Tube Tape & reel Tube 0.3 g 0.4 g Note: xxx = voltage, yy = sensitivity, z = type Table 9: Revision History Date Apr-2002 13-Feb-2006 Revision 5A 6 Last update. TO-220AB delivery mode changed from bulk to tube. ECOPACK statement added. Description of Changes 10/11 BTA08, BTB08 and T8 Series Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners © 2006 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 11/11