BTB12800CWRG

BTA12, BTB12, T12xx 12 A Snubberless™, logic level and standard triacs Features ■ ■ ■ ■ ■ ■ A2 Medium current triac Low thermal resistance with clip bonding Low thermal resistance insulation ceramic for insulated BTA High commutation (4Q) or very high commutation (3Q) capability BTA series UL1557 certified (File ref: 81734) Packages are RoHS ( 2002/95/EC) compliant A1 A2 G A2 G A1 A2 A1 A2 G D2PAK (T12-G) I2PAK (T12-R) A2 Applications ON/OFF or phase angle function in applications such as static relays, light dimmers and appliance motors speed controllers. The snubberless versions (BTA/BTB...W and T12 series) are especially recommended for use on inductive loads, because of their high commutation performances. The BTA series provides an insulated tab (rated at 2500 V RMS). A1 A2 G A1 A2 G TO-220AB Insulated (BTA12) TO-220AB (BTB12) Order code See Ordering information on page 11 Description Available either in through-hole or surface-mount packages, the BTA12, BTB12 and T12xx triac series is suitable for general purpose mains power AC switching. Table 1. Device summary Parameter RMS on-state current Repetitive peak off-state voltage Triggering gate current Triggering gate current T12xx 12 600/800 10/35/50 BTA12 (1) 12 600/800 5/10/35/50 35/50 BTB12 12 600/800 5/10/35/50 35/50 Symbol IT(RMS) VDRM/VRRM IGT (Snubberless) IGT (Standard) 1. Insulated TM: Snubberless is a trademark of STMicroelectronics September 2007 Rev 9 1/12 www.st.com 12 Characteristics BTA12, BTB12, T12xx 1 Table 2. Symbol Characteristics Absolute maximum ratings Parameter RMS on-state current (full sine wave) Non repetitive surge peak on-state current (full cycle, Tj initial = 25° C) I2t Value for fusing Critical rate of rise of on-state current IG = 2 x IGT , tr ≤ 100 ns Non repetitive surge peak off-state voltage Peak gate current Average gate power dissipation Storage junction temperature range Operating junction temperature range I2PAK / D2PAK / TO-220AB TO-220AB Ins. F = 50 Hz F = 60 Hz tp = 10 ms F = 120 Hz tp = 10 ms tp = 20 µs Tj = 125° C Tj = 25° C Tj = 125° C Tj = 125° C ITSM I2t dI/dt Tc = 105° C Tc = 90° C t = 20 ms t = 16.7 ms 120 A 126 78 50 VDRM/VRRM + 100 4 1 - 40 to + 150 - 40 to + 125 A²s A/µs V A W °C Value Unit IT(RMS) 12 A VDSM/VRSM IGM PG(AV) Tstg Tj Table 3. Electrical characteristics (Tj = 25°C, unless otherwise specified) Snubberless and logic level (3 quadrants) T12xx Symbol IGT (1) VGT VGD IH (2) IL dV/dt (2) Test conditions Quadrant T1210 VD = 12 V RL = 30 Ω VD = VDRM RL = 3.3 kΩ Tj = 125° C IT = 100 mA I - III IG = 1.2 IGT MAX. II MIN. 30 40 6.5 MIN. 2.9 6.5 12 60 500 80 1000 15 20 3.5 1 I - II - III I - II - III I - II - III MAX. MAX. MIN. MAX. 15 25 35 50 50 70 10 T1235 35 T1250 50 1.3 0.2 10 10 TW 5 BTA12 / BTB12 Unit SW 10 CW 35 BW 50 mA V V 15 25 30 40 6.5 2.9 6.5 12 A/ms 35 50 60 500 50 70 mA 80 1000 V/µs mA VD = 67 %VDRM gate open Tj = 125° C (dV/dt)c = 0.1 V/µs Tj = 125° C (dI/dt)c (2) (dV/dt)c = 10 V/µs Tj = 125° C Without snubber Tj= 125° C 1. Minimum IGT is guaranted at 5% of IGT max 2. for both polarities of A2 referenced to A1 2/12 BTA12, BTB12, T12xx Table 4. Electrical characteristics (Tj = 25°C, unless otherwise specified) standard (4 quadrants) Characteristics BTA12 / BTB12 Symbol Test Conditions Quadrant C IGT (1) VGT VGD IH (2) IL dV/dt (2) (dV/dt)c (2) VD = VDRM RL = 3.3 kΩ Tj = 125° C IT = 500 mA I - III - IV IG = 1.2 IGT VD = 67% VDRM gate open Tj = 125° C (dI/dt)c = 5.3 A/ms Tj = 125° C MAX. II MIN. MIN. 80 200 5 100 400 10 V/µs V/µs I - II - III IV ALL ALL MAX. MAX. MIN. MAX. 25 40 25 50 1.3 0.2 50 50 mA B 50 100 mA V V mA Unit VD = 12 V RL = 30 Ω 1. Minimum IGT is guaranted at 5% of IGT max. 2. for both polarities of A2 referenced to A1. Table 5. Symbol VT (1) Vt0 (1) Rd (1) IDRM IRRM Static characteristics Test conditions ITM = 17 A tp = 380 µs Tj = 25° C Tj = 125° C Tj = 125° C Tj = 25° C Tj= 125° C MAX. MAX. MAX. MAX. 1 mA Value 1.55 0.85 35 5 Unit V V mΩ µA Threshold voltage Dynamic resistance VDRM = VRRM 1. for both polarities of A2 referenced to A1 Table 6. Symbol Rth(j-c) Thermal resistance Parameter I2 Junction to case (AC) TO-220AB insulated Junction to ambient S(1) = 1 cm2 D2PAK TO-220AB / PAK TO-220AB insulated I2 2.3 45 °C/W 60 PAK / D PAK / TO-220AB 2 Value 1.4 Unit °C/W Rth(j-a) 1. Copper surface under tab. 3/12 Characteristics BTA12, BTB12, T12xx Figure 1. P(W) 16 14 12 10 8 6 4 2 0 0 1 2 Maximum power dissipation versus Figure 2. RMS on-state current (full cycle) IT(RMS)(A) 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 8 9 10 11 12 0 RMS on-state current versus case temperature (full cycle) BTB / T12 BTA IT(RMS)(A) 3 4 5 6 7 TC(°C) 25 50 75 100 125 Figure 3. RMS on-state current versus ambient temperature (printed circuit board FR4, copper thickness: 35µm) (full cycle) Figure 4. Relative variation of thermal impedance versus pulse duration IT(RMS)(A) 3.5 3.0 2.5 D2PAK (S=1cm2) K=[Zth/Rth] 1E+0 Zth(j-c) Zth(j-a) 2.0 1E-1 1.5 1.0 0.5 TC(°C) 0.0 0 25 50 75 100 125 1E-2 1E-3 1E-2 1E-1 tp(s) 1E+0 1E+1 1E+2 5E+2 Figure 5. ITM(A) 100 Tj max. Vto = 0.85V Rd = 35 mΩ On-state characteristics (maximum Figure 6. values) ITSM(A) 130 120 110 100 90 80 70 60 50 40 30 20 10 0 3.5 4.0 4.5 5.0 Surge peak on-state current versus number of cycles t=20ms Tj = Tj max. Non repetitive Tj initial=25°C One cycle 10 Tj = 25°C. Repetitive TC=90°C VTM(V) 1 0.5 1.0 1.5 2.0 2.5 3.0 Number of cycles 1 10 100 1000 4/12 BTA12, BTB12, T12xx Characteristics Figure 7. Non-repetitive surge peak on-state Figure 8. current for a sinusoidal pulse with width tp < 10 ms and corresponding value of I2t 2.5 Tj initial=25°C Figure 8: Relative variation of gate trigger current, holding current and latching current versus junction temperature (typical values) ITSM(A), I2t (A2s) 1000 dI/dt limitation: 50A/µs IGT,IH,IL[Tj] / IGT,IH,IL[Tj=25°C] 2.0 ITSM IGT 1.5 100 I2t 1.0 IH & IL 0.5 tp(ms) 10 0.01 0.10 1.00 10.00 0.0 -40 -20 0 20 Tj(°C) 40 60 80 100 120 140 Figure 9. Relative variation of critical rate of decrease of main current versus (dV/dt)c (typical values) (BW/CW/T1210/T1235) Figure 10. Relative variation of critical rate of decrease of main current versus (dV/dt)c (typical values) (TW) (dI/dt)c [(dV/dt)c] / Specified (dI/dt)c 5.0 4.5 (dI/dt)c [(dV/dt)c] / Specified (dI/dt)c 2.8 2.4 2.0 1.6 1.2 0.8 0.4 C B T1235/T1250/CW/BW T1210/SW 4.0 TW 3.5 3.0 2.5 2.0 1.5 1.0 (dV/dt)c (V/µs) 0.0 0.1 1.0 10.0 100.0 0.5 0.0 (dV/dt)c (V/µs) 0.1 1.0 10.0 100.0 Figure 11. Relative variation of critical rate of decrease of main current versus junction temperature (dI/dt)c [Tj] / (dI/dt)c [Tj specified] 6 5 4 Figure 12. D2PAK thermal resistance junction to ambient versus copper surface under tab (printed circuit board FR4, copper thickness: 35 µm) Rth(j-a)(°C/W) 80 70 60 50 3 2 1 40 30 20 10 D2PAK Tj(°C) 0 0 25 50 75 100 125 0 0 4 8 12 16 S(cm²) 20 24 28 32 36 40 5/12 Ordering information scheme BTA12, BTB12, T12xx 2 Ordering information scheme Figure 13. BTA12 and BTB12 series BT A 12 - 600 BW RG Triac series Insulation A = insulated B = non insulated Current 12 = 12A Voltage 600 = 600V 800 = 800V Sensitivity and type B = 50mA Standard C = 25mA Standard SW = 10mA Logic Level Packing mode RG = Tube BW = 50mA Snubberless CW = 35mA Snubberless TW = 5mA Logic Level Figure 14. T12xx series T 12 35 - 600 G (-TR) Triac series Current 12 = 12 A Sensitivity 50 = 50 mA 35 = 35 mA 10 = 10 mA Voltage 600 = 600 V 800 = 800 V Package G = D2PAK R = I2PAK Packing mode Blank = Tube -TR = Tape & Reel 6/12 BTA12, BTB12, T12xx Table 7. Product selector Voltage (xxx) Ordering information scheme Order code(1) BTA/BTB12-xxxBRG BTA/BTB12-xxxBWRG BTA/BTB12-xxxCRG BTA/BTB12-xxxCWRG BTA/BTB12-xxxSWRG BTA/BTB12-xxxTWRG T1210-800G T1235-xxxG T1235-xxxR T1250-600G Sensitivity 600 V X X X X X X X X X 800 V X X X X X X X X X 50 mA 50 mA 25 mA 35 mA 10 mA 5 mA 10 mA 35 mA 35 mA 50 mA Type Standard Snubberless Standard Snubberless Logic Level Logic Level Logic Level Snubberless Snubberless Snubberless Package TO-220AB TO-220AB TO-220AB TO-220AB TO-220AB TO-220AB D2PAK D2PAK I2PAK D2PAK 1. BTB: non insulated TO-220AB package 7/12 Packaging information BTA12, BTB12, T12xx 3 Packaging information ● Epoxy meets UL94, V0 In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Table 8. D2PAK dimensions Dimensions Ref. Millimeters Min. A A E L2 C2 Inches Min. 0.169 0.098 0.001 0.027 0.048 0.055 Typ. Max. 0.181 0.106 0.009 0.037 Typ. Max. 4.60 2.69 0.23 0.93 4.30 2.49 0.03 0.70 1.25 0.45 1.21 8.95 10.00 4.88 15.00 1.27 1.40 0.40 0° 1.40 A1 A2 B D L L3 A1 B2 C C2 0.60 1.36 9.35 0.017 0.047 0.352 0.024 0.054 0.368 0.405 0.208 0.624 0.055 0.069 0.016 B2 B G C R D E 10.28 0.393 5.28 0.192 A2 2mm min. FLAT ZONE G L V2 15.85 0.590 1.40 1.75 0.050 0.055 L2 L3 R V2 8° 0° 8° Figure 15. Footprint (dimensions in mm) 16.90 10.30 1.30 5.08 8.90 3.70 8/12 BTA12, BTB12, T12xx Table 9. I2PAK dimensions Packaging information Dimensions Ref. Millimeters Min. A E L2 c2 V Inches Min. Typ. Max. 0.181 0.106 0.037 0.054 Typ. Max. A A1 b b1 4.30 2.49 0.70 1.20 1.25 0.45 1.21 8.95 2.44 10.00 13.10 3.75 1.27 5° 45° 1.40 4.60 0.169 2.69 0.098 0.93 0.028 1.38 0.047 0.049 0.055 0.60 0.018 1.36 0.048 9.35 0.352 2.64 0.096 10.28 0.394 13.60 0.516 0.148 1.40 0.050 5° 45° D V4 V b2 c c2 D e 0.024 0.054 0.368 0.104 0.405 0.535 L1 b2 L b1 A1 E V4 e b c L L1 L2 V V4 0.055 9/12 Packaging information Table 10. BTA12, BTB12, T12xx TO-220AB dimensions (insulated and non-insulated) Dimensions Ref. Millimeters Min. A a1 B ØI L F A b2 C Inches Min. Typ. Max. 0.625 0.147 Typ. Max. 15.20 3.75 13.00 10.00 0.61 1.23 4.40 0.49 2.40 2.40 6.20 3.75 15.90 0.598 a2 B b1 b2 C 14.00 0.511 10.40 0.393 0.88 0.024 1.32 0.048 4.60 0.173 0.70 0.019 2.72 0.094 2.70 0.094 6.60 0.244 3.85 0.147 0.551 0.409 0.034 0.051 0.181 0.027 0.107 0.106 0.259 0.151 I4 l3 a1 l2 c2 c1 c2 a2 e M F c1 b1 e ØI I4 L l2 l3 M 15.80 16.40 16.80 0.622 0.646 0.661 2.65 1.14 1.14 2.60 2.95 0.104 1.70 0.044 1.70 0.044 0.102 0.116 0.066 0.066 10/12 BTA12, BTB12, T12xx Ordering information 4 Ordering information Table 11. Ordering information Marking BTA/BTB12-xxxyz T1210-xxxG T1235xxxG T1235xxxG T1235-xxxR T1250xxxG I2PAK D 2PAK Order code BTA/BTB12-xxxyzRG T1210-xxxG-TR T1235-xxxG T1235-xxxG-TR T1235-xxxR T1250-xxxG-TR Package TO-220AB D2 PAK Weight 2.3 g 1.5 g 1.5 g Base qty 50 1000 50 1000 Delivery mode Tube Tape and reel Tube Tape and reel Tube Tape and reel D2PAK 1.5 g 1.5 g 50 1000 Note: xxx = voltage, y = sensitivity, z = type 5 Revision history Table 12. Date Sep-2002 25-Mar-2005 27-May-2005 28-Sep-2007 Revision history Revision 6A 7 8 9 Last update. 1. I2PAK package added. 2. TO-220AB delivery mode changed from bulk to tube. T1210 added Reformatted to current standards. T1250 added Changes 11/12 BTA12, BTB12, T12xx Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2007 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 12/12