BTB24-700BRG

BTA24, BTB24, T25 Datasheet 800 V and 600 V, 25 A standard and Snubberless Triacs Features A2 • • • G A1 A2 A2 G A1 A1 TO-220AB A2 G TO-220AB Ins. A2 • • • Applications • D²PAK A2 A1 G High current 25 A RMS current Triac Low thermal resistance High commutation (4 quadrants) or very high commutation (3 quadrants) capability BTA series UL1557 recognized components (file ref: 81734) RoHS (2002/95/EC) compliant packages UL-94, V0 flammability package resin compliance • On/off function in static relays, heating regulation, induction motor starting circuits Phase control operations in light dimmers and motor speed controllers Description Available either in through-hole or surface-mount packages, the BTA24, BTB24 and T25 are suitable for general purpose AC switching. Product status link BTA24 TO-220AB insulated package BTB24 TO-220AB uninsulated package T25 D²PAK package Product summary BTA24 BTB24 T25 IT(RMS) 25 A VDRM/VRRM 600 V and 800 V IGT Snubberless IGT standard 35 / 50 mA 35 mA 50 mA DS2112 - Rev 12 - September 2021 For further information contact your local STMicroelectronics sales office. www.st.com BTA24, BTB24, T25 Characteristics 1 Characteristics Table 1. Absolute maximum ratings Symbol Parameters D2PAK / IT(RMS) RMS on-state current (full sine wave) I2t Unit 25 A Tc = 100 °C TO-220AB TO-220AB Ins. ITSM Value Tc = 75 °C Non repetitive surge peak on-state current (full cycle, Tj initial = 25 °C) f = 60 Hz tp = 16,7 ms 260 f = 50 Hz tp = 20 ms 250 I2t value for fusing tp = 10 ms Critical rate of rise of on-state current A 340 A2s f = 120 Hz Tj = 125 °C 50 A/µs tp = 10 ms Tj = 25 °C VDRM, VRRM + 100 V Tj = 25 °C 600 or 800 V Tj = 125 °C 4 A Tj = 125 °C 1 W Storage junction temperature range -40 to +150 °C Tj Operating junction temperature range -40 to +125 °C TL Maximum lead temperature for soldering during 10 s 260 °C Insulation RMS voltage, 1 minute 2.5 kV dl/dt IG = 2 x IGT , tr ≤ 100 ns VDSM, VRSM Non repetitive surge peak off-state voltage VDRM, VRRM Repetitive peak off-state voltage IGM PG(AV) Tstg VINS tp = 20 µs Peak gate current Average gate power dissipation Table 2. Electrical characteristics (Tj = 25 °C, unless otherwise specified) - Snubberless (3 quadrants) T25, BTA24-XXXXW, BTB24-XXXXW Symbol IGT(1) VGT Parameters VD = 12 V, RL = 33 Ω VGD VD = VDRM, RL = 3.3 kΩ, Tj = 125 °C IH(2) IT = 500 mA IL IG = 1.2 IGT dV/dt(2) (dI/dt)c(2) T25 Quadrant BTA/BTB T2535 CW BW 35 35 50 Unit I - II - III Max. mA I - II - III Max. 1.3 V I - II - III Min. 0.2 V Max. 50 50 75 mA I - III Max. 70 70 80 II Max. 80 80 100 VD = 67 % VDRM gate open, Tj = 125 °C Min. 500 500 1000 V/µs Without snubber Min. 13 13 22 A/ms mA 1. Minimum IGT is guaranteed at 5 % of IGT max. 2. For both polarities of A2 referenced to A1 DS2112 - Rev 12 page 2/14 BTA24, BTB24, T25 Characteristics Table 3. Electrical characteristics (Tj = 25 °C, unless otherwise specified) - standard (4 quadrants) BTB24-800B, BTB24-600B Symbol IGT(1) Parameters Quadrant I - II - III IV VD = 12 V, RL = 33 Ω VGT VGD VD = VDRM, RL = 3.3 kΩ, Tj = 125 °C IH(2) IT = 500 mA IL IG = 1.2 IGT dV/dt(2) (dV/dt)c(2) Value Max. 50 100 Unit mA All Max. 1.3 V All Min. 0.2 V Max. 80 mA I - III - IV Max. 70 II Max. 160 VD = 67 % VDRM gate open, Tj = 125 °C Min. 500 V/µs (dI/dt)c = 13.3 A/ms, Tj = 125 °C Min. 10 V/µs Value Unit mA 1. Minimum IGT is guaranteed at 5 % of IGT max. 2. For both polarities of A2 referenced to A1 Table 4. Static electrical characteristics Symbol Tj Test conditions VTM(1) ITM = 35 A, tp = 380 µs 25 °C Max. 1.55 V VTO(1) threshold on-state voltage 125 °C Max. 0.85 V RD(1) Dynamic resistance 125 °C Max. 16 mΩ 5 µA 3 mA Value Unit IDRM/IRRM 25 °C VT = VDRM, VT = VRRM 125 °C Max. 1. For both polarities of A2 referenced to A1 Table 5. Thermal resistance Symbol Rth(j-c) Rth(j-a) Parameters Junction to case (AC) Junction to ambient, S(1) = 2.5 cm² Junction to ambient D2PAK / TO-220AB TO-220AB insulated D2PAK TO-220AB / TO-220AB insulated Max. Typ. 0.8 1.7 45 °C/W 60 1. S = Copper surface under tab. DS2112 - Rev 12 page 3/14 BTA24, BTB24, T25 Characteristics (curves) 1.1 Characteristics (curves) Figure 1. Maximum power dissipation versus on-state RMS current (full cycle) P(W) Figure 2. RMS on-state current versus case temperature (full cycle) 30 IT(RMS) (A) 30 25 BTB24/T25 25 BTA24 20 20 15 15 10 10 5 5 IT(RMS) (A) TC (°C) 0 0 0 5 10 15 20 25 Figure 3. RMS on-state current versus ambient temperature (full cycle) D²PAK 0 25 50 75 100 125 Figure 4. Relative variation of thermal impedance versus pulse duration IT(RMS) (A) 1.E+00 4.0 K=[Z th /Rth ] 3.5 Zth(j-c) 3.0 1.E-01 2.5 2.0 1.5 Zth(j-a) BTA / BTB / T25 . 1.E-02 1.0 0.5 Ta (°C) 0.0 t p (s) 1.E-03 0 25 50 75 100 125 Figure 5. On-state characteristics (maximum values) 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 Figure 6. Surge peak on-state current versus number of cycles ITM (A) ITSM (A) 1000 300 Tj max. Vto = 0.85V Rd = 16 mΩ 250 100 t=20ms Non repetitive Tj initial=25°C 200 Tj = 150 °C One cycle 150 Repetitive TC= 75 °C Tj = 25°C. 10 100 50 VTM (V) 1 0.5 DS2112 - Rev 12 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 Number of cycles 0 1 10 100 1000 page 4/14 BTA24, BTB24, T25 Characteristics (curves) Figure 7. Non-repetitive surge peak on-state current for a sinusoidal pulse with width tP < 10 ms Figure 8. Relative variation of gate trigger current, holding and latching current versus junction temperature ITSM (A) 2.5 10000 IGT, IH, IL [T j ] / I GT, IH, IL [T j = 25 °C] 2.0 IGT Tj initial=25 °C dI/dt limitation: 50A/µs 1.5 IITSM IH & IL 1000 1.0 0.5 T j (°C) t p (ms) 0.0 100 0.01 0.10 1.00 Figure 9. Relative variation of critical rate of decrease of main current versus (dV/dt)c (typical values) 2.4 -40 10.00 0 20 40 60 80 100 120 Figure 10. Relative variation of critical rate of decrease of main current versus junction temperature (typical values) (dI/dt)c [(dV/dt)c] / specified (dI/dt)c (dI/dt)c [Tj ] / (dI/dt)c [T j = 125 °C] 8 2.2 7 2.0 6 1.8 1.6 5 Snuberless (3 quadrants) T25, BTA24-XXXXW, BTB24-XXXXW 1.4 4 1.2 1.0 -20 3 Standard (4 quadrants) BTA24/BTB24-XXXB 0.8 2 0.6 0.4 1 0.2 0.0 0.1 (dV/dt) (V/µs) 1.0 Tj (°C) 0 100.0 10.0 0 25 50 75 100 125 Figure 11. D²PAK thermal resistance junction to ambient versus copper surface under tab Rth(j-a) (°C/W) 60 D²PAK 50 40 30 20 10 SCu (cm²) 0 0 DS2112 - Rev 12 5 10 15 20 25 30 35 40 page 5/14 BTA24, BTB24, T25 Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 2.1 TO-220AB package information • • • Molding compound resin is halogen free and meets UL94 flammability standard, level V0 Lead-free plating package leads Recommended torque: 0.4 to 0.6 N·m Figure 12. TO-220AB package outline DS2112 - Rev 12 page 6/14 BTA24, BTB24, T25 TO-220AB package information Table 6. TO-220AB package mechanical data Dimensions Min. A Inches(1) Millimeters Ref. Typ. 15.20 a1 Max. Min. 15.90 0.5984 3.75 Typ. Max. 0.6260 0.1476 a2 13.00 14.00 0.5118 0.5512 B 10.00 10.40 0.3937 0.4094 b1 0.61 0.88 0.0240 0.0346 b2 1.23 1.32 0.0484 0.0520 C 4.40 4.60 0.1732 0.1811 c1 0.49 0.70 0.0193 0.0276 c2 2.40 2.72 0.0945 0.1071 e 2.40 2.70 0.0945 0.1063 F 6.20 6.60 0.2441 0.2598 I 3.73 3.88 0.1469 0.1528 L 2.65 2.95 0.1043 0.1161 I2 1.14 1.70 0.0449 0.0669 I3 1.14 1.70 0.0449 0.0669 I4 15.80 16.80 0.6220 M 16.40 2.6 0.6457 0.6614 0.1024 1. Inch dimensions are for reference only. DS2112 - Rev 12 page 7/14 BTA24, BTB24, T25 D²PAK package information 2.2 D²PAK package information • • • ECOPACK2 compliant Lead-free package leads finishing Molding compound resin is halogen-free and meets UL94 flammability standard level V0 Figure 13. D²PAK package outline A E E1 E2 H D D1 L2 c2 2 3 D2 L3 1 b2 b e Max resin gate protrusion: 0.5 mm (1) G A1 A2 A3 L R Gauge Plane V2 c (1) Resin gate is accepted in each of position shown on the drawing, or their symmetrical. DS2112 - Rev 12 page 8/14 BTA24, BTB24, T25 D²PAK package information Table 7. D²PAK package mechanical data Dimensions Inches(1) Millimeters Ref. Min. Typ. Max. Min. Typ. Max. A 4.30 4.60 0.1693 0.1811 A1 2.49 2.69 0.0980 0.1059 A2 0.03 0.23 0.0012 0.0091 A3 0.25 0.0098 b 0.70 0.93 0.0276 0.0366 b2 1.25 1.7 0.0492 0.0669 c 0.45 0.60 0.0177 0.0236 c2 1.21 1.36 0.0476 0.0535 D 8.95 9.35 0.3524 0.3681 D1 7.50 8.00 0.2953 0.3150 D2 1.30 1.70 0.0512 0.0669 e 2.54 E 10.00 10.28 0.3937 0.4047 E1 8.30 8.70 0.3268 0.3425 E2 6.85 7.25 0.2697 0.2854 G 4.88 5.28 0.1921 0.2079 H 15 15.85 0.5906 0.6240 L 1.78 2.28 0.0701 0.0898 L2 1.19 1.40 0.0468 0.0551 L3 1.40 1.75 0.0551 0.0689 R V2(2) 0.10000 0.40 0° 0.0157 8° 0° 8° 1. Dimensions in inches are given for reference only 2. Degrees DS2112 - Rev 12 page 9/14 BTA24, BTB24, T25 D²PAK package information Figure 14. D²PAK recommended footprint (dimensions are in mm) 16.90 10.30 5.08 1.30 8.90 3.70 Figure 15. D²PAK stencil definitions (dimensions are in mm) DS2112 - Rev 12 page 10/14 BTA24, BTB24, T25 Ordering information 3 Ordering information Figure 16. Ordering information scheme (BTA24 and BTB24 series) BT A 24 - 600 BW RG Triac Insulation A = Insulated B = Non-insulated Current 24 = 25 A Voltage 600 = 600 V 800 = 800 V Sensitivity and type B = 50 mA Standard BW = 50 mA Snubberless CW = 35 mA Snubberless Packing mode RG = Tube Figure 17. Ordering information scheme (T25 series) T 25 35 - 800 G (-TR) Triac Current 25 = 25 A Sensitivity 35 = 35 mA Voltage 800 V 600 V Package G = D²PAK Packing mode (blank) = Tube -TR = Tape and reel DS2112 - Rev 12 page 11/14 BTA24, BTB24, T25 Ordering information Table 8. Ordering information DS2112 - Rev 12 Order code Marking BTA24-600BWRG BTA24 600BW BTA24-600CWRG BTA24 600CW BTA24-800BWRG BTA24 800BW BTA24-800CWRG BTA24 800CW BTB24-600BRG BTB24 600B BTB24-600BWRG BTB24 600BW BTB24-600CWRG BTB24 600CW BTB24-800BRG BTB24 800B BTB24-800BWRG BTB24 800BW BTB24-800CWRG BTB24 800CW T2535-600G T2535 600G T2535-600G-TR T2535 600G T2535-800G T2535 800G T2535-800G-TR T2535 800G Package Weig ht Base qty. Delivery mode 2.3 g 50 Tube 50 Tube 2500 Tape and reel 50 Tube 2500 Tape and reel TO-220AB insulated TO-220AB D²PAK 1.5 g page 12/14 BTA24, BTB24, T25 Revision history Table 9. Document revision history Date Revision Oct-2002 6A 13-Feb-2006 7 31-May-2006 8 Reformatted to current standard. Tc in figure 3 changed to Tamb 31-Jul-2006 9 Typing error corrected on page 1 (BTB124 instead of BTB24) 05-Jul-2007 10 28-Jul-2021 11 Changes Previous update. TO-220AB delivery mode changed from bulk to tube. ECOPACK statement added. Added BTB26-600BRG. Restructured cover page and section 2: Ordering information scheme on page 6 to simplify product selection. Thermal resistance values updated in Table 6 and Figure 2. Graphic for I2t updated in Figure 7. Removed RD91, TOP3 insulated and TOP3 package information. Put in separate specification. Minor text changes. 29-Sep-2021 DS2112 - Rev 12 12 Updated Table 2. page 13/14 BTA24, BTB24, T25 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2021 STMicroelectronics – All rights reserved DS2112 - Rev 12 page 14/14