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BUL804

BUL804

  • 厂商:

    STMICROELECTRONICS(意法半导体)

  • 封装:

    SOT78

  • 描述:

    TRANS NPN 450V 4A TO-220

  • 数据手册
  • 价格&库存
BUL804 数据手册
BUL804 High voltage fast-switching NPN Power Transistor General features ■ ■ ■ ■ ■ ■ NPN Transistor High voltage capability Low spread of dynamic parameters Minimum lot-to-lot spread for reliable operation Very high switching speed In compliance with the 2002/93/EC European Directive TO-220 1 2 3 Description The device is manufactured using high voltage Multi-Epitaxial Planar technology for high switching speeds and medium voltage capability. It uses a Cellular Emitter structure with planar edge termination to enhance switching speeds while maintaining the wide RBSOA. The device is designed for use as PFC in high frequency ballast half Bridge voltage fed topology. Internal schematic diagram Applications ■ ■ Electronic ballast for fluorescent lighting Dedicated for PFC solution in half-bridge voltage fed topology. Order codes Part Number BUL804 Marking BUL804 Package TO-220 Packing Tube May 2006 Rev 2 1/10 www.st.com 10 BUL804 Contents 1 2 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.1 2.2 Electrical characteristics (curves) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Test circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 3 4 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2/10 BUL804 Electrical ratings 1 Electrical ratings Table 1. Symbol VCES VCEO VEBO IC ICM IB IBM Ptot Tstg TJ Absolute maximum rating Parameter Collector-emitter voltage (V BE = 0) Collector-emitter voltage (IB = 0) Emitter-base voltage (IC = 0) Collector current Collector peak current (tP < 5ms) Base current Base peak current (tP < 5ms) Total dissipation at T c = 25°C Storage temperature Max. operating junction temperature Value 800 450 8 4 8 2 4 70 -65 to 150 150 Unit V V V A A A A W °C °C Table 2. Symbol Rthj-case Rthj-amb Thermal data Parameter Thermal resistance junction-case Thermal resistance junction-amb __max __max Value 1.78 62.5 Unit °C/W °C/W 3/10 Electrical characteristics BUL804 2 Electrical characteristics (Tcase = 25°C unless otherwise specified) Table 3. Symbol ICES ICEO VEBO Electrical characteristics Parameter Collector cut-off current (VBE =-1.5V) Collector cut-off current (IB =0) Emitter-base voltage (IC = 0) Test Conditions VCE =800V VCE =800V VCE =450V IE =10mA 8 Min. Typ. Max. 100 500 250 Unit µA µA µA V Tj =125°C Collector-emitter VCEO(sus) (1) sustaining voltage (IB = 0) VCE(sat) (1) Collector-emitter saturation voltage Base-emitter saturation voltage DC current gain Resistive load Storage time Fall time Inductive load Storage time Fall time IC =100mA IC =1A IC =2.5A IC =1A IC =2.5A IC =10mA IC =2A VCC =300V IB1 = -IB2 =0.4A tp = 30µs IC =2A VBE(off) =-5V L =25mH IB =0.2A IB =0.5A IB =0.2A IB =0.5A V CE =5V V CE =5V IC =2A 450 0.8 1.2 1.2 1.3 10 10 20 V V V V V VBE(sat) (1) hFE ts tf ts tf 1.8 0.1 2.6 0.25 µs µs (see fig.8 ) IB1 =0.4A R BB =0Ω 0.6 0.1 1 0.2 µs µs Vclamp=360V (see fig.9) Note (1) Pulsed duration = 300µs, duty cycle ≤1.5% 4/10 BUL804 Electrical characteristics 2.1 Electrical characteristics (curves) Figure 1. DC current gain Figure 2. DC current gain Figure 3. Collector-emitter saturation voltage Figure 4. Base-emitter saturation voltage Figure 5. Inductive load switching time Figure 6. Resistive load switching time 5/10 Electrical characteristics Figure 7. Reverse biased safe operating area BUL804 2.2 Test circuits Figure 8. Resistive load switching test circuit 1) Fast electronic switch 2) Non-inductive resistor Figure 9. Inductive load switching test circuit 1) Fast electronic switch 2) Non-inductive resistor 3) Fast recovery rectifier 6/10 BUL804 Package mechanical data 3 Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com 7/10 Package mechanical data BUL804 TO-220 MECHANICAL DATA DIM. A b b1 c D E e e1 F H1 J1 L L1 L20 L30 mm. MIN. 4.40 0.61 1.15 0.49 15.25 10 2.40 4.95 1.23 6.20 2.40 13 3.50 16.40 28.90 3.75 2.65 3.85 2.95 0.147 0.104 TYP MAX. 4.60 0.88 1.70 0.70 15.75 10.40 2.70 5.15 1.32 6.60 2.72 14 3.93 MIN. 0.173 0.024 0.045 0.019 0.60 0.393 0.094 0.194 0.048 0.244 0.094 0.511 0.137 0.645 1.137 0.151 0.116 inch TYP. MAX. 0.181 0.034 0.066 0.027 0.620 0.409 0.106 0.202 0.052 0.256 0.107 0.551 0.154 øP Q 8/10 BUL804 Revision history 4 Revision history Table 4. Date 01-July-2005 17-May-2006 Revision history Revision 1 2 Initial release. New template. Changes 9/10 BUL804 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZE REPRESENTATIVE OF ST, ST PRODUCTS ARE NOT DESIGNED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS, WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2006 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 10/10
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