®
BYV54V BYV541V
HIGH EFFICIENCY FAST RECOVERY RECTIFIER DIODES
FEATURES
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SUITED FOR SMPS VERY LOW FORWARD LOSSES NEGLIGIBLE SWITCHING LOSSES HIGH SURGE CURRENT CAPABILITY HIGH AVALANCHE ENERGY CAPABILITY INSULATED : Insulating voltage = 2500 VRMS Capacitance = 45 pF
K2
A2
A2
K1
K1
A1
K2
A1
BYV541V-200
BYV54V-200
DESCRIPTION Dual rectifier suited for switchmode power supply and high frequency DC to DC converters. Packaged in ISOTOPTM this device is intended for use in low voltage, high frequency inverters, free wheeling and polarity protection applications.
ISOTOP (Plastic)
ABSOLUTE MAXIMUM RATINGS Symbol IF(RMS) IF(AV) IFSM Tstg Tj RMS forward current Average forward current δ = 0.5 Surge non repetitive forward current Storage and junction temperature range Tc=90° C Parameter Per diode Per diode Value 100 50 1000 - 40 to + 150 - 40 to + 150 Unit A A A °C °C
tp=10ms Per diode sinusoidal
Symbol VRRM
Parameter Repetitive peak reverse voltage
BYV54V / BYV541V 200
Unit V
ISOTOP is a trademark of STMicroelectronics.
May 2000 - Ed : 2E
1/5
BYV54V / BYV541V
THERMAL RESISTANCE Symbol Rth (j-c) Junction to case Parameter Per diode Total Rth (c) Coupling Value 1.2 0.85 0.1 °C/W Unit °C/W
When the diodes 1 and 2 are used simultaneously : Tj-Tc (diode 1) = P(diode 1) x Rth(j-c)(Per diode) + P(diode 2) x Rth(c)
ELECTRICAL CHARACTERISTICS (Per diode) STATIC CHARACTERISTICS Symbol IR * Tj = 25°C Tj = 100° C VF ** Tj = 125° C Tj = 125° C Tj = 25°C IF = 50 A IF = 100 A IF = 100 A Test Conditions VR = VRRM Min. Typ. Max. 50 5 0.85 1.00 1.15 Unit µA mA V
Pulse test : * tp = 5 ms, duty cycle < 2 % ** tp = 380 µs, duty cycle < 2 %
RECOVERY CHARACTERISTICS Symbol trr Tj = 25°C Test Conditions IF = 0.5A IR = 1A IF = 1A VR = 30V tfr Tj = 25°C IF = 1A VFR = 1.1 x VF IF = 1A Irr = 0.25A Min. Typ. Max. 40 Unit ns
dIF/dt = -50A/µs
60
tr = 5 ns
10
ns
VFP
Tj = 25°C
tr = 5 ns
1.5
V
2/5
BYV54V / BYV541V
Fig.1 : Average forward power dissipation versus average forward current.
P F(av)(W)
=0.1 =0.05 =0.2 =0.5 =1
Fig.2 : Peak current versus form factor.
45 40 35 30 25 20 15 10 5
1000 800 600
T
IM(A)
T
P=30W
I M
=tp/T tp
P=15W P=45W
400 200
P=60W
I F(av)(A)
=tp/T
tp
0 0
5
10
15
20
25
30
35
40
45
50
0 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
Fig.3 : Forward voltage drop versus forward current (maximum values).
VFM(V)
Fig.4 : Relative variation of thermal impedance junction to case versus pulse duration.
1.0
K
Zth(j-c) (tp. ) K= Rth(j-c)
=0 . 5 =0 . 2 =0 . 1
1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0
1 10
IFM(A)
Tj=125 oC
0.5
T
0.2
Single pulse
100
500
0.1
1.0E-03 1.0E-02
tp(s)
1.0E-01
=t p/T
tp
1. 0E+0 0
Fig.5 : Non repetitive surge peak forward current versus overload duration.
IM(A)
Fig.6 : Average current versus temperature. (duty cycle : 0.5)
IF(av)(A)
ambient
400
60 50
Rth(j-a)=Rth(j-c)
300
40
Tc=25 oC Tc=50 o C
200
30
=0.5
20 10
=tp/T
T
100
IM t
Tc=90 o C
=0.5
t(s) 0.01 0.1 1
0 0
tp
Tamb(o C)
0 0.001
20
40
60
80
100
120
140
160
3/5
BYV54V / BYV541V
Fig.7 : Junction capacitance versus reverse voltage applied (Typical values). Fig.8 : Recovery charges versus dIF/dt.
420 400 380 360 340 320 300 280 260
C(pF)
F=1Mhz Tj=25 oC
VR(V)
10 100 20 0
240 1
1 20 110 90%CONFIDENCE 1 00 IF=IF(av) Tj=100 OC 90 80 70 60 Tj=25 O C 50 40 30 20 10 dIF/dt(A/us) 0 1 10
QRR(nC)
1 00
Fig.9 : Peak reverse current versus dIF/dt.
Fig.10 : Dynamic parameters versus junction temperature.
QRR;IRM[Tj]/QRR;IRM[Tj=125oC]
4.0 3.6 90%CONFIDENCE IF=IF(av) 3.2 2.8 2.4 2.0 1.6 1.2 0.8 0.4 0.0 20 1
IRM(A)
1.50
Tj=100 O C
1.25 1.00
IRM
0.75
QRR
0.50
Tj=25 O C
0.25
dIF/dt(A/us)
10 100
Tj( oC)
0.00 0
25
50
75
100
125
150
4/5
BYV54V / BYV541V
PACKAGE MECHANICAL DATA ISOTOP DIMENSIONS REF. A A1 B C C2 D D1 E E1 E2 G G1 G2 F F1 P P1 S Marking : Type number Cooling method : C Weight : 27 g Epoxy meets UL94, V0 Millimeters Min. Max. 11.80 12.20 8.90 9.10 7.8 8.20 0.75 0.85 1.95 2.05 37.80 38.20 31.50 31.70 25.15 25.50 23.85 24.15 24.80 typ. 14.90 15.10 12.60 12.80 3.50 4.30 4.10 4.30 4.60 5.00 4.00 4.30 4.00 4.40 30.10 30.30 Inches Min. Max. 0.465 0.480 0.350 0.358 0.307 0.323 0.030 0.033 0.077 0.081 1.488 1.504 1.240 1.248 0.990 1.004 0.939 0.951 0.976 typ. 0.587 0.594 0.496 0.504 0.138 0.169 0.161 0.169 0.181 0.197 0.157 0.69 0.157 0.173 1.185 1.193
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Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics © 2000 STMicroelectronics - Printed in Italy - All rights reserved. STMicroelectronics GROUP OF COMPANIES Australia - Brazil - China - Finland - France - Germany - Hong Kong - India - Italy - Japan - Malaysia Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - U.S.A. http://www.st.com 5/5
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