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BZW04-48B

BZW04-48B

  • 厂商:

    STMICROELECTRONICS(意法半导体)

  • 封装:

    DO-15

  • 描述:

    TVS DIODE 47.8VWM 100VC DO15

  • 数据手册
  • 价格&库存
BZW04-48B 数据手册
BZW04-xx, BZW04-xxB Datasheet 400 W TVS in DO-15 Features A • • • • Peak pulse power: – 400 W (10/1000 μs) – up to 2.3 kW (8/20 μs) Stand-off voltage range from 5.8 V to 376 V Unidirectional and bidirectional types Operating Tj max: 175 °C • High power capability at Tj max.: up to 230 W (10/1000 µs) • Lead finishing: matte tin plating K DO-15 (JEDEC DO-204AC) K Complies with the following standards A Bidirectional Unidirectional Product status link BZW04-5V8, BZW04-28, BZW04-48, BZW04-58, BZW04-299, BZW04-376. BZW04-5V8B, BZW04-28B, BZW04-48B, BZW04-58B, BZW04-299B, BZW04-376B. • • • • • • • UL94, V0 J-STD-020 MSL level 1 J-STD-002, JESD 22-B102 E3 and MIL-STD-750, method 2026 JESD-201 class 2 whisker test UL 497B file number: QVGQ2.E136224 IEC 61000-4-4 level 4: – 4kV IEC 61000-4-2, C = 150 pF, R = 330 Ω exceeds level 4: – 30 kV (air discharge) – 30 kV (contact discharge) Description The BZW04 TVS series is designed to protect sensitive equipment against electrostatic discharges according to IEC 61000-4-2, MIL STD 883 Method 3015, and electrical overstress such as IEC 61000-4-4 and 5. They are used for surges below 400 W 10/1000 μs. This planar technology makes it compatible with high-end equipment and SMPS where low leakage current and high junction temperature are required to provide reliability and stability over time. DS0660 - Rev 4 - March 2023 For further information contact your local STMicroelectronics sales office. www.st.com BZW04-xx, BZW04-xxB Characteristics 1 Characteristics Table 1. Absolute maximum ratings (Tamb = 25 °C) Symbol Parameter Value Unit Contact discharge 30 kV Air discharge 30 IEC 61000-4-2 (C = 150 pF, R = 330 Ω) VPP Peak pulse voltage PPP Peak pulse power dissipation 10/1000 µs, Tj initial = Tamb 400 W IFSM Non repetitive surge peak forward current for unidirectional types tp = 10 ms, Tj initial = Tamb 30 A Tstg Storage temperature range -65 to +175 °C Tj Operating junction temperature range -55 to +175 °C TL Maximum lead temperature for soldering during 10 s at 5 mm from case 260 °C Figure 1. Electrical characteristics - parameter definitions Figure 2. Pulse definition for electrical characteristics DS0660 - Rev 4 page 2/12 BZW04-xx, BZW04-xxB Characteristics Table 2. Electrical characteristics - parameter values (Tamb = 25 °C, unless otherwise specified) Type IRM max at VRM VBR at IBR (1) 25 °C Min. 10 / 1000 µs VCL(2)(3) 8 / 20µs IPP(4) Max. RD VCL(2)(3) Max. Max. IPP(4) αT C Max. Max. Typ. pF RD µA V V mA V A Ω V A Ω 10-4/°C BZW04-5V8/B 1000 5.8 6.45 10 10.5 38.0 0.088 13.4 174 0.036 5.7 3500 BZW04-28/B 1 28.2 31.4 1 45.7 8.8 1.24 59.0 39 0.621 9.8 510 BZW04-48/B 1 47.8 53.2 1 77.0 5.2 3.50 100 23 1.79 10.3 320 BZW04-58/B 1 58.1 64.6 1 92.0 4.3 4.79 121 19 2.61 10.4 270 BZW04-299/B 1 273 304 1 438 1.2 85.0 564 4.0 57.0 11.0 85 BZW04-376/B 1 376 418 1 603 0.8 176 776 3.0 105 11.0 70 1. To calculate VBR versus Tj : VBR at Tj = VBR at 25 °C x (1 + αT x (Tj - 25)) 2. To calculate VCL versus Tj : VCL at Tj = VCL at 25 °C x (1 + αT x (Tj - 25)) 3. To calculate VCL max versus IPPappli: VCL max = VCL - RD x (IPP - IPPappli) where IPPappli is the surge current in the application. 4. Surge capability given for both directions for unidirectional and bidirectional devices DS0660 - Rev 4 page 3/12 BZW04-xx, BZW04-xxB Characteristics (curves) 1.1 Characteristics (curves) Figure 3. Maximum peak power dissipation versus initial junction temperature PPP (W) 500 Figure 4. Maximum peak pulse power versus exponential pulse duration 10 PPP (kW) Tj initial = 25 °C 10/1000 µs 400 300 1 200 100 Tj (°C) 0 0 25 50 75 100 125 150 175 200 Figure 5. Maximum peak pulse current versus clamping voltage 1000 IPP (A) tp(ms) 0.1 0.001 0.01 0.1 1 10 Figure 6. Dynamic resistance versus pulse duration 1000 RD(Ω) 8/20 µs 10/1000 µs 100 100 BZW04-376/376B 10 10 BZW04-58/58B 1 BZW04-376/376B BZW04-58/58B BZW04-28/28B BZW04-5V8/5V8B 1 0.1 1 10 VCL (V) 100 1000 Figure 7. Junction capacitance versus reverse applied voltage (unidirectional type) 10000 BZW04-28/28B 0.1 C(pF) BZW04-5V8/5V8B 0.01 0.01 tp (ms) 0.1 1 Figure 8. Junction capacitance versus applied voltage (bidirectional type) 10000 C(pF) f=1MHz Vosc=30mVRMS Tj=25°C f=1MHz Vosc=30mVRMS Tj=25°C BZW04-5V8 10 1000 1000 BZW04-5V8B BZW04-28 100 100 BZW04-28B BZW04-58 BZW04-56B 10 10 BZW04-376B BZW04-376 VR (V) 1 1 DS0660 - Rev 4 10 100 VR (V) 1 1000 1 10 100 1000 page 4/12 BZW04-xx, BZW04-xxB Characteristics (curves) Figure 9. Leakage current versus junction temperature 10000 Figure 10. Peak forward voltage drop versus peak forward current IR (nA) IF (A) 100 VR=VRM VRM < 10V 1000 Single pulse For products with VRM > 188 V, VF is multiplied by 2 10 Tj = 125 °C 100 VRM ≥ 10V Tj = 25 °C 1 10 Tj (°C) 1 25 50 75 100 125 150 175 Figure 11. Thermal impedance junction to ambient versus pulse duration 100 Zth(j-a) (°C/W) 0 0.5 1 1.5 2 2.5 3 3.5 Figure 12. Thermal resistance junction to ambient versus copper area under each lead 80 Single pulse Epoxy printed circuit board FR4, 70 µm Cu thickness VF (V) 0.1 Rth(j-a) (°C/W) Single pulse. Epoxy printed circuit board FR4, 70 µm Cu thickness 70 60 10 50 40 30 1 20 0.1 0.01 DS0660 - Rev 4 tp (s) 0.1 1 10 100 1000 10 0 S Cu(cm²) 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 page 5/12 BZW04-xx, BZW04-xxB Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 2.1 DO-15 package information Figure 13. DO-15 package outline B ØC A B ØD Table 3. DO-15 package mechanical data Dimensions Millimeters Ref. DS0660 - Rev 4 Inches (for reference only) Min. Typ. Max. Min. Typ. Max. A 6.05 6.40 6.75 0.238 0.252 0.266 B 26.00 28.5 31.00 1.023 1.122 1.221 C 2.95 3.24 3.53 0.116 0.128 0.139 D 0.71 0.80 0.88 0.027 0.031 0.035 page 6/12 BZW04-xx, BZW04-xxB DO-15 package information Figure 14. Marking layout Figure 15. Tape and reel orientation Figure 16. Reel dimension values (mm) Figure 17. Inner box dimension values (mm) Figure 18. Ammopack dimension values (mm) DS0660 - Rev 4 page 7/12 BZW04-xx, BZW04-xxB DO-15 package information Figure 19. Tape outline C B A Dimensions are not to scale Unidirectional components are oriented with red tape on the cathode and white tape on the anode. Bidirectional components have red tape on both sides. Table 4. Tape dimension values Dimensions Millimeters Ref. DS0660 - Rev 4 Min. Typ. Max. A 4.5 5 5.5 B 51 53 55 C 62 65 68 page 8/12 BZW04-xx, BZW04-xxB Reflow profile 2.2 Reflow profile Figure 20. ST ECOPACK recommended soldering reflow profile for PCB mounting 250 240-245 °C Temperature (°C) -2 °C/s 2 - 3 °C/s 60 sec (90 max) 200 -3 °C/s 150 -6 °C/s 100 0.9 °C/s 50 Time (s) 0 Note: 60 90 120 150 180 210 240 270 300 Minimize air convection currents in the reflow oven to avoid component movement. Maximum soldering profile corresponds to the latest IPC/JEDEC J-STD-020. For wave soldering profile refer to AN5088 chapter 1.5. • DS0660 - Rev 4 30 AN5088: Rectifiers thermal management, handling and mounting recommendations. page 9/12 BZW04-xx, BZW04-xxB Ordering information 3 Ordering information Table 5. Ordering information Order code Marking BZW04-xxRL/BZW04-xxBRL(1) Equal to order code (without RL suffix) BZW04-xx / BZW04-xxB Equal to order code Package Weight DO-15 0.4 g Base qty. Delivery mode 6000 Reel 1000 Ammopack 1. Where xx corresponds to VRM and blank or B indicates unidirectional or bidirectional version. DS0660 - Rev 4 page 10/12 BZW04-xx, BZW04-xxB Revision history Table 6. Document revision history DS0660 - Rev 4 Date Revision Changes 24-Jul-2012 3 Last update. 27-Mar-2023 4 Updated package information. Minor text changes. page 11/12 BZW04-xx, BZW04-xxB IMPORTANT NOTICE – READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgment. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. For additional information about ST trademarks, refer to www.st.com/trademarks. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2023 STMicroelectronics – All rights reserved DS0660 - Rev 4 page 12/12
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