BZW06-5V8RL

BZW06-xx, BZW06-xxB Datasheet 600 W TVS in DO-15 Features A • • • • Peak pulse power: – 600 W (10/1000 μs) – up to 4 kW (8/20 μs) Stand-off voltage range from 5.8 V to 376 V Unidirectional and bidirectional types Operating Tj max: 175 °C • High power capability at Tj max.: up to 420 W (10/1000 µs) • Lead finishing: matte tin plating K DO-15 (JEDEC DO-204AC) K Complies with the following standards A Bidirectional Unidirectional Product status link BZW06-5V8, BZW06-15, BZW06-28, BZW06-31, BZW06-33, BZW06-58, BZW06-342, BZW06-376. BZW06-5V8B, BZW06-15B, BZW06-28B, BZW06-31B, BZW06-33B, BZW06-58B, BZW06-342B, BZW06-376B. • • • • • • • UL94, V0 J-STD-020 MSL level 1 J-STD-002, JESD 22-B102 E3 and MIL-STD-750, method 2026 JESD-201 class 2 whisker test UL 497B file number: QVGQ2.E136224 IEC 61000-4-4 level 4: – 4kV IEC 61000-4-2, C = 150 pF, R = 330 Ω exceeds level 4: – 30 kV (air discharge) – 30 kV (contact discharge) Description The BZW06 TVS series is designed to protect sensitive equipment against electrostatic discharges according to IEC 61000-4-2, MIL STD 883 Method 3015, and electrical overstress such as IEC 61000-4-4 and 5. They are used for surges below 600 W 10/1000 μs. This planar technology makes it compatible with high-end equipment and SMPS where low leakage current and high junction temperature are required to provide reliability and stability over time. DS0661 - Rev 6 - April 2023 For further information contact your local STMicroelectronics sales office. www.st.com BZW06-xx, BZW06-xxB Characteristics 1 Characteristics Table 1. Absolute maximum ratings (Tamb = 25 °C) Symbol Parameter Value Unit Contact discharge 30 kV Air discharge 30 IEC 61000-4-2 (C = 150 pF, R = 330 Ω) VPP Peak pulse voltage PPP Peak pulse power dissipation 10/1000 µs, Tj initial = Tamb 600 W IFSM Non repetitive surge peak forward current for unidirectional types tp = 10 ms, Tj initial = Tamb 100 A Tstg Storage temperature range -65 to +175 °C Tj Operating junction temperature range -55 to +175 °C TL Maximum lead temperature for soldering during 10 s at 5 mm from case 260 °C Figure 1. Electrical characteristics - parameter definitions Figure 2. Pulse definition for electrical characteristics DS0661 - Rev 6 page 2/12 BZW06-xx, BZW06-xxB Characteristics Table 2. Electrical characteristics - parameter values (Tamb = 25 °C, unless otherwise specified) Type 25 °C 10 / 1000 µs VBR at IBR (1) IRM max at VRM Min. Typ. VCL(2)(3) Max. IPP(4) Max. 8 / 20µs RD VCL(2)(3) Max. Max. IPP(4) RD αT Max. Max. mA V A Ω V A Ω 10-4/°C 7.14 10 10.5 57.0 0.059 13.4 298 0.021 5.7 18 18.9 1 25.2 24.0 0.263 32.5 123 0.111 8.9 31.4 33.1 34.8 1 45.7 13.1 0.835 59 68 0.357 9.8 31 34.2 36 37.8 1 49.9 12.0 1.01 64.3 62 0.427 9.9 0.2 33 37.1 39.1 41.1 1 53.9 11.1 1.16 69.7 57 0.503 10 BZW06-58/B 0.2 58 64.6 68 71.4 1 92.0 6.5 3.17 121 33 1.50 10.4 BZW06-342/B 0.2 342 380 400 420 1 548 1.1 116 706 6 50.2 11 BZW06-376/B 0.2 376 418 440 462 1 603 1 141 776 5.7 55.1 11 µA V V BZW06-5V8/B 20 5.8 6.45 6.8 BZW06-15/B 0.2 15 17.1 BZW06-28/B 0.2 28 BZW06-31/B 0.2 BZW06-33/B 1. To calculate VBR versus Tj : VBR at Tj = VBR at 25 °C x (1 + αT x (Tj - 25)) 2. To calculate VCL versus Tj : VCL at Tj = VCL at 25 °C x (1 + αT x (Tj - 25)) 3. To calculate VCL max versus IPPappli: VCL max = VBR max. + RD x IPPappli 4. Surge capability given for both directions for unidirectional and bidirectional devices DS0661 - Rev 6 page 3/12 BZW06-xx, BZW06-xxB Characteristics (curves) 1.1 Characteristics (curves) Figure 3. Maximum peak power dissipation versus initial junction temperature 800 PPP (W) Figure 4. Maximum peak pulse power versus exponential pulse duration PPP (W) 100000 Tj initial = 25 °C 10/1000 µs 600 10000 400 1000 200 100 Tj (°C) 0 0 25 50 75 100 125 150 175 200 Figure 5. Maximum peak pulse current versus clamping voltage 1000 IPP (A) tp (ms) 10 0.001 0.1 0.01 1 10 Figure 6. Dynamic resistance versus pulse duration 1000 RD (Ω) 8/20 µs 10/1000 µs 100 100 BZW06-376/376B 10 10 1 BZW06-376/376B BZW06-33/33B 0.1 BZW06-15/15B BZW06-5V8/5V8B 1 BZW06-33/33B BZW06-5V8/5V8B V CL (V) 10 1 100 0.01 0.01 tp (ms) 0.1 1 Figure 8. Junction capacitance versus applied voltage (bidirectional type) C(pF) 10000 C(pF) f = 1MHz VOSC = 30 mVRMS Tj = 25 °C f = 1MHz VOSC = 30 mVRMS Tj = 25 °C BZW06-5V8 10 1000 Figure 7. Junction capacitance versus reverse applied voltage (unidirectional type) 10000 BZW06-15/15B 0.1 1000 1000 BZW06-5V8B BZW06 -15 BZW06-15B BZW06 -33 100 BZW06-33B 100 BZW06 -376 BZW06-376B 10 10 VR(V) 1 1 DS0661 - Rev 6 10 100 VR(V) 1000 1 1 10 100 1000 page 4/12 BZW06-xx, BZW06-xxB Characteristics (curves) Figure 9. Leakage current versus junction temperature Figure 10. Peak forward voltage drop versus peak forward current IR (nA) 10000 IF (A) 100 VR = V RM Single pulse, for products with VRM > 188 V, VF is multiplied by 2 VRM < 10V 1000 10 Tj=125 °C 100 VRM ≥ 10V Tj=25 °C 1 10 Tj (°C) 1 25 50 75 100 125 150 175 VF(V) 0.1 0 Figure 11. Thermal impedance junction to ambient versus pulse duration Zth(j-a) (°C/W) 100 1 1.5 2 2.5 3 Figure 12. Thermal resistance junction to ambient versus copper area under each lead 80 Single pulse Epoxy printed circuit board FR4, 70 µm Cu thickness 0.5 Rth(j-a) (°C/W) Single pulse Epoxy printed circuit board FR4, 70 µm Cu thickness 70 60 10 50 40 30 1 20 10 tp (s) 0.1 0.01 DS0661 - Rev 6 0.1 1 10 100 1000 SCu (cm²) 0 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 page 5/12 BZW06-xx, BZW06-xxB Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 2.1 DO-15 package information Figure 13. DO-15 package outline B ØC A B ØD Table 3. DO-15 package mechanical data Dimensions Millimeters Ref. DS0661 - Rev 6 Inches (for reference only) Min. Typ. Max. Min. Typ. Max. A 6.05 6.40 6.75 0.238 0.252 0.266 B 26.00 28.5 31.00 1.023 1.122 1.221 C 2.95 3.24 3.53 0.116 0.128 0.139 D 0.71 0.80 0.88 0.027 0.031 0.035 page 6/12 BZW06-xx, BZW06-xxB DO-15 package information Figure 14. Marking layout Figure 15. Tape and reel orientation Figure 16. Reel dimension values (mm) Figure 17. Inner box dimension values (mm) Figure 18. Ammopack dimension values (mm) DS0661 - Rev 6 page 7/12 BZW06-xx, BZW06-xxB DO-15 package information Figure 19. Tape outline C B A Dimensions are not to scale Unidirectional components are oriented with red tape on the cathode and white tape on the anode. Bidirectional components have red tape on both sides. Table 4. Tape dimension values Dimensions Millimeters Ref. DS0661 - Rev 6 Min. Typ. Max. A 4.5 5 5.5 B 51 53 55 C 62 65 68 page 8/12 BZW06-xx, BZW06-xxB Reflow profile 2.2 Reflow profile Figure 20. ST ECOPACK recommended soldering reflow profile for PCB mounting 250 240-245 °C Temperature (°C) -2 °C/s 2 - 3 °C/s 60 sec (90 max) 200 -3 °C/s 150 -6 °C/s 100 0.9 °C/s 50 Time (s) 0 Note: 60 90 120 150 180 210 240 270 300 Minimize air convection currents in the reflow oven to avoid component movement. Maximum soldering profile corresponds to the latest IPC/JEDEC J-STD-020. For wave soldering profile refer to AN5088 chapter 1.5. • DS0661 - Rev 6 30 AN5088: Rectifiers thermal management, handling and mounting recommendations. page 9/12 BZW06-xx, BZW06-xxB Ordering information 3 Ordering information Table 5. Ordering information Order code Marking BZW06-xxRL / BZW06-xxBRL(1) Equal to order code (without RL suffix) BZW06-xx / BZW06-xxB Equal to order code Package Weight Base qty. DO-15 0.4 g Delivery mode 6000 Reel 1000 Ammopack 1. Where xx corresponds to VRM and blank or B indicates unidirectional or bidirectional version. DS0661 - Rev 6 page 10/12 BZW06-xx, BZW06-xxB Revision history Table 6. Document revision history DS0661 - Rev 6 Date Revision Changes Feb-2003 3A 06-Apr-2017 4 Updated Table 1, Table 3, Characteristics (curves) and DO-15 package information. 10-Jan-2023 5 Updated package information. Minor text changes. 07-Apr-2023 6 Updated Table 5. Last update. page 11/12 BZW06-xx, BZW06-xxB IMPORTANT NOTICE – READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgment. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. For additional information about ST trademarks, refer to www.st.com/trademarks. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2023 STMicroelectronics – All rights reserved DS0661 - Rev 6 page 12/12