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BZW50-33RL

BZW50-33RL

  • 厂商:

    STMICROELECTRONICS(意法半导体)

  • 封装:

    R-6

  • 描述:

    TVS DIODE 33VWM 76VC R6

  • 数据手册
  • 价格&库存
BZW50-33RL 数据手册
BZW50-xx, BZW50-xxB Datasheet 5 kW TVS in R6 Features A K R6 K • • • • Peak pulse power: – 5000 W (10/1000 μs) – up to 60 kW (8/20 μs) Stand-off voltage range from 12 V to 180 V Unidirectional and bidirectional types Operating Tj max: 175 °C • High power capability at Tj max.: up to 3700 W (10/1000 µs) • Lead finishing: matte tin plating Complies with the following standards A Bidirectional Unidirectional • • • • • • • Product status link BZW50-12, BZW50-15, BZW50-18, BZW50-22, BZW50-27, BZW50-33, BZW50-39, BZW50-47, BZW50-56, BZW50-68, BZW50-82, BZW50-100, BZW50-120, BZW50-150, BZW50-180. BZW50-12B, BZW50-15B, BZW50-18B, BZW50-22B, BZW50-27B, BZW50-33B, BZW50-39B, BZW50-47B, BZW50-56B, BZW50-68B, BZW50-82B, BZW50-100B, BZW50-120B, BZW50-150B, BZW50-180B. UL94, V0 J-STD-020 MSL level 1 J-STD-002, JESD 22-B102 E3 and MIL-STD-750, method 2026 JESD-201 class 2 whisker test UL 497B file number: QVGQ2.E136224 IEC 61000-4-4 level 4: – 4kV IEC 61000-4-2, C = 150 pF, R = 330 Ω exceeds level 4: – 30 kV (air discharge) – 30 kV (contact discharge) Description The BZW50 TVS series is designed to protect sensitive equipment against electrostatic discharges according to IEC 61000-4-2, MIL STD 883 Method 3015, and electrical overstress such as IEC 61000-4-4 and 5. They are used for surges below 5000 W 10/1000 μs. This planar technology makes it compatible with high-end equipment and SMPS where low leakage current and high junction temperature are required to provide reliability and stability over time. DS0662 - Rev 7 - March 2023 For further information contact your local STMicroelectronics sales office. www.st.com BZW50-xx, BZW50-xxB Characteristics 1 Characteristics Table 1. Absolute maximum ratings (Tamb = 25 °C) Symbol Value Unit 5000 W Power dissipation on infinite heatsink 6.5 W IFSM Non repetitive surge peak forward current for unidirectional types 500 A Tstg Storage temperature range -65 to +175 °C Top Operating junction temperature range -55 to +175 °C TL Maximum lead temperature for soldering during 10 s at 5 mm from case. 260 °C PPP P Parameter Peak pulse power dissipation Figure 1. Electrical characteristics (definitions) Symbol VRM VBR VCL IRM IPP αT VF RD Parameter Stand-off voltage Breakdown voltage Clamping voltage Leakage current @ VRM Peak pulse current Voltage temperature coefficient Forward voltage drop Dynamic resistance Unidirectional I I IF IPP VF VCL VBR VRM V VCLVBR VRM IRM IR IPP IR IRM V IRM IR IPP VRMVBR VCL Bidirectional Figure 2. Pulse definition for electrical characteristics DS0662 - Rev 7 page 2/12 BZW50-xx, BZW50-xxB Characteristics Table 2. Electrical characteristics - parameter values (Tamb = 25 °C, unless otherwise specified) Type IRM max at VRM VBR at IBR (1) 25 °C Min. 10 / 1000 µs VCL(2)(3) IPP(4) Max. 8 / 20µs RD VCL(2)(3) Max. Max. IPP(4) RD αT Max. Max. µA V V mA V A Ω V A Ω 10-4/°C BZW50-12/B 5 12 13.3 1 22 227 0.032 28 2143 0.006 8.4 BZW50-15/B 5 15 16.6 1 26.9 186 0.046 35 1714 0.010 8.8 BZW50-18/B 5 18 20 1 32.2 155 0.065 41.5 1446 0.013 9.2 BZW50-22/B 5 22 24.4 1 39.4 127 0.098 51 1177 0.020 9.6 BZW50-27/B 5 27 30 1 48.3 103 0.147 62 968 0.030 9.8 BZW50-33/B 5 33 36.6 1 59 85 0.218 76 789 0.045 10 BZW50-39/B 5 39 43.3 1 69.4 72 0.299 90 667 0.063 10.1 BZW50-47/B 5 47 52 1 83.2 60.1 0.428 108 556 0.091 10.3 BZW50-56/B 5 56 62.2 1 99.6 50 0.617 129 465 0.130 10.4 BZW50-68/B 5 68 75.6 1 121 41 0.913 157 382 0.192 10.5 BZW50-82/B 5 82 91 1 145 34 1.31 189 317 0.279 10.6 BZW50-100/B 5 100 111 1 179 28 2.01 228 263 0.400 10.7 BZW50-120/B 5 120 133 1 215 23 2.96 274 219 0.580 10.8 BZW50-150/B 5 150 166 1 269 19 4.50 343 175 0.912 10.8 BZW50-180/B 5 180 200 1 322 16 6.31 410 146 1.294 10.8 1. To calculate VBR versus Tj : VBR at Tj = VBR at 25 °C x (1 + αT x (Tj - 25)) 2. To calculate VCL versus Tj : VCL at Tj = VCL at 25 °C x (1 + αT x (Tj - 25)) 3. To calculate VCL max versus IPPappli: VCL max = VCL - RD x (IPP - IPPappli) where IPPappli is the surge current in the application. 4. Surge capability given for both directions for unidirectional and bidirectional devices DS0662 - Rev 7 page 3/12 BZW50-xx, BZW50-xxB Characteristics (curves) 1.1 Characteristics (curves) Figure 3. Maximum peak power dissipation versus initial junction temperature PPP (W) 6000 Figure 4. Maximum peak pulse power versus exponential pulse duration PPP (kW) 1000 Tj initial = 25 °C 10/1000 µs 5000 VBR < 36V VRM > 30 V 100 4000 3000 VRM ≤ 30 V 10 VBR ≥ 36V 2000 1 1000 Tj (°C) 0 0 25 50 75 100 125 150 175 200 Figure 5. Maximum peak pulse current versus clamping voltage 10000 0.1 0.001 t p (ms) 0.01 0.1 1 10 100 Figure 6. Dynamic resistance versus pulse duration RD(Ω) IPP (A) 100 8/20 µs 1000 10 82B 82/ 50 - W BZ 1 10 0.1 BZW50-82/82B BZW50-39/39B BZW50-18/18B BZW50-12/12B BZW50-180/180B 100 1 100 39B 39/ 18B 18/ 50BZW B 2/12 50-1 BZW C (nF) tp (ms) 0.001 0.01 1000 Figure 7. Junction capacitance versus reverse applied voltage (unidirectional type) 100 50- W BZ 0.01 VCL (V) 0.1 10 B 180 80/ 0-1 W5 BZ 10/1000 µs 0.1 1 10 100 Figure 8. Junction capacitance versus applied voltage (bidirectional type) 100 C(nF) f=1MHz Vosc=30mVRMS Tj=25°C f=1MHz Vosc=30mVRMS Tj=25°C 10 10 BZW50-12 BZW50-12B BZW50-18 BZW50-18B BZW50-39B BZW50-39 1 1 BZW50-82B BZW50-82 BZW50-180 BZW50-180B VR (V) 0.1 1 DS0662 - Rev 7 10 100 1000 VR (V) 0.1 1 10 100 1000 page 4/12 BZW50-xx, BZW50-xxB Characteristics (curves) Figure 9. Leakage current versus junction temperature Figure 10. Peak forward voltage drop versus peak forward current IR (nA) 10000 IF (A) 100 VR=VRM Single pulse 1000 10 Tj=125 °C 100 Tj=25 °C 1 10 Tj (°C) 1 25 50 75 100 125 150 175 Figure 11. Thermal impedance junction to ambient versus pulse duration 100 Zth(j-a) (°C/W) 0 0.5 1 1.5 2 2.5 3 Figure 12. Thermal resistance junction to ambient versus copper area under each lead 80 Single pulse Epoxy printed circuit board FR4, 70 µm Cu thickness VF (V) 0.1 Rth(j-a) (°C/W) Single pulse. Epoxy printed circuit board FR4, 70 µm Cu thickness 70 60 50 10 40 30 20 10 tp (s) 1 0.1 DS0662 - Rev 7 1 10 100 1000 0 S Cu(cm²) 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 page 5/12 BZW50-xx, BZW50-xxB Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 2.1 R6 package information Figure 13. R6 package outline B B A ØC ØD Table 3. R6 mechanical data Dimensions Inches(1) mm Ref. Min. Typ. Max. Min. Typ. Max. A 8.60 8.85 9.10 0.338 0.348 0.359 B 25.40 C 8.60 8.85 9.10 0.338 0.348 0.359 D 1.20 1.25 1.30 0.047 0.049 0.052 1.000 1. Inches given for reference only Figure 14. Marking layout Figure 15. Tape and reel orientation Cathode bar (unidirectional devices only) E L PPPYWW MMMMMMM E : ECOPACK grade L: ECO level MMMM : Marking DS0662 - Rev 7 I PPP : Assembly location Y : Year WW : Week I: Traceability page 6/12 BZW50-xx, BZW50-xxB R6 package information Figure 16. Reel dimension values (mm) Figure 17. Inner box dimension values (mm) Figure 18. Ammopack dimension values (mm) Figure 19. Tape outline C B A Dimensions are not to scale Unidirectional components are oriented with red tape on the cathode and white tape on the anode. Bidirectional components have red tape on both sides. DS0662 - Rev 7 page 7/12 BZW50-xx, BZW50-xxB R6 package information Table 4. Tape dimension values Dimensions Millimeters Ref. DS0662 - Rev 7 Min. Typ. Max. A 9.5 10 10.5 B 51 53 55 C 62 65 68 page 8/12 BZW50-xx, BZW50-xxB Reflow profile 2.2 Reflow profile Figure 20. ST ECOPACK recommended soldering reflow profile for PCB mounting 250 240-245 °C Temperature (°C) -2 °C/s 2 - 3 °C/s 60 sec (90 max) 200 -3 °C/s 150 -6 °C/s 100 0.9 °C/s 50 Time (s) 0 Note: 60 90 120 150 180 210 240 270 300 Minimize air convection currents in the reflow oven to avoid component movement. Maximum soldering profile corresponds to the latest IPC/JEDEC J-STD-020. For wave soldering profile refer to AN5088 chapter 1.5. • DS0662 - Rev 7 30 AN5088: Rectifiers thermal management, handling and mounting recommendations. page 9/12 BZW50-xx, BZW50-xxB Ordering information 3 Ordering information Table 5. Ordering information Order code Marking BZW50-xxRL/BZW50-xxBRL(1) Equal to order code (without RL suffix) BZW50xx/B Equal to order code Package Weight R6 2.05 g Base qty. Delivery mode 1000 Reel 100 Ammopack 1. Where xx corresponds to VRM and blank or B indicates unidirectional or bidirectional version. DS0662 - Rev 7 page 10/12 BZW50-xx, BZW50-xxB Revision history Table 6. Document revision history DS0662 - Rev 7 Date Revision Changes Feb-2003 4 Last update. 14-Dec-2012 5 Updated ECOPACK statement. 25-May-2018 6 Updated tittle description. Updated Figure 2. Pulse definition for electrical characteristics and Figure 12. Ordering information scheme. 06-Mar-2023 7 Added packing information. page 11/12 BZW50-xx, BZW50-xxB IMPORTANT NOTICE – READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgment. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. For additional information about ST trademarks, refer to www.st.com/trademarks. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2023 STMicroelectronics – All rights reserved DS0662 - Rev 7 page 12/12
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