BZW50-xx, BZW50-xxB
Datasheet
5 kW TVS in R6
Features
A
K
R6
K
•
•
•
•
Peak pulse power:
–
5000 W (10/1000 μs)
–
up to 60 kW (8/20 μs)
Stand-off voltage range from 12 V to 180 V
Unidirectional and bidirectional types
Operating Tj max: 175 °C
•
High power capability at Tj max.: up to 3700 W (10/1000 µs)
•
Lead finishing: matte tin plating
Complies with the following standards
A
Bidirectional
Unidirectional
•
•
•
•
•
•
•
Product status link
BZW50-12,
BZW50-15,
BZW50-18,
BZW50-22,
BZW50-27,
BZW50-33,
BZW50-39,
BZW50-47,
BZW50-56,
BZW50-68,
BZW50-82,
BZW50-100,
BZW50-120,
BZW50-150,
BZW50-180.
BZW50-12B,
BZW50-15B,
BZW50-18B,
BZW50-22B,
BZW50-27B,
BZW50-33B,
BZW50-39B,
BZW50-47B,
BZW50-56B,
BZW50-68B,
BZW50-82B,
BZW50-100B,
BZW50-120B,
BZW50-150B,
BZW50-180B.
UL94, V0
J-STD-020 MSL level 1
J-STD-002, JESD 22-B102 E3 and MIL-STD-750, method 2026
JESD-201 class 2 whisker test
UL 497B file number: QVGQ2.E136224
IEC 61000-4-4 level 4:
–
4kV
IEC 61000-4-2, C = 150 pF, R = 330 Ω exceeds level 4:
–
30 kV (air discharge)
–
30 kV (contact discharge)
Description
The BZW50 TVS series is designed to protect sensitive equipment against
electrostatic discharges according to IEC 61000-4-2, MIL STD 883 Method 3015,
and electrical overstress such as IEC 61000-4-4 and 5. They are used for surges
below 5000 W 10/1000 μs.
This planar technology makes it compatible with high-end equipment and SMPS
where low leakage current and high junction temperature are required to provide
reliability and stability over time.
DS0662 - Rev 7 - March 2023
For further information contact your local STMicroelectronics sales office.
www.st.com
BZW50-xx, BZW50-xxB
Characteristics
1
Characteristics
Table 1. Absolute maximum ratings (Tamb = 25 °C)
Symbol
Value
Unit
5000
W
Power dissipation on infinite heatsink
6.5
W
IFSM
Non repetitive surge peak forward current for unidirectional types
500
A
Tstg
Storage temperature range
-65 to +175
°C
Top
Operating junction temperature range
-55 to +175
°C
TL
Maximum lead temperature for soldering during 10 s at 5 mm from case.
260
°C
PPP
P
Parameter
Peak pulse power dissipation
Figure 1. Electrical characteristics (definitions)
Symbol
VRM
VBR
VCL
IRM
IPP
αT
VF
RD
Parameter
Stand-off voltage
Breakdown voltage
Clamping voltage
Leakage current @ VRM
Peak pulse current
Voltage temperature coefficient
Forward voltage drop
Dynamic resistance
Unidirectional
I
I
IF
IPP
VF
VCL VBR VRM
V
VCLVBR VRM
IRM
IR
IPP
IR
IRM
V
IRM
IR
IPP
VRMVBR VCL
Bidirectional
Figure 2. Pulse definition for electrical characteristics
DS0662 - Rev 7
page 2/12
BZW50-xx, BZW50-xxB
Characteristics
Table 2. Electrical characteristics - parameter values (Tamb = 25 °C, unless otherwise specified)
Type
IRM max at VRM
VBR at IBR (1)
25 °C
Min.
10 / 1000 µs
VCL(2)(3)
IPP(4)
Max.
8 / 20µs
RD
VCL(2)(3)
Max.
Max.
IPP(4)
RD
αT
Max.
Max.
µA
V
V
mA
V
A
Ω
V
A
Ω
10-4/°C
BZW50-12/B
5
12
13.3
1
22
227
0.032
28
2143
0.006
8.4
BZW50-15/B
5
15
16.6
1
26.9
186
0.046
35
1714
0.010
8.8
BZW50-18/B
5
18
20
1
32.2
155
0.065
41.5
1446
0.013
9.2
BZW50-22/B
5
22
24.4
1
39.4
127
0.098
51
1177
0.020
9.6
BZW50-27/B
5
27
30
1
48.3
103
0.147
62
968
0.030
9.8
BZW50-33/B
5
33
36.6
1
59
85
0.218
76
789
0.045
10
BZW50-39/B
5
39
43.3
1
69.4
72
0.299
90
667
0.063
10.1
BZW50-47/B
5
47
52
1
83.2
60.1
0.428
108
556
0.091
10.3
BZW50-56/B
5
56
62.2
1
99.6
50
0.617
129
465
0.130
10.4
BZW50-68/B
5
68
75.6
1
121
41
0.913
157
382
0.192
10.5
BZW50-82/B
5
82
91
1
145
34
1.31
189
317
0.279
10.6
BZW50-100/B
5
100
111
1
179
28
2.01
228
263
0.400
10.7
BZW50-120/B
5
120
133
1
215
23
2.96
274
219
0.580
10.8
BZW50-150/B
5
150
166
1
269
19
4.50
343
175
0.912
10.8
BZW50-180/B
5
180
200
1
322
16
6.31
410
146
1.294
10.8
1. To calculate VBR versus Tj : VBR at Tj = VBR at 25 °C x (1 + αT x (Tj - 25))
2. To calculate VCL versus Tj : VCL at Tj = VCL at 25 °C x (1 + αT x (Tj - 25))
3. To calculate VCL max versus IPPappli: VCL max = VCL - RD x (IPP - IPPappli) where IPPappli is the surge current in the
application.
4. Surge capability given for both directions for unidirectional and bidirectional devices
DS0662 - Rev 7
page 3/12
BZW50-xx, BZW50-xxB
Characteristics (curves)
1.1
Characteristics (curves)
Figure 3. Maximum peak power dissipation versus initial
junction temperature
PPP (W)
6000
Figure 4. Maximum peak pulse power versus exponential
pulse duration
PPP (kW)
1000
Tj initial = 25 °C
10/1000 µs
5000
VBR < 36V
VRM > 30 V
100
4000
3000
VRM ≤ 30 V
10
VBR ≥ 36V
2000
1
1000
Tj (°C)
0
0
25
50
75
100
125
150
175
200
Figure 5. Maximum peak pulse current versus clamping
voltage
10000
0.1
0.001
t p (ms)
0.01
0.1
1
10
100
Figure 6. Dynamic resistance versus pulse duration
RD(Ω)
IPP (A)
100
8/20 µs
1000
10
82B
82/
50 -
W
BZ
1
10
0.1
BZW50-82/82B
BZW50-39/39B
BZW50-18/18B
BZW50-12/12B
BZW50-180/180B
100
1
100
39B
39/
18B
18/
50BZW
B
2/12
50-1
BZW
C (nF)
tp (ms)
0.001
0.01
1000
Figure 7. Junction capacitance versus reverse applied
voltage (unidirectional type)
100
50-
W
BZ
0.01
VCL (V)
0.1
10
B
180
80/
0-1
W5
BZ
10/1000 µs
0.1
1
10
100
Figure 8. Junction capacitance versus applied voltage
(bidirectional type)
100
C(nF)
f=1MHz
Vosc=30mVRMS
Tj=25°C
f=1MHz
Vosc=30mVRMS
Tj=25°C
10
10
BZW50-12
BZW50-12B
BZW50-18
BZW50-18B
BZW50-39B
BZW50-39
1
1
BZW50-82B
BZW50-82
BZW50-180
BZW50-180B
VR (V)
0.1
1
DS0662 - Rev 7
10
100
1000
VR (V)
0.1
1
10
100
1000
page 4/12
BZW50-xx, BZW50-xxB
Characteristics (curves)
Figure 9. Leakage current versus junction temperature
Figure 10. Peak forward voltage drop versus peak forward
current
IR (nA)
10000
IF (A)
100
VR=VRM
Single pulse
1000
10
Tj=125 °C
100
Tj=25 °C
1
10
Tj (°C)
1
25
50
75
100
125
150
175
Figure 11. Thermal impedance junction to ambient versus
pulse duration
100
Zth(j-a) (°C/W)
0
0.5
1
1.5
2
2.5
3
Figure 12. Thermal resistance junction to ambient versus
copper area under each lead
80
Single pulse
Epoxy printed circuit board FR4, 70 µm Cu thickness
VF (V)
0.1
Rth(j-a) (°C/W)
Single pulse.
Epoxy printed circuit board FR4, 70 µm Cu thickness
70
60
50
10
40
30
20
10
tp (s)
1
0.1
DS0662 - Rev 7
1
10
100
1000
0
S Cu(cm²)
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
page 5/12
BZW50-xx, BZW50-xxB
Package information
2
Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages,
depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product
status are available at: www.st.com. ECOPACK is an ST trademark.
2.1
R6 package information
Figure 13. R6 package outline
B
B
A
ØC
ØD
Table 3. R6 mechanical data
Dimensions
Inches(1)
mm
Ref.
Min.
Typ.
Max.
Min.
Typ.
Max.
A
8.60
8.85
9.10
0.338
0.348
0.359
B
25.40
C
8.60
8.85
9.10
0.338
0.348
0.359
D
1.20
1.25
1.30
0.047
0.049
0.052
1.000
1. Inches given for reference only
Figure 14. Marking layout
Figure 15. Tape and reel orientation
Cathode bar
(unidirectional devices only)
E L PPPYWW
MMMMMMM
E : ECOPACK grade
L: ECO level
MMMM : Marking
DS0662 - Rev 7
I
PPP : Assembly location
Y : Year
WW : Week
I: Traceability
page 6/12
BZW50-xx, BZW50-xxB
R6 package information
Figure 16. Reel dimension values (mm)
Figure 17. Inner box dimension values (mm)
Figure 18. Ammopack dimension values (mm)
Figure 19. Tape outline
C
B
A
Dimensions are not to scale
Unidirectional components are oriented with red tape on the cathode and white tape on the anode.
Bidirectional components have red tape on both sides.
DS0662 - Rev 7
page 7/12
BZW50-xx, BZW50-xxB
R6 package information
Table 4. Tape dimension values
Dimensions
Millimeters
Ref.
DS0662 - Rev 7
Min.
Typ.
Max.
A
9.5
10
10.5
B
51
53
55
C
62
65
68
page 8/12
BZW50-xx, BZW50-xxB
Reflow profile
2.2
Reflow profile
Figure 20. ST ECOPACK recommended soldering reflow profile for PCB mounting
250
240-245 °C
Temperature (°C)
-2 °C/s
2 - 3 °C/s
60 sec
(90 max)
200
-3 °C/s
150
-6 °C/s
100
0.9 °C/s
50
Time (s)
0
Note:
60
90
120
150
180
210
240
270
300
Minimize air convection currents in the reflow oven to avoid component movement. Maximum soldering profile
corresponds to the latest IPC/JEDEC J-STD-020.
For wave soldering profile refer to AN5088 chapter 1.5.
•
DS0662 - Rev 7
30
AN5088: Rectifiers thermal management, handling and mounting recommendations.
page 9/12
BZW50-xx, BZW50-xxB
Ordering information
3
Ordering information
Table 5. Ordering information
Order code
Marking
BZW50-xxRL/BZW50-xxBRL(1)
Equal to order code (without RL suffix)
BZW50xx/B
Equal to order code
Package
Weight
R6
2.05 g
Base qty.
Delivery mode
1000
Reel
100
Ammopack
1. Where xx corresponds to VRM and blank or B indicates unidirectional or bidirectional version.
DS0662 - Rev 7
page 10/12
BZW50-xx, BZW50-xxB
Revision history
Table 6. Document revision history
DS0662 - Rev 7
Date
Revision
Changes
Feb-2003
4
Last update.
14-Dec-2012
5
Updated ECOPACK statement.
25-May-2018
6
Updated tittle description. Updated Figure 2. Pulse definition for electrical characteristics and Figure
12. Ordering information scheme.
06-Mar-2023
7
Added packing information.
page 11/12
BZW50-xx, BZW50-xxB
IMPORTANT NOTICE – READ CAREFULLY
STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST
products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST
products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgment.
Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of
purchasers’ products.
No license, express or implied, to any intellectual property right is granted by ST herein.
Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.
ST and the ST logo are trademarks of ST. For additional information about ST trademarks, refer to www.st.com/trademarks. All other product or service names
are the property of their respective owners.
Information in this document supersedes and replaces information previously supplied in any prior versions of this document.
© 2023 STMicroelectronics – All rights reserved
DS0662 - Rev 7
page 12/12