CBTVS2A12-1F3

CBTVS2A12-1F3 Circuit breaker with transient voltage suppressor Datasheet - production data Features • Transient voltage suppressor (TVS) • Non-resettable over current protection (OCP) • Electrostatic discharge protection • Electrical overstress protection (OVP) • Unidirectional device • Fast response time Flip Chip (4 bumps) • Very thin package: 0.4 mm • High ESD protection level • High integration • Suitable for high density boards Figure 1. Pin configuration (bump side) A • IEC 61000-4-2 level 4: – ±15 kV (air discharge) – ±15 kV (contact discharge) B 1 2 Description Figure 2. Configuration(a) &KDUJHULQSXW Complies with the following standards: 7R3RZHU0DQDJHPHQW,& $ The CBTVS2A12-1F3 is a single line diode TVS integrating a fuse designed specifically for the protection of integrated circuits in portable equipment and miniaturized electronics devices subject to ESD, OVP and OCP. $ 1RQUHVHWWDEOHIXVH % *1' % *1' a. B1 and B2 bumps must be grounded on the PCB together. May 2014 This is information on a product in full production. DocID026350 Rev 1 1/7 www.st.com Characteristics 1 CBTVS2A12-1F3 Characteristics Table 1. Absolute maximum ratings (Tamb = 25 °C) Symbol VPP PPP Tj Tstg Parameter Test condition Value IEC 61000-4-2 contact discharge 15 IEC 61000-4-2 air discharge 15 10/1000 µs pulse, on A2-B2, Tj = Tamb 44 8/20 µs pulse, on A2-B2, Tj = Tamb 350 Unit Peak pulse voltage kV Peak pulse power dissipation W Maximum operating junction temperature Storage temperature range 125 °C -55 to +150 °C Figure 3. Electrical characteristics (definitions) I Symbol VBR VCL IRM VRM IF Rd IPP IR VF = = = = = = = = = Parameter Breakdown voltage Clamping voltage Leakage current @ VRM Stand-off voltage Forward current Dynamic impedance Peak pulse current Breakdown current Forward voltage drop IF VF VCL VBR VRM V IRM Slope = 1/Rd IPP Table 2. Electrical characteristics (at operating temperature: Top = -30 °C to +85 °C, unless otherwise specified) Symbol Test conditions Typ. Max. 12 Unit VBR IR = 1 mA, Tamb = 25 °C IRM VRM = 10 V, at Tamb = 25 °C 100 nA VCL IPP = 1 A, 8/20 µs pulse waveform, between A1-B1 at Tamb = 25 °C 15 V VF IF = 850 mA, between A1-B1 1.4 V Cline VR = 0 V, VOSC = 30 mV, F = 1 MHz V 180 pF RA1-A2 At Tamb = 25 °C at 100 mA RA1-A2 After fused 50 TFuse At 5 A (maximum opening time) A1-A2, A2-A1 100 ms TFuse2 At 3.2 A, A1-A2, A2-A1 24 hours 1 Tfuse Lifetime IDC = 2 A (continuous current) at Tamb = 25 °C 2/7 Min. DocID026350 Rev 1 500 mΩ MΩ hours CBTVS2A12-1F3 Characteristics Figure 4. Clamping voltage versus peak pulse current (typical values) IPP (A) 100 8/20µs Tj initial = 25 °C A1/B1 A2/B2 Figure 5. Forward voltage drop versus peak forward current (typical values) IFM (A) 10 1 10 0.1 0.01 1 0.001 0.1 13.5 VCL(V) 14.5 15.5 16.5 17.5 18.5 0.0001 19.5 Figure 6. Frequency response 0 Tj initial = 25 °C A1/B1 A2/B2 0.6 0.7 0.8 0.9 1 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 2 VFM(V) Figure 7. Junction capacitance versus reverse applied voltage (typical values) S21 (dB ) 200.0 C (pF) 180.0 160.0 -10 140.0 120.0 -20 100.0 80.0 -30 60.0 40.0 -40 20.0 F (Hz) 0.0 -50 300k 1M 3M 10M 30M 100M 300M 1G 3G Figure 8. ESD response to IEC 61000-4-2 (+8 kV contact discharge) VR(V) 0 2 4 6 8 10 12 Figure 9. ESD response to IEC 61000-4-2 (-8 kV contact discharge) 5.0 V/di v 5.0 V/di v 200 ns/div DocID026350 Rev 1 200 ns/div 3/7 7 Ordering information scheme 2 CBTVS2A12-1F3 Ordering information scheme Figure 10. Ordering information scheme &%796$) &LUFXLWEUHDNHU 7UDQVLHQWYROWDJHVXSSUHVVRU %UHDNGRZQYROWDJH   90,1 1XPEHURIOLQHV  VLQJOHOLQH 3DFNDJH ) )OLS&KLS  OHDGIUHHSLWFK —P 4/7 DocID026350 Rev 1 CBTVS2A12-1F3 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Figure 11. Package dimensions 400 µm ± 50 185 µm ± 10 0.77 mm ± 30 µm 400 µm ± 40 400 µm ± 40 3 Package information 205 µm ± 40 185 µm ± 10 0.77 mm ± 30 µm 255 µm ± 40 Figure 12. Foot print recommendations Figure 13. Marking Dot xx = marking z = manufacturing location yww = datecode (y = year ww = week) Copper pad Diameter: 220 µm recommended 260 µm maximum Solder mask opening: 300 µm minimum x x z y ww Solder stencil opening: 220 µm recommended Figure 14. Tape and reel specifications Ø 1.55 ± 0.05 4.0 ± 0.1 0.20 ± 0.05 3.5 ±- 0.05 xxz yww xxz yww xxz yww 0.87± 0.05 xxz yww xxz yww xxz yww xxz yww 8.0 ± 0.3 0.87± 0.05 2.0 ± 0.1 0.69 ± 0.05 All dimensions in mm 1.75 ± 0.1 2.0 ± 0.05 User direction of unreeling DocID026350 Rev 1 5/7 7 Ordering information Note: CBTVS2A12-1F3 More information is available in the application notes: AN2348: “400 µm Flip Chip: Package description and recommendations for use” AN1751: "EMI Filters: Recommendations and measurements" 4 Ordering information Table 3. Ordering information 5 Order code Marking Package Weight Base qty Delivery mode CBTVS2A12-1F3 EB Flip Chip 0.659 mg 10 000 Tape and reel (7”) Revision history Table 4. Document revision history 6/7 Date Revision 19-May-2014 1 Changes Initial release. DocID026350 Rev 1 CBTVS2A12-1F3 Please Read Carefully: Information in this document is provided solely in connection with ST products. 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