CPL-WB-01D3

CPL-WB-01D3 Wide-band directional coupler with ISO port Features ■ 50 Ω nominal input / output impedance ■ Wide operating frequency range (824 MHz to 2170 MHz) ■ Low insertion loss (< 0.2 dB) ■ 26 dB coupling factor ■ High directivity ■ High ESD robustness (IEC 61000-4-2 Level 4) ■ Flip-Chip package ■ Small footprint Flip-Chip package 6 bumps Figure 1. Benefits ■ Very low profile ■ Lead-free package ■ High RF performance ■ RF module size reduction Pin configuration (top view) 3 2 1 RFOUT GND RFIN A B ISO GND CPLD Applications ■ Quad-band power amplifier module ■ Quad-band front end module Description ■ GSM / WCDMA mobile phone The CPL-WB-01D3 is a wide-band directional coupler designed to measure RF antenna output power in GSM / WCDMA / TD-SCDMA applications. This CPL has been customized for wide band operating frequencies (EGSM and CELL, PCS, DCS, TD-SCDMA, WCDMA Band I) with less than 0.2 dB insertion losses in the transmit bandwidth (824 MHz to 2170 MHz). The CPL-WB-01D3 has been designed using STMicroelectronics IPD (integrated passive device) technology on non-conductive glass substrate to optimize RF performance. The device is delivered 100% tested in tape and reel. February 2012 Doc ID 019036 Rev 3 1/10 www.st.com 10 Characteristics CPL-WB-01D3 1 Characteristics Table 1. Absolute maximum rating (limiting values) Value Symbol Parameter Unit Min. PIN Typ. Input power RFIN Max. 35 ESD ratings IEC 61000-4-2 (C = 150 pF, R = 330 Ω, 10 shots with both polarities and each condition, cumulative method) VESD (IEC) RFIN, RFOUT, air discharge RFIN, RFOUT, contact discharge dBm ±15 ±8 kV kV 2 kV VESD (MM) Machine model, JESD22-A115-A, All I/O 100 V VESD (CDM) Charge device model, JESD22-C101-C, All I/O 500 V VESD (HBM) Human body model, JESD22-A114-B, All I/O TOP Table 2. Operating temperature -30 +85 ºC Electrical characteristics (Tamb = 25 °C) - impedances Value Symbol Parameter Unit Min. ZOUT ZIN ZCPLD ZISO 2/10 Typ. Max. Nominal output impedance 50 Ω Nominal input impedance 50 Ω Nominal coupling impedance 50 Ω Nominal ISO impedance 50 Ω Doc ID 019036 Rev 3 CPL-WB-01D3 Table 3. Characteristics Electrical characteristics (Tamb = 25 °C) - RF performance Value Symbol Parameter Test condition Unit Min. Typ. Max. Operating temperature -30 +85 °C f Frequency range (bandwidth) 824 2170 MHz IL Insertion loss in bandwidth From 824 MHz to 2170 MHz 0.2 dB RL Return loss in bandwidth TOP CPLD 0.1 From 824 MHz to 2170 MHz 15 dB From 824 MHz to 915 MHz 24 26 27 dB From 1710 MHz to 2025 MHz 18 19 21 dB 0.5 dB Coupling factor Ripple Coupling ripple in individual band (824 to 849 MHz) - (880 to 915 MHz) (1710 to 1785 MHz) - (1850 to 1910 MHz) (1880 to 2025 MHz) - (1920 to 1980 MHz) DIR Coupler directivity From 824 MHz to 2025 MHz Doc ID 019036 Rev 3 15 20 dB 3/10 Characteristics 1.1 CPL-WB-01D3 RF measurement Figure 2. Insertion loss IL - dB 0.00 -0.05 -0.10 -0.15 -0.20 F (Hz) -0.25 8.0E8 Figure 3. 1.0E9 1.2E9 1.4E9 1.6E9 1.8E9 2.0E9 2.2E9 Coupling LB CPLD_LB, dB -23 -24 -25 -26 -27 F (Hz) -28 8.2E8 Figure 4. 8.4E8 8.6E8 8.8E8 9.2E8 9.0E8 Coupling HB -17 CPLD_HB, dB -18 -19 -20 -21 F (Hz) -22 1.70E9 4/10 1.75E9 1.80E9 1.85E9 1.90E9 Doc ID 019036 Rev 3 1.95E9 2.00E9 2.05E9 CPL-WB-01D3 Figure 5. Characteristics Return losses -10 RL - dB -15 -20 RL_IN RL_OUT RL_ISO RL_CPLD -25 -30 -35 -40 -45 F (Hz) -50 0.0 5.0E8 1.0E9 1.5E9 Doc ID 019036 Rev 3 2.0E9 2.5E9 3.0E9 5/10 PCB layout recommendation 2 PCB layout recommendation Figure 6. 6/10 CPL-WB-01D3 Typical PCB layout recommendation ● Material: 4 layers FR4 with solder mask on top and bottom layer ● Substrate thickness: 0.8 mm ● 50 Ω line access ● Ground plane must be on PCB layer 1 as shown in Figure 6 Doc ID 019036 Rev 3 CPL-WB-01D3 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Figure 7. Package dimensions 625 µm ±50 µm 255 µm 1.3 mm ± 45 µm 595 µm 450 µm 3 Package information UBM: ø 220 µm 1.0 mm ± 45 µm Figure 8. Footprint Figure 9. Copper pad diameter: 220 µm recommended 260 µm maximum Marking Dot, ST logo ECOPACK grade xx = marking z = manufacturing location yww = datecode (y = year ww = week) Solder mask opening: 300 µm minimum Solder stencil opening: 220 µm recommended Doc ID 019036 Rev 3 x x z y ww 7/10 Package information CPL-WB-01D3 Figure 10. Flip Chip tape and reel specifications Dot identifying Pin A1 location 2.0 Ø 1.55 4.0 8.0 3.5 1.4 1.75 0.22 ST ST ST xxz yww xxz yww xxz yww 1.1 4.0 0.73 All dimensions are typical values in mm Note: User direction of unreeling More information is available in the application note: AN2348: “Flip Chip: package description and recommendations for use” 8/10 Doc ID 019036 Rev 3 CPL-WB-01D3 4 Ordering information Ordering information Table 4. 5 Ordering information Order code Marking Package Weight Base qty Delivery mode CPL-WB-01D3 RV Flip Chip 1.61 mg 5000 Tape and reel Revision history Table 5. Document revision history Date Revision Changes 08-Jul-2011 1 Initial release 12-Sep-2011 2 Updated Figure 2, Figure 3, and Figure 4. 14-Feb-2012 3 Updated Figure 8. Doc ID 019036 Rev 3 9/10 CPL-WB-01D3 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. 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