E-L6201PSTR

L6201 L6202 - L6203 ® DMOS FULL BRIDGE DRIVER SUPPLY VOLTAGE UP TO 48V 5A MAX PEAK CURRENT (2A max. for L6201) TOTAL RMS CURRENT UP TO L6201: 1A; L6202: 1.5A; L6203/L6201PS: 4A RDS (ON) 0.3 Ω (typical value at 25 °C) CROSS CONDUCTION PROTECTION TTL COMPATIBLE DRIVE OPERATING FREQUENCY UP TO 100 KHz THERMAL SHUTDOWN INTERNAL LOGIC SUPPLY HIGH EFFICIENCY DESCRIPTION The I.C. is a full bridge driver for motor control applications realized in Multipower-BCD technology which combines isolated DMOS power transistors with CMOS and Bipolar circuits on the same chip. By using mixed technology it has been possible to optimize the logic circuitry and the power stage to achieve the best possible performance. The DMOS output transistors can operate at supply voltages up to 42V and efficiently at high switch- MULTIPOWER BCD TECHNOLOGY Powerdip 12+3+3 SO20 (12+4+4) Multiwatt11 PowerSO20 ORDERING NUMBERS: L6201 (SO20) L6201PS (PowerSO20) L6202 (Powerdip18) L6203 (Multiwatt) ing speeds. All the logic inputs are TTL, CMOS and µC compatible. Each channel (half-bridge) of the device is controlled by a separate logic input, while a common enable controls both channels. The I.C. is mounted in three different packages. BLOCK DIAGRAM July 2003 1/20 This is advanced information on a new product now in development or undergoing evaluation. Details are subject to change without notice. L6201 - L6202 - L6203 PIN CONNECTIONS (Top view) SO20 POWERDIP GND 1 20 GND N.C. 2 19 N.C. N.C. N.C. 3 18 OUT2 4 17 ENABLE VS 5 16 SENSE OUT1 6 15 Vref BOOT1 7 14 BOOT2 IN1 8 13 IN2 N.C. 9 12 N.C. GND 10 11 GND D95IN216 PowerSO20 MULTIWATT11 2/20 L6201 - L6202 - L6203 PINS FUNCTIONS Device Name Function 10 SENSE A resistor Rsense connected to this pin provides feedback for motor current control. 11 ENAB LE When a logic high is present on this pin the DMOS POWER transistors are enabled to be selectively driven by IN1 and IN2. 3 N.C. Not Connected 4 GND Common Ground Terminal L6201 L6201PS L6202 L6203 1 16 1 2 17 2 3 2,3,9,12, 18,19 4,5 – – 1, 10 5 GND Common Ground Terminal 6,7 – 6 GND Common Ground Terminal 8 – 7 N.C. Not Connected 9 4 8 OUT2 Ouput of 2nd Half Bridge 6 1 10 5 9 2 Vs Supply Voltage 11 6 10 3 OUT1 Output of first Half Bridge 12 7 11 4 BOOT1 A boostrap capacitor connected to this pin ensures efficient driving of the upper POWER DMOS transistor. 13 8 12 5 IN1 Digital Input from the Motor Controller 6 14,15 – 13 GND Common Ground Terminal – 11, 20 14 GND Common Ground Terminal 16,17 – 15 GND Common Ground Terminal 18 13 16 7 IN2 Digital Input from the Motor Controller 19 14 17 8 BOOT2 A boostrap capacitor connected to this pin ensures efficient driving of the upper POWER DMOS transistor. 20 15 18 9 Vref Internal voltage reference. A capacitor from this pin to GND is recommended. The internal Ref. Voltage can source out a current of 2mA max. ABSOLUTE MAXIMUM RATINGS Symbol Vs VOD VIN, VEN Io Vsense Value Unit Power Supply Parameter 52 V Differential Output Voltage (between Out1 and Out2) 60 V – 0.3 to + 7 V 5 5 10 1 A A A A – 1 to + 4 V Input or Enable Voltage Pulsed Output Current for L6201PS/L6202/L6203 (Note 1) – Non Repetitive (< 1 ms) for L6201 for L6201PS/L6202/L6203 DC Output Current for L6201 (Note 1) Sensing Voltage Vb Boostrap Peak Voltage 60 V Ptot Total Power Dissipation: Tpins = 90°C for L6201 for L6202 Tcase = 90°C for L6201PS/L6203 Tamb = 70°C for L6201 (Note 2) for L6202 (Note 2) for L6201PS/L6203 (Note 2) 4 5 20 0.9 1.3 2.3 W W W W W W – 40 to + 150 °C Tstg, Tj Storage and Junction Temperature Note 1: Pulse width limited only by junction temperature and transient thermal impedance (see thermal characteristics) Note 2: Mounted on board with minimized dissipating copper area. 3/20 L6201 - L6202 - L6203 THERMAL DATA Symbol Rth j-pins Rth j-case Rth j-amb Value Parameter Thermal Resistance Junction-pins Thermal Resistance Junction Case Thermal Resistance Junction-ambient L6201 L6201PS L6202 L6203 15 – 85 – – 13 (*) 12 – 60 – 3 35 max max. max. Unit °C/W (*) Mounted on aluminium substrate. ELECTRICAL CHARACTERISTICS (Refer to the Test Circuits; Tj = 25°C, VS = 42V, Vsens = 0, unless otherwise specified). Symbol Parameter Vs Supply Voltage Vref Reference Voltage IREF Output Current Is Quiescent Supply Current Test Conditions Min. Typ. Max. Unit 12 36 48 V IREF = 2mA EN = H VIN = L EN = H VIN = H EN = L ( Fig. 1,2,3) 13.5 IL = 0 V 2 mA 10 10 8 15 15 15 mA mA mA 30 100 KHz fc Commutation Frequency (*) Tj Thermal Shutdown 150 °C Td Dead Time Protection 100 ns TRANSISTORS OFF IDSS Leakage Current Fig. 11 Vs = 52 V RDS On Resistance Fig. 4,5 Drain Source Voltage Fig. 9 IDS = 1A IDS = 1.2A IDS = 3A 1 mA 0.55 Ω ON VDS(ON) Vsens 0.3 L6201 L6202 L6201PS/0 3 Sensing Voltage 0.3 0.36 0.9 –1 V V V 4 V SOURCE DRAIN DIODE Vsd trr tfr Forward ON Voltage Reverse Recovery Time Fig. 6a and b EN = L ISD = 1A L6201 EN = L ISD = 1.2A L6202 ISD = 3A L6201PS/03 EN = L dif = 25 A/µs dt IF = 1A IF = 1.2A IF = 3A 0.9 (**) 0.9 (**) 1.35(**) V V V 300 ns 200 ns L6201 L6202 L6203 Forward Recovery Time LOGIC LEVELS VIN L, VEN L Input Low Voltage – 0.3 0.8 V VIN H, VEN H Input High Voltage 2 7 V IIN L, IEN L Input Low Current VIN, VEN = L –10 µA IIN H, IEN H Input High Current VIN, VEN = H 4/20 30 µA L6201 - L6202 - L6203 ELECTRICAL CHARACTERISTICS (Continued) LOGIC CONTROL TO POWER DRIVE TIMING Symbol Parameter Test Conditions Min. Typ. Max. Unit t1 (Vi) Source Current Turn-off Delay Fig. 12 300 ns t2 (Vi) Source Current Fall Time Fig. 12 200 ns t3 (Vi) Source Current Turn-on Delay Fig. 12 400 ns t4 (Vi) Source Current Rise Time Fig. 12 200 ns t5 (Vi) Sink Current Turn-off Delay Fig. 13 300 ns t6 (Vi) Sink Current Fall Time Fig. 13 200 ns t7 (Vi) Sink Current Turn-on Delay Fig. 13 400 ns t8 (Vi) Sink Current Rise Time Fig. 13 200 ns (*) Limited by power dissipation (**) In synchronous rectification the drain-source voltage drop VDS is shown in fig. 4 (L6202/03); typical value for the L6201 is of 0.3V. Figure 1: Typical Normalized IS vs. Tj Figure 2: Typical Normalized Quiescent Current vs. Frequency Figure 3: Typical Normalized IS vs. VS Figure 4: Typical RDS (ON) vs. VS ~ Vref 5/20 L6201 - L6202 - L6203 Figure 5: Normalized RDS (ON)at 25°C vs. Temperature Typical Values Figure 6a: Typical Diode Behaviour in Synchronous Rectification (L6201) Figure 6b: Typical Diode Behaviour in Synchronous Rectification (L6201PS/02/03) Figure 7a: Typical Power Dissipation vs IL (L6201) Figure 7b: Typical Power Dissipation vs IL (L6201PS, L6202, L6203)) 6/20 L6201 - L6202 - L6203 Figure 8a: Two Phase Chopping Figure 8b: One Phase Chopping IN1 = H IN 2 = H EN = H Figure 8c: Enable Chopping 7/20 L6201 - L6202 - L6203 TEST CIRCUITS Figure 9: Saturation Voltage Figure 10: Quiescent Current Figure 11: Leakage Current 8/20 L6201 - L6202 - L6203 Figure 12: Source Current Delay Times vs. Input Chopper 42V for L6201PS/02/03 Figure 13: Sink Current Delay Times vs. Input Chopper 42V for L6201PS/02/03 9/20 L6201 - L6202 - L6203 CIRCUIT DESCRIPTION The L6201/1PS/2/3 is a monolithic full bridge switching motor driver realized in the new Multipower-BCD technology which allows the integration of multiple, isolated DMOS power transistors plus mixed CMOS/bipolar control circuits. In this way it has been possible to make all the control inputs TTL, CMOS and µC compatible and eliminate the necessity of external MOS drive components. The Logic Drive is shown in table 1. Figure 15: Current Typical Spikes on the Sensing Pin Table 1 Inputs IN1 IN2 VEN = H L L H H L H L H VEN = L X X Output Mosfets (*) Sink 1, Sink 2 Sink 1, Source 2 Source 1, Sink 2 Source 1, Source 2 All transistors turned oFF L = Low H = High X = DON’t care (*) Numbers referred to INPUT1 or INPUT2 controlled output stages Although the device guarantees the absence of cross-conduction, the presence of the intrinsic diodes in the POWER DMOS structure causes the generation of current spikes on the sensing terminals. This is due to charge-discharge phenomena in the capacitors C1 & C2 associated with the drain source junctions (fig. 14). When the output switches from high to low, a current spike is generated associated with the capacitor C1. On the low-to-high transition a spike of the same polarity is generated by C2, preceded by a spike of the opposite polarity due to the charging of the input capacity of the lower POWER DMOS transistor (fig. 15). Figure 14: Intrinsic Structures in the POWER DMOS Transistors TRANSISTOR OPERATION ON State When one of the POWER DMOS transistor is ON it can be considered as a resistor RDS (ON) throughout the recommended operating range. In this condition the dissipated power is given by : PON = RDS (ON) ⋅ IDS2 (RMS) The low RDS (ON) of the Multipower-BCD process can provide high currents with low power dissipation. OFF State When one of the POWER DMOS transistor is OFF the VDS voltage is equal to the supply voltage and only the leakage current IDSS flows. The power dissipation during this period is given by : POFF = VS ⋅ IDSS The power dissipation is very low and is negligible in comparison to that dissipated in the ON STATE. Transitions As already seen above the transistors have an intrinsic diode between their source and drain that can operate as a fast freewheeling diode in switched mode applications. During recirculation with the ENABLE input high, the voltage drop across the transistor is RDS (ON) ⋅ ID and when it reaches the diode forward voltage it is clamped. When the ENABLE input is low, the POWER MOS is OFF and the diode carries all of the recirculation current. The power dissipated in the transitional times in the cycle depends upon the voltage-current waveforms and in the driving mode. (see Fig. 7ab and Fig. 8abc). Ptrans. = IDS (t) ⋅ VDS (t) 10/20 L6201 - L6202 - L6203 Boostrap Capacitors To ensure that the POWER DMOS transistors are driven correctly gate to source voltage of typ. 10 V must be guaranteed for all of the N-channel DMOS transistors. This is easy to be provided for the lower POWER DMOS transistors as their sources are refered to ground but a gate voltage greater than the supply voltage is necessary to drive the upper transistors. This is achieved by an internal charge pump circuit that guarantees correct DC drive in combination with the boostrap circuit. For efficient charging the value of the boostrap capacitor should be greater than the input capacitance of the power transistor which is around 1 nF. It is recommended that a capacitance of at least 10 nF is used for the bootstrap. If a smaller capacitor is used there is a risk that the POWER transistors will not be fully turned on and they will show a higher RDS (ON). On the other hand if a elevated value is used it is possible that a current spike may be produced in the sense resistor. Reference Voltage To by-pass the internal Ref. Volt. circuit it is recommended that a capacitor be placed between its pin and ground. A value of 0.22 µF should be sufficient for most applications. This pin is also protected against a short circuit to ground: a max. current of 2mA max. can be sinked out. Dead Time To protect the device against simultaneous conduction in both arms of the bridge resulting in a rail to rail short circuit, the integrated logic control provides a dead time greater than 40 ns. Thermal Protection A thermal protection circuit has been included that will disable the device if the junction temperature reaches 150 °C. When the temperature has fallen to a safe level the device restarts the input and enable signals under control. APPLICATION INFORMATION Recirculation During recirculation with the ENABLE input high, the voltage drop across the transistor is RDS (ON)⋅ IL, clamped at a voltage depending on the characteristics of the source-drain diode. Although the device is protected against cross conduction, current spikes can appear on the current sense pin due to charge/discharge phenomena in the intrinsic source drain capacitances. In the application this does not cause any problem because the voltage spike generated on the sense resistor is masked by the current controller circuit. Rise Time Tr (See Fig. 16) When a diagonal of the bridge is turned on current begins to flow in the inductive load until the maximum current IL is reached after a time Tr. The dissipated energy EOFF/ON is in this case : EOFF/ON = [RDS (ON) ⋅ IL2 ⋅ Tr] ⋅ 2/3 Load Time TLD (See Fig.16) During this time the energy dissipated is due to the ON resistance of the transistors (ELD) and due to commutation (ECOM). As two of the POWER DMOS transistors are ON, EON is given by : ELD = IL2 ⋅ RDS (ON) ⋅ 2 ⋅ TLD In the commutation the energy dissipated is : ECOM = VS ⋅ IL ⋅ TCOM ⋅ fSWITCH ⋅ TLD Where : TCOM = TTURN-ON = TTURN-OFF fSWITCH = Chopping frequency. Fall Time Tf (See Fig. 16) It is assumed that the energy dissipated in this part of the cycle takes the same form as that shown for the rise time : EON/OFF = [RDS (ON) ⋅ IL2 ⋅ Tf] ⋅ 2/3 Figure 16. 11/20 L6201 - L6202 - L6203 Quiescent Energy The last contribution to the energy dissipation is due to the quiescent supply current and is given by: EQUIESCENT = IQUIESCENT ⋅ Vs ⋅ T Total Energy Per Cycle ETOT = EOFF/ON + ELD + ECOM + + EON/OFF + EQUIESCENT The Total Power Dissipation PDIS is simply : PDIS = ETOT/T Tr = Rise time TLD = Load drive time Tf = Fall time Td = Dead time T = Period T = Tr + TLD + Tf + Td DC Motor Speed Control Since the I.C. integrates a full H-Bridge in a single package it is idealy suited for controlling DC motors. When used for DC motor control it performs the power stage required for both speed and direction control. The device can be combined with a current regulator like the L6506 to implement a transconductance amplifier for speed control, as shown in figure 17. In this particular configuration only half of the L6506 is used and the other half of the device may be used to control a second Figure 17: Bidirectional DC Motor Control 12/20 motor. The L6506 senses the voltage across the sense resistor RS to monitor the motor current: it compares the sensed voltage both to control the speed and during the brake of the motor. Between the sense resistor and each sense input of the L6506 a resistor is recommended; if the connections between the outputs of the L6506 and the inputs of the L6203 need a long path, a resistor must be added between each input of the L6203 and ground. A snubber network made by the series of R and C must be foreseen very near to the output pins of the I.C.; one diode (BYW98) is connected between each power output pin and ground as well. The following formulas can be used to calculate the snubber values: R ≅ VS/lp C = lp/(dV/dt) where: VS is the maximum Supply Voltage foreseen on the application; Ip is the peak of the load current; dv/dt is the limited rise time of the output voltage (200V/µs is generally used). If the Power Supply Cannot Sink Current, a suitable large capacitor must be used and connected near the supply pin of the L6203. Sometimes a capacitor at pin 17 of the L6506 let the application better work. For motor current up to 2A max., the L6202 can be used in a similar circuit configuration for which a typical Supply Voltage of 24V is recommended. L6201 - L6202 - L6203 BIPOLAR STEPPER MOTORS APPLICATIONS Bipolar stepper motors can be driven with one L6506 or L297, two full bridge BCD drivers and very few external components. Together these three chips form a complete microprocessor-tostepper motor interface is realized. As shown in Fig. 18 and Fig. 19, the controller connect directly to the two bridge BCD drivers. External component are minimalized: an R.C. network to set the chopper frequency, a resistive divider (R1; R2) to establish the comparator reference voltage and a snubber network made by R and C in series (See DC Motor Speed Control). Figure 18: Two Phase Bipolar Stepper Motor Control Circuit with Chopper Current Control L6201 L6201PS L6202 L6203 L6201 L6201PS L6202 L6203 Figure 19: Two Phase Bipolar Stepper Motor Control Circuit with Chopper Current Control and Translator L6201 L6201PS L6202 L6203 L6201 L6201PS L6202 L6203 13/20 L6201 - L6202 - L6203 It could be requested to drive a motor at VS lower than the minimum recommended one of 12V (See Electrical Characteristics); in this case, by accepting a possible small increas in the RDS (ON) resistance of the power output transistors at the lowest Supply Voltage value, may be a good solution the one shown in Fig. 20. Figure 21: Typical RTh J-amb vs. "On Board" Heatsink Area (L6201) Figure 20: L6201/1P/2/3 Used at a Supply Voltage Range Between 9 and 18V L6201 L6201PS L6202 L6203 THERMAL CHARACTERISTICS Thanks to the high efficiency of this device, often a true heatsink is not needed or it is simply obtained by means of a copper side on the P.C.B. (L6201/2). Under heavy conditions, the L6203 needs a suitable cooling. By using two square copper sides in a similar way as it shown in Fig. 23, Fig. 21 indicates how to choose the on board heatsink area when the L6201 total power dissipation is known since: RTh j-amb = (Tj max. – Tamb max) / Ptot Figure 22 shows the Transient Thermal Resistance vs. a single pulse time width. Figure 23 and 24 refer to the L6202. For the Multiwatt L6203 addition information is given by Figure 25 (Thermal Resistance JunctionAmbient vs. Total Power Dissipation) and Figure 26 (Peak Transient Thermal Resistance vs. Repetitive Pulse Width) while Figure 27 refers to the single pulse Transient Thermal Resistance. 14/20 Figure 22: Typical Transient RTH in Single Pulse Condition (L6201) Figurre 23: Typical RTh J-amb vs. Two "On Board" Square Heatsink (L6202) L6201 - L6202 - L6203 Figure 24: Typical Transient Thermal Resistance for Single Pulses (L6202) Figure 25: Typical RTh J-amb of Multiwatt Package vs. Total Power Dissipation Figure 26: Typical Transient Thermal Resistance for Single Pulses with and without Heatsink (L6203) Figure 27: Typical Transient Thermal Resistance versus Pulse Width and Duty Cycle (L6203) 15/20 L6201 - L6202 - L6203 mm DIM. MIN. a1 0.51 B 0.85 b b1 TYP. inch MAX. MIN. TYP. MAX. 0.020 1.40 0.033 0.50 0.38 0.055 0.020 0.50 D 0.015 0.020 24.80 0.976 E 8.80 0.346 e 2.54 0.100 e3 20.32 0.800 F 7.10 0.280 I 5.10 0.201 L OUTLINE AND MECHANICAL DATA 3.30 0.130 Powerdip 18 Z 16/20 2.54 0.100 L6201 - L6202 - L6203 mm inch OUTLINE AND MECHANICAL DATA DIM. MIN. TYP. MAX. MIN. TYP. MAX. A 2.35 2.65 0.093 0.104 A1 0.1 0.3 0.004 0.012 B 0.33 0.51 0.013 0.020 C 0.23 0.32 0.009 0.013 D 12.6 13 0.496 0.512 E 7.4 7.6 0.291 0.299 e 1.27 0.050 H 10 10.65 0.394 0.419 h 0.25 0.75 0.010 0.030 L 0.4 1.27 0.016 0.050 SO20 K 0˚ (min.)8˚ (max.) L h x 45˚ A B e A1 K C H D 20 11 E 1 0 1 SO20MEC 17/20 L6201 - L6202 - L6203 DIM. mm MIN. TYP. A a1 inch MAX. MIN. TYP. 3.6 0.1 0.142 0.3 a2 0.004 0.012 3.3 0.130 a3 0 0.1 0.000 0.004 b 0.4 0.53 0.016 0.021 c 0.23 0.32 0.009 0.013 D (1) 15.8 16 0.622 0.630 0.386 D1 9.4 9.8 0.370 E 13.9 14.5 0.547 e 1.27 e3 E1 (1) 0.570 0.450 11.1 E2 0.429 0.437 2.9 0.114 E3 5.8 6.2 0.228 0.244 G 0 0.1 0.000 0.004 H 15.5 15.9 0.610 h L 0.626 1.1 0.8 JEDEC MO-166 0.043 1.1 N Weight: 1.9gr 0.050 11.43 10.9 OUTLINE AND MECHANICAL DATA MAX. 0.031 0.043 8˚ (typ.) S 8˚ (max.) T 10 0.394 PowerSO20 (1) “D and E1” do not include mold flash or protusions. - Mold flash or protusions shall not exceed 0.15mm (0.006”) - Critical dimensions: “E”, “G” and “a3”. N R N a2 b A e DETAIL A c a1 DETAIL B E e3 H DETAIL A lead D slug a3 DETAIL B 20 11 0.35 Gage Plane -C- S SEATING PLANE L G E2 E1 BOTTOM VIEW C (COPLANARITY) T E3 1 h x 45 10 PSO20MEC D1 0056635 18/20 L6201 - L6202 - L6203 mm DIM. MIN. TYP. inch MAX. MIN. TYP. MAX. A 5 0.197 B 2.65 0.104 C 1.6 D OUTLINE AND MECHANICAL DATA 0.063 1 0.039 E 0.49 0.55 0.019 0.022 F 0.88 0.95 0.035 0.037 G 1.45 1.7 1.95 0.057 0.067 0.077 G1 16.75 17 17.25 0.659 0.669 0.679 H1 19.6 0.772 H2 20.2 0.795 L 21.9 22.2 22.5 0.862 0.874 0.886 L1 21.7 22.1 22.5 0.854 0.87 0.886 L2 17.4 18.1 0.685 L3 17.25 17.5 17.75 0.679 0.689 0.713 0.699 L4 10.3 10.7 10.9 0.406 0.421 0.429 L7 2.65 2.9 0.104 M 4.25 4.55 4.85 0.167 0.179 0.191 0.114 M1 4.73 5.08 5.43 0.186 0.200 0.214 S 1.9 2.6 0.075 0.102 S1 1.9 2.6 0.075 0.102 Dia1 3.65 3.85 0.144 0.152 Multiwatt11 V 19/20 L6201 - L6202 - L6203 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specification mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics © 2003 STMicroelectronics – Printed in Italy – All Rights Reserved STMicroelectronics GROUP OF COMPANIES Australia - Brazil - Canada - China - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco Singapore - Spain - Sweden - Switzerland - United Kingdom - United States. http://www.st.com 20/20