ECMF02-3HSM6

ECMF02-3HSM6 Common mode filter with ESD protection for MHL/USB2.0/USB3.0 interface Datasheet - production data Features • Provides -20 dB attenuation at 700 MHz in LTE bands • High common mode attenuation: – -25 dB at 800 MHz – -10 dB at 2GHz • Very low PCB space consumption • Thin package: 0.55 mm max. • Lead-free package µQFN-6L 1.6 x 1.35 mm • High reduction of parasitic elements through integration. Complies with the following standards: Figure 1. Pin configuration (top view) D1+ 1 6 D1+ D1- 2 5 D1- • IEC 61000-4-2 level 4: – ±15 kV (air discharge) – ±8 kV (contact discharge) Applications • Mobile phones • Notebook, laptop • Portable devices ID 3 4 GND • PND Description This device is a highly integrated common mode filter designed to suppress EMI/RFI common mode noise on high speed differential serial buses and complies with the MHL standard.The device can protect and filter a single differential lane. August 2014 This is information on a product in full production. DocID024843 Rev 2 1/14 www.st.com Characteristics 1 ECMF02-3HSM6 Characteristics Table 1. Absolute maximum ratings (Tamb = 25 °C) Symbol Parameter Unit 8 16 kV 100 mA -40 to +85 °C 125 °C - 55 to +150 °C IEC 61000-4-2 Contact discharge (connector side) Air discharge (connector side) VPP Peak pulse voltage IDC Maximum DC current Top Operating temperature range Tj Value Maximum junction temperature Tstg Storage temperature range Figure 2. Electrical characteristics (definitions) I Symbol VBR IRM VRM IR Parameter Breakdown voltage Leakage current @ VRM Stand-off voltage Breakdown current = = = = VBR VRM V IRM IR Table 2. Electrical characteristics (Tamb = 25 °C) Symbol 2/14 Test conditions VBR IR = 1 mA IRM VRM = 3 V per line RDC DC serial resistance Min. Typ. Max. 6 DocID024843 Rev 2 Unit V 100 5 nA Ω ECMF02-3HSM6 Characteristics Figure 3. Differential attenuation versus frequency (Z0 diff = 100 Ω) SDD21 (dB) 0 -1 -2 -3 -4 F (Hz) -5 10M 30M 100M 300M 1G 3G Figure 4. Common mode attenuation versus frequency (Z0 com = 50 Ω) SCC21 (dB) 0 -5 -10 -15 -20 -25 -30 -35 F (Hz) -40 10M 30M 100M DocID024843 Rev 2 300M 1G 3G 3/14 14 Characteristics ECMF02-3HSM6 Figure 5. Return loss versus frequency (Z0 com = 50 Ω) SDDxx (dB) 0 -5 -10 -15 -20 -25 -30 -35 F (Hz) -40 10M 30M 100M SDD11 300M 1G 3G SDD22 Figure 6. Differential (ZDD21) and common mode (ZCC21) impedance versus frequency ZDD21 1E4 ZCC21 (Ω) 1E3 1E2 1E1 F (Hz) 1E7 4/14 1E8 DocID024843 Rev 2 1E9 6E9 ECMF02-3HSM6 Characteristics Figure 7. ESD response to IEC61000-4-2 (+8 kV contact discharge) on data lane 20 V/div 1 2 3 4 VPP: ESD peak voltage VCL :clamping voltage @ 30 ns VCL :clamping voltage @ 60 ns VCL :clamping voltage @ 100 ns 1 71.2 V 3 19.6 V 4 14.3 V 2 27.7 V 20 ns/div Figure 8. ESD response to IEC61000-4-2 (-8 kV contact discharge) on data lane 20 V/div 2 -15.8 V 3 -13.6 V 4 -3.1 V 1 -71.7 V 1 2 3 4 VPP: ESD peak voltage VCL :clamping voltage @ 30 ns VCL :clamping voltage @ 60 ns VCL :clamping voltage @ 100 ns 20 ns/div DocID024843 Rev 2 5/14 14 Characteristics ECMF02-3HSM6 Figure 9. ESD response to IEC61000-4-2 (+8 kV contact discharge) on ID pin 20 V/div 1 136.8 V 1 2 3 4 2 27.6 V VPP: ESD peak voltage VCL :clamping voltage @ 30 ns VCL :clamping voltage @ 60 ns VCL :clamping voltage @ 100 ns 4 15.3 V 3 23.7 V 20 ns/div Figure 10. ESD response to IEC61000-4-2 (-8 kV contact discharge) on ID pin 20 V/div 2 -17.5 V 3 -12 V 4 -3.7 V 1 2 3 4 VPP: ESD peak voltage VCL :clamping voltage @ 30 ns VCL :clamping voltage @ 60 ns VCL :clamping voltage @ 100 ns 1 -112.5 V 20 ns/div 6/14 DocID024843 Rev 2 ECMF02-3HSM6 Characteristics Figure 11. USB2.0 480 Mbps eye diagram without device Figure 12. USB2.0 480 Mbps eye diagram with device Thru ECMF02-3HSM6 Figure 13. USB3.0 5 Gbps eye diagram without device Figure 14. USB3.0 5 Gbps eye diagram with device Thru ECMF02-3HSM6 250 mV/c 33.4 ps/c 33.4 ps/c Figure 15. MHL 2.25 Mbps eye diagram without device 250 mV/c Figure 16. MHL 2.25 Mbps eye diagram with device Thru ECMF02-3HSM6 DocID024843 Rev 2 7/14 14 Characteristics ECMF02-3HSM6 Figure 17. TDR 120 Z (ohm) Before compensation 110 MHL template 100 After compensation 90 time (ns) 80 0.0 8/14 0.2 0.4 0.6 0.8 1.0 1.2 1.4 DocID024843 Rev 2 1.6 1.8 2.0 2.2 2.4 ECMF02-3HSM6 2 Application information Application information Figure 18. USB and MHL schematic USB connector ECMF02-3HSM6 USB controller D+ D+ D- D- ID GND ID More application information available in following AN: • Application Note AN4356: "Antenna desense on handheld equipment" • Application Note AN4511: "Common Mode filters" • Application Note AN4540: "MHL link filtering and protection" DocID024843 Rev 2 9/14 14 PCB layout recommendations 3 ECMF02-3HSM6 PCB layout recommendations Figure 19. PCB layout recommendations 100 µm 100 µm Connector Host 4000 µm 4000 µm 300 µm 200 µm 400 µm 300 µm Figure 20. PCB stack dimensions 40 µm 105 µm εr = 4.28 10/14 DocID024843 Rev 2 ECMF02-3HSM6 4 Package information Package information • Epoxy meets UL94, V0 • Lead-free package In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Figure 21. µQFN-6L dimension definitions Top view D Index area E Side view A1 A Bottom view e 1 3 6 4 b PIN # 1 ID L Table 3. µQFN-6L dimension values Dimensions Ref. Millimeters Inches Min. Typ. Max. Min. Typ. Max. A 0.45 0.50 0.55 0.018 0.020 0.022 A1 0.00 0.02 0.05 0.00 0.0008 0.002 b 0.15 0.20 0.25 0.006 0.008 0.010 D 1.55 1.60 1.65 0.061 0.063 0.065 E 1.30 1.35 1.40 0.051 0.053 0.055 e 0.45 0.50 0.55 0.018 0.020 0.022 L 0.40 0.50 0.60 0.016 0.020 0.024 DocID024843 Rev 2 11/14 14 Package information ECMF02-3HSM6 Figure 22. Footprint Figure 23. Marking 1.20 0.20 0.70 KM 1.75 0.50 Note: Product marking may be rotated by multiples of 90° for assembly plant differentiation. In no case should this product marking be used to orient the component for its placement on a PCB. Only pin 1 mark is to be used for this purpose. Figure 24. Tape and reel specifications Dot identifying Pin A1 location 2.0 Ø 1.55 4.0 8.0 3.5 1.90 1.75 0.22 1.60 4.0 0.75 All dimensions are typical values in mm 12/14 User direction of unreeling DocID024843 Rev 2 ECMF02-3HSM6 5 Ordering information Ordering information Figure 25. Ordering information scheme ECMF 02 - 3 HS M6 Function Common mode filter with ESD protection Number of lines 02 = 2 filtered lines Number of ESD protected lines 3 lines with ESD protection Version HS = High speed Package M6 = µQFN-6L Table 4. Ordering information Order code Marking(1) Package Weight Base qty Delivery mode ECMF02-3HSM6 KM µQFN-6L 3.03 mg 3000 Tape and reel 1. The marking can be rotated by multiples of 90° to differentiate assembly location 6 Revision history Table 5. Document revision history Date Revision Changes 02-Oct-2013 1 Initial release. 25-Aug-2014 2 Added Figure 6: Differential (ZDD21) and common mode (ZCC21) impedance versus frequency. DocID024843 Rev 2 13/14 14 ECMF02-3HSM6 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2014 STMicroelectronics – All rights reserved 14/14 DocID024843 Rev 2