ECMF04-4HSM10Y

ECMF04-4HSM10Y Datasheet Automotive common mode filter with ESD protection Features • • • D1+ Con 1 10 D1+ IC D1- Con 2 9 D1- IC GND 3 8 GND D2+ Con 4 7 D2+ IC D2- Con 5 6 D2- IC • • • • Complies with the following standards • • • • • Product status link ECMF04-4HSM10Y Product summary Order code ECMF04-4HSM10Y AEC-Q101 qualified 2.2 GHz differential bandwidth to comply with HDMI 1.4, USB 3.1, MIPI, display port Common mode attenuation on LTE, GSM, and GPS frequencies: – -20 dB at 0.7 GHz – -25 dB from 0.8 to 0.9 GHz – -14 dB at 1.5 GHz Wettable flank for automatic optical inspection Low PCB space consumption: 3.5 mm² Thin package for compact applications: 0.75 mm RoHS package • UL94, V0 J-STD-020 MSL level 1 J-STD-002 IPC7531 footprint and JEDEC registered package ISO 10605, IEC 61000-4-2, C = 150 pF – R = 330 Ω level 4: – 8 kV (contact discharge) – 15 kV (air discharge) ISO 10605, C = 330 pF – R = 330 Ω level 4: – 8 kV (contact discharge) – 15 kV (air discharge) Description The ECMF04-4HSM10Y is an integrated common mode filter designed to suppress EMI/RFI common mode noise on high speed buses HDMI 1.4, USB 3.1 and MIPI. It is designed to replace discrete common mode chokes or LTCC. The device embeds ESD protections on connector side to meets ISO 10605 requirements. Packaged in QFN-10L with wettable flank, it is compatible with automatic visual inspection. DS12743 - Rev 2 - December 2019 For further information contact your local STMicroelectronics sales office. www.st.com ECMF04-4HSM10Y Characteristics 1 Characteristics Table 1. Absolute maximum ratings (Tamb = 25 °C) Symbol Parameter Value Unit Contact discharge 8 kV Air discharge 15 ISO 10605 (C = 330 pF, R = 330 Ω): VPP Peak pulse voltage ISO10605 / IEC 61000-4-2 (C = 150 pF, R = 330 Ω): Contact discharge 8 Air discharge 15 IRMS RMS current Top Operating ambient temperature range -55 to +125 Tstg Storage temperature range -55 to +150 100 mA °C Figure 1. Electrical characteristics (definitions) I VRM VCL IRM IPP VBR Maximum stand-off voltage Clamping voltage at peak pulse current IPP Leakage current at VRM Peak pulse current Breakdown voltage RDC DC serial resistance fC Differential cut off frequency IPP IR IRM V VRM VBR VCL Table 2. Electrical characteristics (Tamb = 25 °C) Symbol Min. Typ. 6 7 Max. Unit VBR IR = 1 mA IRM VRM = 3 V RDC IDC = 20 mA 5.5 Ω SDD21 = -3 dB 2.2 GHz 8 kV contact discharge after 30 ns, ISO 10605 (150 pF – 330 Ω) 27 V fc VCL DS12743 - Rev 2 Test conditions V 100 nA page 2/11 ECMF04-4HSM10Y Characteristics (curves) 1.1 Characteristics (curves) Figure 2. Differential attenuation versus frequency (Z0_diff = 100 Ω) 0 Figure 3. Common mode attenuation versus frequency (Z0_com = 50 Ω) SDD21 (dB) 0 SCC21 (dB) -5 -1 -10 -15 -2 -20 -3 -25 -30 -4 -35 F (Hz) F (Hz) -40 -5 10M 30M 100M 300M 1G 10M 3G 30M 100M 300M 1G 3G Figure 4. ISO 10605 - C = 150 pF, R = 330 Ω (+8 kV contact) Figure 5. ISO 10605 - C = 150 pF, R = 330 Ω (-8 kV contact) Figure 6. TLP characteristic 20 I(A) 15 10 5 0 -5 -10 -15 V(V) -20 -40 DS12743 - Rev 2 -30 -20 -10 0 10 20 30 40 page 3/11 ECMF04-4HSM10Y Characteristics (curves) Figure 7. HDMI1.4 – 1.485 Gbps eye diagram without device Figure 8. HDMI1.4 – 1.485 Gbps eye diagram with device Figure 9. MIPI - 5.83 Gbps eye diagram without device Figure 10. MIPI - 5.83 Gbps eye diagram with device Figure 11. USB3.1 – 5 Gbps eye diagram without device (with worst cable and equalizer) Figure 12. USB3.1 – 5 Gbps eye diagram with device (with worst cable and equalizer) DS12743 - Rev 2 page 4/11 ECMF04-4HSM10Y Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 2.1 QFN-10L package information Figure 13. QFN-10L package outline L A 1 1 10(N) D e 5 6 A1 b A3 E Seating plane CD CW Table 3. QFN-10L mechanical data Dimensions Ref. Inches(1) Millimeters Min. Typ. Max. Min. Typ. Max. A 0.70 0.75 0.80 0.0275 0.0295 0.0315 A1 0.00 0.02 0.05 0.0000 0.0008 0.0020 A3 0.20 0.0079 b 0.15 0.20 0.25 0.0059 0.0079 0.0099 D 2.55 2.60 2.65 0.1003 0.1024 0.1044 E 1.30 1.35 1.40 0.0511 0.0531 0.0552 e 0.50 0.0197 L 0.45 0.50 0.55 0.0177 0.0197 0.0217 CW 0.01 0.05 0.09 0.0003 0.0020 0.0032 CD 0.10 0.0039 1. Value in inches are converted from mm and rounded to 4 decimal digits DS12743 - Rev 2 page 5/11 ECMF04-4HSM10Y PCB assembly recommendations 3 PCB assembly recommendation Figure 14. Recommended PCB layout Host 170 µm Connector 170 µm Differential lanes (Z0 = 100 ) Pad layout 5000 µm 150 µm 350 µm 350 µm Differential lanes (Z0 = 100 ) 330 µm Figure 15. Recommended PCB stack-up Figure 16. Recommended stencil opening (mm) 0.190 1.710 0.660 0.500 2.190 Stencil opening thickness: 100 µm Figure 17. Wettable flank profile 3.1 Solder paste 1. 2. 3. 4. DS12743 - Rev 2 Halide-free flux qualification ROL0 according to ANSI/J-STD-004. “No clean” solder paste is recommended. Offers a high tack force to resist component movement during high speed. Use solder paste with fine particles: powder particle size is 20-38 μm. page 6/11 ECMF04-4HSM10Y QFN-10L packing information 3.2 QFN-10L packing information Figure 19. Marking Figure 18. Footprint recommendations (mm) 0.200 0.500 1.750 0.700 XXYM Dot indicates pin 1 XX: Marking Y: Year M: Month 2.200 Figure 20. Package orientation in reel Figure 21. Tape and reel orientation Pin 1 located according to EIA-481 Note: Pocket dimensions are not on scale Pocket shape may vary depending on package Figure 22. Reel dimensions (mm) Figure 23. Inner box dimensions (mm) 30 Ø 180 max 14.4 2±0.5 Ø 13 Ø 60 Ø 20.2 min 205 205 DS12743 - Rev 2 page 7/11 ECMF04-4HSM10Y Solder reflow Figure 24. Tape and reel outline Table 4. Tape and reel mechanical data Dimensions Ref. 3.3 Millimeters Min. Typ. Max. ØD0 1.40 1.50 1.50 ØD1 0.80 F 1.65 1.75 1.85 K0 0.85 0.95 1.05 P0 3.9 4.0 4.1 P1 3.9 4.0 4.1 P2 1.95 2.00 2.05 W 7.9 8.0 8.3 Solder reflow Figure 25. ST ECOPACK® recommended soldering reflow profile for PCB mounting 250 240-245 °C Temperature (°C) -2 °C/s 2 - 3 °C/s 60 sec (90 m ax) 200 -3 °C/s 150 -6 ° C/s 100 0.9 °C/s 50 Time (s) 0 Note: DS12743 - Rev 2 30 60 90 120 150 180 210 240 270 300 Minimize air convection currents in the reflow oven to avoid component movement. Maximum soldering profile corresponds to the latest IPC/JEDEC J-STD-020. page 8/11 ECMF04-4HSM10Y Ordering information 4 Ordering information Order code Marking Package Weight Base qty. Delivery mode ECMF04-4HSM10Y AY(1) QFN-10L 7 mg 3000 Tape and reel 1. The marking can be rotated by 90° to differentiate assembly location DS12743 - Rev 2 page 9/11 ECMF04-4HSM10Y Revision history Table 5. Document revision history DS12743 - Rev 2 Date Version Changes 06-Sep-2018 1 Initial release. 09-Dec-2019 2 Added Stencil opening design and Section 3.1 . page 10/11 ECMF04-4HSM10Y IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2019 STMicroelectronics – All rights reserved DS12743 - Rev 2 page 11/11