ECMF04-4HSWM10Y
Datasheet
Automotive common mode filter with ESD protection
Features
•
•
•
D1+ Con
1
10 D1+ IC
D1- Con
2
9 D1- IC
GND 3
8 GND
D2+ Con
4
7 D2+ IC
D2- Con
5
6 D2- IC
•
•
•
•
AEC-Q101 qualified
3.5 GHz differential bandwidth to comply with HDMI 2.0, HDMI 1.4, USB 3.1,
MIPI and LVDS
Common mode attenuation on LTE, GSM, and GPS frequencies:
–
-13 dB at 0.7 GHz
–
-24 dB at 1.5 GHz
–
-30 dB at 2.4 GHZ
–
-26 dB at 2.7 GHZ
–
-16 dB at 5.0 GHZ
Wettable flank for automatic optical inspection
Low PCB space consumption: 3.5 mm²
Thin package for compact applications: 0.75 mm
RoHS package
Complies with the following standards
Product status link
ECMF04-4HSWM10Y
Product summary
Order code
ECMF04-4HSWM10Y
•
•
•
•
•
•
UL94, V0
J-STD-020 MSL level 1
J-STD-002
IPC7531 footprint and JEDEC registered package
ISO 10605, IEC 61000-4-2, C = 150 pF – R = 330 Ω level 4:
–
8 kV (contact discharge)
–
15 kV (air discharge)
ISO 10605, C = 330 pF – R = 330 Ω level 4:
–
8 kV (contact discharge)
–
15 kV (air discharge)
Description
The ECMF04-4HSWM10Y is an integrated common mode filter designed to suppress
EMI/RFI common mode noise on high speed buses HDMI 1.4, USB 3.1 and MIPI. It
is designed to replace discrete common mode chokes or LTCC.
The device embeds ESD protections on connector side to meets ISO 10605
requirements.
Packaged in QFN-10L with wettable flank, it is compatible with automatic visual
inspection.
DS12859 - Rev 1 - December 2019
For further information contact your local STMicroelectronics sales office.
www.st.com
ECMF04-4HSWM10Y
Characteristics
1
Characteristics
Table 1. Absolute maximum ratings (Tamb = 25 °C)
Symbol
Parameter
Value
Unit
Contact discharge
8
kV
Air discharge
15
ISO 10605 (C = 330 pF, R = 330 Ω):
VPP
Peak pulse voltage
ISO10605 / IEC 61000-4-2 (C = 150 pF, R = 330 Ω):
Contact discharge
8
kV
Air discharge
15
IRMS
RMS current
Top
Operating ambient temperature range
-55 to +125
Tstg
Storage temperature range
-55 to +150
100
mA
°C
Figure 1. Electrical characteristics (definitions)
I
VRM
VCL
IRM
IPP
VBR
Maximum stand-off voltage
Clamping voltage at peak pulse current IPP
Leakage current at VRM
Peak pulse current
Breakdown voltage
RDC
DC serial resistance
fC
Differential cut off frequency
IPP
IR
IRM
V
VRM VBR VCL
Table 2. Electrical characteristics (Tamb = 25 °C)
Symbol
Min.
Typ.
6
7
Max.
Unit
VBR
IR = 1 mA
IRM
VRM = 3 V
RDC
IDC = 20 mA
5.5
Ω
SDD21 = -3 dB
3.5
GHz
8 kV contact discharge after 30 ns, ISO 10605 (150 pF – 330 Ω)
27
V
fc
VCL
DS12859 - Rev 1
Test conditions
V
100
nA
page 2/12
ECMF04-4HSWM10Y
Characteristics (curves)
1.1
Characteristics (curves)
Figure 2. Differential attenuation versus frequency
(Z0_diff = 100 Ω)
Figure 3. Common mode attenuation versus frequency
(Z0_com = 50 Ω)
Figure 4. ISO 10605 - C = 150 pF, R = 330 Ω (+8 kV contact) Figure 5. ISO 10605 - C = 150 pF, R = 330 Ω (-8 kV contact)
Figure 6. TLP characteristic
20
I(A)
15
10
5
0
-5
-10
-15
V(V)
-20
-40
DS12859 - Rev 1
-30
-20
-10
0
10
20
30
40
page 3/12
ECMF04-4HSWM10Y
Characteristics (curves)
Figure 7. HDMI1.4 – 1.485 Gbps eye diagram without
device
Figure 8. HDMI1.4 – 1.485 Gbps eye diagram with device
Figure 9. HDMI2.0 – 5.94 Gbps eye diagram without device
(with worst cable and equalizer)
Figure 10. HDMI2.0 – 5.94 Gbps eye diagram with device
(with worst cable and equalizer)
Figure 11. MIPI - 5.83 Gbps eye diagram without device
Figure 12. MIPI - 5.83 Gbps eye diagram with device
DS12859 - Rev 1
page 4/12
ECMF04-4HSWM10Y
Characteristics (curves)
Figure 13. USB3.1 – 5 Gbps eye diagram without device
(with worst cable and equalizer)
DS12859 - Rev 1
Figure 14. USB3.1 – 5 Gbps eye diagram with device (with
worst cable and equalizer)
page 5/12
ECMF04-4HSWM10Y
Package information
2
Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages,
depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product
status are available at: www.st.com. ECOPACK is an ST trademark.
2.1
QFN-10L package information
Figure 15. QFN-10L package outline
L
A
1
1
10(N)
D
e
5
6
A1
b
A3
E
Seating
plane
CD
CW
Table 3. QFN-10L mechanical data
Dimensions
Ref.
Inches(1)
Millimeters
Min.
Typ.
Max.
Min.
Typ.
Max.
A
0.70
0.75
0.80
0.0275
0.0295
0.0315
A1
0.00
0.02
0.05
0.0000
0.0008
0.0020
A3
0.20
0.0079
b
0.15
0.20
0.25
0.0059
0.0079
0.0099
D
2.55
2.60
2.65
0.1003
0.1024
0.1044
E
1.30
1.35
1.40
0.0511
0.0531
0.0552
e
0.50
0.0197
L
0.45
0.50
0.55
0.0177
0.0197
0.0217
CW
0.01
0.05
0.09
0.0003
0.0020
0.0032
CD
0.10
0.0039
1. Value in inches are converted from mm and rounded to 4 decimal digits
DS12859 - Rev 1
page 6/12
ECMF04-4HSWM10Y
PCB assembly recommendations
3
PCB assembly recommendations
Figure 16. Recommended PCB layout
Host
170 µm
Connector
170 µm
Differential
lanes
(Z0 = 100 )
Pad layout
5000 µm
150 µm
350 µm
350 µm
Differential
lanes
(Z0 = 100 )
330 µm
Figure 17. Recommended PCB stack-up
Figure 18. Recommended stencil opening (mm)
0.190
1.710
0.660
0.500
2.190
Stencil opening thickness: 100 µm
Figure 19. Wettable flank profile
3.1
Solder paste
1.
2.
3.
4.
DS12859 - Rev 1
Halide-free flux qualification ROL0 according to ANSI/J-STD-004.
“No clean” solder paste is recommended.
Offers a high tack force to resist component movement during high speed.
Use solder paste with fine particles: powder particle size is 20-38 μm.
page 7/12
ECMF04-4HSWM10Y
QFN-10L packing information
3.2
QFN-10L packing information
Figure 21. Marking
Figure 20. Footprint recommendations (mm)
0.200
0.500
1.750
0.700
XXYM
Dot indicates pin 1
XX: Marking
Y: Year
M: Month
2.200
Figure 22. Package orientation in reel
Figure 23. Tape and reel orientation
Pin 1 located according to EIA-481
Note:
Pocket dimensions are not on scale
Pocket shape may vary depending on package
Figure 24. Reel dimensions (mm)
Figure 25. Inner box dimensions (mm)
30
Ø 180 max
14.4
2±0.5
Ø 13
Ø 60
Ø 20.2 min
205
205
DS12859 - Rev 1
page 8/12
ECMF04-4HSWM10Y
Solder reflow
Figure 26. Tape and reel outline
Table 4. Tape and reel mechanical data
Dimensions
Ref.
3.3
Millimeters
Min.
Typ.
Max.
ØD0
1.40
1.50
1.50
ØD1
0.80
F
1.65
1.75
1.85
K0
0.85
0.95
1.05
P0
3.9
4.0
4.1
P1
3.9
4.0
4.1
P2
1.95
2.00
2.05
W
7.9
8.0
8.3
Solder reflow
Figure 27. ST ECOPACK® recommended soldering reflow profile for PCB mounting
250
240-245 °C
Temperature (°C)
-2 °C/s
2 - 3 °C/s
60 sec
(90 m ax)
200
-3 °C/s
150
-6 ° C/s
100
0.9 °C/s
50
Time (s)
0
Note:
DS12859 - Rev 1
30
60
90
120
150
180
210
240
270
300
Minimize air convection currents in the reflow oven to avoid component movement. Maximum soldering profile
corresponds to the latest IPC/JEDEC J-STD-020.
page 9/12
ECMF04-4HSWM10Y
Ordering information
4
Ordering information
Order code
Marking
Package
Weight
Base qty.
Delivery mode
ECMF04-4HSWM10Y
BY(1)
QFN-10L
7 mg
3000
Tape and reel
1. The marking can be rotated by 90° to differentiate assembly location
DS12859 - Rev 1
page 10/12
ECMF04-4HSWM10Y
Revision history
Table 5. Document revision history
DS12859 - Rev 1
Date
Version
17-Dec-2019
1
Changes
Initial release.
page 11/12
ECMF04-4HSWM10Y
IMPORTANT NOTICE – PLEASE READ CAREFULLY
STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST
products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST
products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement.
Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of
Purchasers’ products.
No license, express or implied, to any intellectual property right is granted by ST herein.
Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.
ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks. All other product or service
names are the property of their respective owners.
Information in this document supersedes and replaces information previously supplied in any prior versions of this document.
© 2019 STMicroelectronics – All rights reserved
DS12859 - Rev 1
page 12/12
很抱歉,暂时无法提供与“ECMF04-4HSWM10Y”相匹配的价格&库存,您可以联系我们找货
免费人工找货- 国内价格 香港价格
- 1+7.393081+0.89178
- 10+6.3863210+0.77034
- 100+4.42171100+0.53337
- 500+3.69430500+0.44562
- 1000+3.144081000+0.37925