ECMF4-2450A17M10

ECMF4-2450A17M10 Common mode filter with ESD protection for high speed serial interface Datasheet - production data Description The ECMF4-2450A17M10 is a highly integrated common mode filter and low pass filter designed to suppress WiFi differential and common mode noise on high speed differential serial buses like HDMI. The device can protect and filter 2 differential lanes. Figure 1: Pin configuration µQFN-10L 2.60 x 1.35 mm Features       High differential mode attenuation on WLAN frequencies :  -23 dB at 2.4 GHz and -32 dB at 5.0 GHz Large bandwidth: 1.7 GHz Very low PCB space consumption. Thin package: 0.55 mm max. Lead-free package. High reduction of parasitic elements through integration. D1+ 1 10 D1+ D1- 2 9 D1- GND 3 8 GND D2+ 4 7 D2+ D2- 5 6 D2- Applications       Set top box Streaming box HDMI stick Game console Notebook, laptop Portable devices November 2016 DocID030008 Rev 1 This is information on a product in full production. 1/13 www.st.com Characteristics 1 ECMF4-2450A17M10 Characteristics Table 1: Absolute maximum ratings (Tamb = 25 °C) Symbol Parameter Value Unit 8 15 kV mA IEC 61000-4-2: Contact discharge (connector side) Air discharge (connector side) VPP Peak pulse voltage IRMS Maximum RMS current 100 Top Operating temperature -40 to +85 Tj Maximum junction temperature Tstg 125 Storage temperature range °C -55 to +150 Figure 2: Electrical characteristics (definitions) Table 2: Electrical characteristics (Tamb = 25 °C) Symbol Test condition Min. Typ. 4.5 5.5 Unit VBR IR = 1 mA IRM VRM = 3 V per line RDC DC serial resistance 5.5 Ω -3 dB differential mode cut-off frequency 1.7 GHz Fc Cdiode [D+ or D-]/ GND Rd nA 10 IEC 61000 4-2, +8 kV contact (IPP = 16 A), measured at 30 ns 12.9 VD+/D- = 0 V, F = 2.5 GHz to 6 GHz 0.35 Dynamic resistance, tP = 100 ns V 100 IPP = 1 A, 8/20 µs VCL 2/13 Max. D+ or D- to GND 0.48 GND to D+ or D- 0.96 DocID030008 Rev 1 V 0.45 pF Ω ECMF4-2450A17M10 Characteristics Table 3: Pin description Pin number Description Pin number Description 1 D1+ (to connector) 6 D2- (to IC) 2 D1- (to connector) 7 D2+ (to IC) 3 GND 8 GND 4 D2+(to connector) 9 D1- (to IC) 5 D2- (to connector) 10 D1+ (to IC) DocID030008 Rev 1 3/13 Characteristics 1.1 ECMF4-2450A17M10 Characteristics (curves) Figure 3: Differential attenuation versus frequency (Z0 diff = 100 Ω) – evaluation board with SMA connector Figure 4: Common mode attenuation versus frequency (Z0 com = 50 Ω) Figure 5: ESD response to IEC61000-4-2 (+8 kV contact discharge) 4/13 DocID030008 Rev 1 ECMF4-2450A17M10 Characteristics Figure 6: ESD response to IEC61000-4-2 (-8 kV contact discharge) Figure 7: HDMI1.4 2.228 Gbps source eye diagram (without ECMF4-2450A17M10) Figure 8: HDMI1.4 2.228 Gbps source eye diagram (with ECMF4-2450A17M10) Figure 9: HDMI1.4 1.485 Gbps source eye diagram (without ECMF4-2450A17M10) Figure 10: HDMI1.4 1.485 Gbps source eye diagram (with ECMF4-2450A17M10) DocID030008 Rev 1 5/13 Application information 2 ECMF4-2450A17M10 Application information Figure 11: HDMI schematic ECMF4-2450A17M10 D0 ECMF4-2450A17M10 HDMI ASIC HDMI connector D1 D2 CLK HDMI2C1-6C1 6/13 DocID030008 Rev 1 Package information ECMF4-2450A17M10 3 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 3.1 µQFN10L package information Figure 12: µQFN10L package outline Table 4: µQFN10L package mechanical data Dimensions Ref. Millimeters Inches Min. Typ. Max. Min. Typ. Max. A 0.45 0.50 0.55 0.018 0.020 0.022 A1 0.00 0.02 0.05 0.00 0.0008 0.002 b 0.15 0.20 0.25 0.006 0.008 0.010 D 2.55 2.60 2.65 0.1 0.102 0.104 E 1.30 1.35 1.40 0.051 0.053 0.055 e L 0.50 0.40 0.50 0.020 0.60 DocID030008 Rev 1 0.016 0.020 0.024 7/13 Package information ECMF4-2450A17M10 Figure 14: Marking layout Figure 13: Footprint recommendations, dimensions in mm (inches) 0.20 0.70 ME 1.75 0.50 Product marking may be rotated by 90° for assembly plant differentiation. In no case should this product marking be used to orient the component for its placement on a PCB. Only pin 1 mark is to be used for this purpose. Figure 16: Tape and reel orientation Figure 15: Package orientation in reel Figure 17: Reel dimensions in mm 8/13 Figure 18: Inner box dimension definition in mm DocID030008 Rev 1 Package information ECMF4-2450A17M10 Figure 19: Tape dimension definitions Table 5: Tape and reel mechanical data Dimensions Ref. P1 Millimeters Min. Typ. Max. 3.9 4.0 4.1 P0 4.0 Ø D0 1.4 1.5 1.6 Ø D1 1 F 3.45 3.5 3.55 K0 0.6 0.7 0.8 P2 1.95 2 2.05 W 7.9 8 8.3 DocID030008 Rev 1 9/13 Recommendation on PCB assembly ECMF4-2450A17M10 4 Recommendation on PCB assembly 4.1 Solder paste 1. 2. 3. 4. 4.2 Placement 1. 2. 3. 4. 5. 6. 4.3 Manual positioning is not recommended. It is recommended to use the lead recognition capabilities of the placement system, not the outline centering Standard tolerance of ±0.05 mm is recommended. 3.5 N placement force is recommended. Too much placement force can lead to squeezed out solder paste and cause solder joints to short. Too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. To improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool. For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools. PCB design preference 1. 2. 10/13 Halide-free flux qualification ROL0 according to ANSI/J-STD-004. “No clean” solder paste is recommended. Offers a high tack force to resist component movement during high speed. Solder paste with fine particles: powder particle size is 20-45 μm. To control the solder paste amount, the closed via is recommended instead of open vias. The position of tracks and open vias in the solder area should be well balanced. The symmetrical layout is recommended, in case any tilt phenomena caused by asymmetrical solder paste amount due to the solder flow away. DocID030008 Rev 1 Recommendation on PCB assembly ECMF4-2450A17M10 4.4 Reflow profile Figure 20: ST ECOPACK® recommended soldering reflow profile for PCB mounting Minimize air convection currents in the reflow oven to avoid component movement. Maximum soldering profile corresponds to the latest IPC/JEDEC J-STD-020. DocID030008 Rev 1 11/13 Ordering information 5 ECMF4-2450A17M10 Ordering information Figure 21: Ordering information scheme ECMF 4 – 24 50 A 17 M10 Function Common mode filter with ESD protection Number of lines 4 = 4 filtered lines with ESD protection 1st common mode rejection 24 = 2.4 GHz 2nd common mode rejection 50 = 5.0 GHz Version A = 1st version Differential bandwidth 17 = 1.7 GHz Package M10: µQFN-10L Table 6: Ordering information 6 Order code Marking Package Weight Base qty. Delivery mode ECMF4-2450A17M10 ME µQFN-10L 5 mg 3000 Tape and reel Revision history Table 7: Document revision history 12/13 Date Revision 08-Nov-2016 1 Changes Initial release. DocID030008 Rev 1 ECMF4-2450A17M10 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2016 STMicroelectronics – All rights reserved DocID030008 Rev 1 13/13