EMIF02-MIC03M6

EMIF02-MIC03M6 2-line IPAD™, EMI filter and ESD protection for microphone Features Pin 1 ■ ■ ■ ■ ■ ■ ■ ■ EMI symmetrical (I/O) low-pass filter High efficiency in EMI filtering Very low PCB space consumption: 1.0 mm x 1.45 mm Very thin package: 0.6 mm max High efficiency in ESD suppression High reliability offered by monolithic integration High reduction of parasitic elements through integration and wafer level packaging Lead-free and halogen-free package Micro QFN 6 leads 1.45 mm x 1.00 mm (bottom view) Figure 1. Pin configuration (top view) Complies with following standards ■ IEC 61000-4-2 level 4, input and output pins ■ IEC 61000-4-2 level 4 requirements – 8 kV (contact discharge) or – 15 kV (air discharge) MICR in 1 6 MICR out GND 2 5 GND MICL in 3 4 MICL out Application ■ Mobile phones Description Figure 2. The EMIF02-MIC03M6 is a 2-line highly integrated device designed to suppress EMI/RFI noise in all systems exposed to electromagnetic interference. Basic cell configuration Low-pass filter Input This filter includes ESD protection circuitry, which prevents damage to the application when subjected to ESD surges up to 8 kV on all pins. Output GND GND GND R = 68 Ω, Cline = 45 pF typ. TM: IPAD is a trademark of STMicroelectronics May 2011 Doc ID 14448 Rev 2 1/11 www.st.com 11 Characteristics EMIF02-MIC03M6 1 Characteristics Table 1. Absolute ratings(1) Symbol VPP Tj Parameter Value Unit ESD discharge IEC61000-4-2 contact discharge ESD discharge IEC61000-4-2 air discharge(2) 8 15 kV Junction temperature 125 °C Top Operating temperature range -40 to + 85 °C Tstg Storage temperature range -55 to +150 °C 1. limiting values at Tamb = 25 °C unless otherwise specified 2. According to IEC61000-4-2 test conditions with ungrounded table top equipment set-up, PCB board on insulated plane (dimensions 25 x 25 mm2), 2 serial resistors of 470 kΩ to GND reference plane Table 2. Electrical characteristics (Tamb = 25 °C) Symbol Parameter I VBR Breakdown voltage IRM Leakage current @ VRM VRM Stand-off voltage VCL Clamping voltage Rd Dynamic resistance IPP Peak pulse current RI/O Series resistance between Input & Output Cline Input capacitance per line Symbol IPP VCL VBR VRM IR IRM IRM IR Test conditions VRM VBR VCL V IPP Min. Typ. 6 8 Max. Unit VBR IR = 1 mA IRM VRM = 3 V per line RI/O Tolerance ± 20% 68 Ω VR = 0 V, F = 1 MHz, VOSC = 30 mV 45 pF Cline (1) 500 1. Tolerance ± 20% 2/11 V Doc ID 14448 Rev 2 nA EMIF02-MIC03M6 Figure 3. 0.00 Characteristics S21 attenuation measurement dB Figure 4. 0.00 -5.00 -10.00 -10.00 -20.00 -15.00 -30.00 Analog cross talk measurements (MIC R / MIC L) dB -40.00 -20.00 -50.00 -25.00 -60.00 -30.00 -80.00 300.0k -40.00 300.0k Figure 5. 1.0M 3.0M F (Hz) -70.00 F (Hz) -35.00 10.0M 30.0M 100.0M 300.0M 1.0G 3.0G ESD response to IEC 61000-4-2 (+8 kV contact discharge) on MIC lines Figure 6. 1.0M 3.0M Xtalk R- L 10.0M 30.0M 100.0M 300.0M 1.0G Xtalk L-R ESD response to IEC 61000-4-2 (-8 kV contact discharge) on MIC lines vi = 20 V/d Input 3.0G vi = 20 V/d Input vo = 10 V/d Output vo = 10 V/d Output 20 ns/d Doc ID 14448 Rev 2 20 ns/d 3/11 Ordering information scheme 2 EMIF02-MIC03M6 Ordering information scheme Figure 7. Ordering information scheme EMIF EMI Filter Number of lines Information xxx = application zz = version Package Mx = Micro QFN x leads 4/11 Doc ID 14448 Rev 2 yy - xxx zz Mx EMIF02-MIC03M6 3 Package information Package information ● Epoxy meets UL94, V0 ● Lead-free packages In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Table 3. Micro QFN 1.45 x 1.00 6L dimensions Dimensions D N Ref. Millimeters Inches E 1 Min. Typ. Max. Min. A 0.50 0.55 0.60 0.020 0.022 0.024 A1 0.00 0.02 0.05 0.000 0.001 0.002 b 0.18 0.25 0.30 0.007 0.010 0.012 2 A A1 1 2 L k Typ. D 1.45 0.057 E 1.00 0.039 e 0.50 0.020 Max. b e Figure 8. Footprint in mm [inches] 0.50 [0.020] K 0.20 L 0.30 Figure 9. 0.25 [0.010] 0.008 0.35 0.40 0.012 0.014 0.016 Marking Dot : Pi n 1 Identification 0.60 [0.023] 0.30 1.60 [0.012] [0.063] Doc ID 14448 Rev 2 L 5/11 Package information EMIF02-MIC03M6 Figure 10. Tape and reel specification Dot identifying pin 1 location 3.5 +/- 0.03 1.65 8.0 +/- 0.3 0.75 All dimensions in mm Note: 6/11 φ 1.5 +/- 0.1 4.00+/-0.1 1.75 +/- 0.1 2.0+/-0.05 L L 1.20 L 4.00 User direction of unreeling Product marking may be rotated by 90° for assembly plant differentiation. In no case should this product marking be used to orient the component for its placement on a PCB. Only pin 1 mark is to be used for this purpose. Doc ID 14448 Rev 2 EMIF02-MIC03M6 Recommendation on PCB assembly 4 Recommendation on PCB assembly 4.1 Stencil opening design 1. General recommendation on stencil opening design a) Stencil opening dimensions: L (Length), W (Width), T (Thickness). Figure 11. Stencil opening dimensions L T b) W General design rule Stencil thickness (T) = 75 ~ 125 µm W Aspect Ratio = ----- ≥ 1.5 T L×W Aspect Area = ---------------------------- ≥ 0.66 2T ( L + W ) 2. Reference design a) Stencil opening thickness: 100 µm b) Stencil opening for leads: Opening to footprint ratio is 90%. Figure 12. Recommended stencil window position 7 µm 7 µm 620 µm 650 µm 15 µm 236 µm 15 µm Footprint 250 µm Stencil window Footprint Doc ID 14448 Rev 2 7/11 Recommendation on PCB assembly 4.2 4.3 4.4 8/11 EMIF02-MIC03M6 Solder paste 1. Halide-free flux qualification ROL0 according to ANSI/J-STD-004. 2. “No clean” solder paste is recommended. 3. Offers a high tack force to resist component movement during high speed. 4. Solder paste with fine particles: powder particle size is 20-45 µm. Placement 1. Manual positioning is not recommended. 2. It is recommended to use the lead recognition capabilities of the placement system, not the outline centering. 3. Standard tolerance of ± 0.05 mm is recommended. 4. 3.5 N placement force is recommended. Too much placement force can lead to squeezed out solder paste and cause solder joints to short. Too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. 5. To improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool. 6. For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools. PCB design preference 1. To control the solder paste amount, the closed via is recommended instead of open vias. 2. The position of tracks and open vias in the solder area should be well balanced. The symmetrical layout is recommended, in case any tilt phenomena caused by asymmetrical solder paste amount due to the solder flow away. Doc ID 14448 Rev 2 EMIF02-MIC03M6 4.5 Recommendation on PCB assembly Reflow profile Figure 13. ST ECOPACK® recommended soldering reflow profile for PCB mounting Temperature (°C) 260°C max 255°C 220°C 180°C 125 °C 2°C/s recommended 2°C/s recommended 6°C/s max 6°C/s max 3°C/s max 3°C/s max 0 0 1 2 3 4 5 10-30 sec 90 to 150 sec Note: 6 7 Time (min) 90 sec max Minimize air convection currents in the reflow oven to avoid component movement. Doc ID 14448 Rev 2 9/11 Ordering information 5 EMIF02-MIC03M6 Ordering information Table 4. Ordering information Order code Marking Package Weight Base qty Delivery mode EMIF02-MIC03M6 L(1) Micro QFN 2.2 mg 3000 Tape and reel (7”) 1. The marking can be rotated by 90° to differentiate assembly location 6 Revision history Table 5. 10/11 Document revision history Date Revision Changes 13-Feb-2008 1 Initial release 27-May-2011 2 Updated ECOPACK statement. Updated n: IEC 61000-4-2 level 4 requirements on page 1. Added note 2. on page 2 . Updated title Figure 5. and Figure 6. on page 3. Doc ID 14448 Rev 2 EMIF02-MIC03M6 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. 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