EMIF03-SIM02C2

EMIF03-SIM02C2 3-line IPAD™ EMI filter including ESD protection Features ■ EMI symmetrical (I/O) low-pass filter ■ high efficiency in EMI filtering ■ lead-free coated package ■ very low PCB space occupation: – 1.42 mm x 1.42 mm ■ very thin package: 0.65 mm ■ high efficiency in ESD suppression ■ high reliability offered by monolithic integration ■ high reduction of parasitic elements through integration and wafer level packaging Coated Flip-Chip package (8 bumps) Complies with following standards: ■ IEC 61000-4-2 level 4 on external and VCC pins: – 15 kV (air discharge) – 8 kV (contact discharge) Figure 1. Pin configuration (bump side) 3 2 RST in RST ext Applications CLK in Gnd CLK ext B Where EMI filtering in ESD sensitive equipment is required: Data in VCC Data ext C ■ MIL STD 883G - Method 3015-7 Class 3 ■ SIM Interface (subscriber identify module) ■ UIM Interface (universal identify module) 1 A Description The EMIF03-SIM02C2 is a highly integrated device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interference. The EMIF03 Flip-Chip packaging means the package size is equal to the die size. This filter includes an ESD protection circuitry which protects the application from damage when subjected to ESD surges up 15 kV. TM: IPAD is a trademark of STMicroelectronics September 2010 Doc ID 13251 Rev 3 1/8 www.st.com 8 Characteristics 1 EMIF03-SIM02C2 Characteristics Figure 2. Basic cell configuration VCC 100 Ω RST in RST ext R1 47 Ω CLK in CLK ext R2 100 Ω Data ext Data in R3 Cline = 20pF max. GND Table 1. Absolute ratings (limiting values) Symbol Parameter Value Unit Internal pins (A3, B3, C3): ESD discharge IEC61000-4-2, air discharge ESD discharge IEC61000-4-2, contact discharge External pins (A2, B1, C2, C1): ESD discharge IEC61000-4-2, air discharge ESD discharge IEC61000-4-2, contact discharge 15 8 Tj Maximum junction temperature 125 °C Top Operating temperature range -40 to +85 °C Tstg Storage temperature range -55 to +150 °C VPP Figure 3. 2 2 kV Electrical characteristics (definitions) I Symbol VBR VCL IRM VRM IF IPP IR VF = = = = = = = = Parameter Breakdown voltage Clamping voltage Leakage current @ VRM Stand-off voltage Forward current Peak pulse current Breakdown current Forward voltage drop IF VF VCL VBR VRM IRM IR IPP 2/8 Doc ID 13251 Rev 3 V EMIF03-SIM02C2 Characteristics Table 2. Electrical characteristics, parameter values Symbol Test conditions VBR IR = 1 mA IRM VRM = 3 V Min 6 Rd Max Unit 20 V 0.2 µA Ω 1.5 R1, R3 Tolerance ± 20% 100 R2 Tolerance ± 20% 47 Cline Figure 4. Typ VR = 0 V 20 S21 (dB) attenuation measurement Figure 5. (A2-A3 line) EMIF03-SIM02C2_FREQ-MEAS_PM428 Aplac 7.70 User: ST Microelectronics Sep 22 2004 pF S21 (dB) attenuation measurement (B1-B3 line) EMIF03-SIM02C2_FREQ-MEAS_PM428 Aplac 7.70 User: ST Microelectronics Sep 22 2004 0.00 0.00 dB dB -10.00 -10.00 -20.00 -20.00 -30.00 -30.00 -40.00 -40.00 100.0k 1.0M 10.0M 100.0M 1.0G 100.0k 1.0M 10.0M f/Hz Figure 6. 100.0M 1.0G f/Hz A2/A3 Line B1/B3 line S21 (dB) attenuation measurement Figure 7. (C1-C3 line) EMIF03-SIM02C2_FREQ-MEAS_PM428 Aplac 7.70 User: ST Microelectronics Sep 22 2004 Analog crosstalk measurements EMIF03-SIM02C2_FREQ-MEAS_PM428 Aplac 7.70 User: ST Microelectronics Sep 22 2004 0.00 0.00 dB -10.00 dB -20.00 -10.00 -30.00 -40.00 -20.00 -50.00 -60.00 -70.00 -30.00 -80.00 -90.00 -40.00 -100.00 100.0k 1.0M 10.0M 100.0M 1.0G 100.0k f/Hz 1.0M 10.0M 100.0M 1.0G f/Hz C1/C3 line Xtalk A2/B3 Doc ID 13251 Rev 3 3/8 Characteristics Figure 8. EMIF03-SIM02C2 Figure 9. Voltages when IEC 61000-4-2 (+15 kV air discharge) applied to external pin Voltages when IEC 61000-4-2 (-15 kV air discharge) applied to external pin Vexternal : 10V/d Vexternal : 5V/d Vinternal : 10V/d Vinternal : 5V/d 100ns/d 100ns/d Figure 10. Line capacitance versus reverse applied voltage (typical) C(pF) 20.00 16.00 12.00 8.00 4.00 VR(V) 0.00 0 1 2 3 4 5 Figure 11. Aplac model LbumpRbump 100 Rbump Lbump a2 Cbump Rsub bulk Lbump Rbump a3 Rsub Cbump bulk 47 Rbump Lbump b1 b3 Cbump Rsub bulk LbumpRbump Rsub Cbump bulk 100 Rbump Lbump c1 c3 Rsub Cbump bulk Dext2 Dint1 Dint1 Dext1 Dext1 0.25 0.28 bulk Rsub Cbump Dint2 0.25 0.29 0.31 0.29 Bulk Lbump Ls 100m Rbump a2 100m Ls a3 Lgnd Port1 50 4/8 Cgnd Rgnd Doc ID 13251 Rev 3 Port2 50 EMIF03-SIM02C2 Ordering information scheme Figure 12. Aplac parameters Ls 950pH Rs 150m Cext1 15pF Cint1 4.5pF Cext2 14pF Cint2 4pF Rbump 20m Lbump 50pH Cbump 0.15pF Rgnd 500m Lgnd 50pH Cgnd 0.15pF Rsub 100m 2 Model Dint1 BV=15 CJO=Cint1 IBV=1u IKF=1000 IS=10f ISR=100p N=1 M=0.3333 RS=0.001m VJ=0.6 TT=50n Model Dext1 BV=15 CJO=Cext1 IBV=1u IKF=1000 IS=10f ISR=100p N=1 M=0.3333 RS=0.001m VJ=0.6 TT=50n Model Dint2 BV=15 CJO=Cint2 IBV=1u IKF=1000 IS=10f ISR=100p N=1 M=0.3333 RS=0.001m VJ=0.6 TT=50n Model Dext2 BV=15 CJO=Cext2 IBV=1u IKF=1000 IS=10f ISR=100p N=1 M=0.3333 RS=0.001m VJ=0.6 TT=50n Ordering information scheme Figure 13. Ordering information scheme EMIF yy - xxx zz Cx EMI filter Number of lines Information 3 letters = application 2 digits = version Package C = Coated Flip Chip x = 2: lead-free, pitch = 500 µm, bump = 315 µm Doc ID 13251 Rev 3 5/8 Package information 3 EMIF03-SIM02C2 Package information ● Epoxy meets UL94, V0 ● Lead-free package In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Figure 14. Flip-Chip dimensions 500µm ± 50 695µm ± 65 1.42mm ± 50µm 500µm ± 50 315µm ± 50 1.42mm ± 50µm Figure 15. Marking Figure 16. Footprint recommendation Dot, ST logo ECOPACK status xx = marking z = manufacturing location yww = datecode (y = year Copper pad Diameter: 250 µm recommended, 300 µm max Solder stencil opening: 330 µm x x z y ww 6/8 Doc ID 13251 Rev 3 Solder mask opening recommendation: 340 µm min for 315 µm copper pad diameter EMIF03-SIM02C2 Ordering information Figure 17. Flip-Chip tape and reel specification Dot identifying Pin A1 location 3.5 +/- 0.1 ST E xxz yww 4 +/- 0.1 User direction of unreeling All dimensions in mm Ordering information Table 3. 5 ST E xxz yww ST E xxz yww 8 +/- 0.3 0.78 +/- 0.05 4 1.75 +/- 0.1 Ø 1.5 +/- 0.1 4 +/- 0.1 Ordering information Ordering code Marking Package Weight Base qty Delivery mode EMIF03-SIM02C2 GR Flip Chip 3.04 mg 5000 7” Tape and reel Revision history Table 4. Document revision history Date Revision Changes 07-Feb-2007 1 Initial release. 21-Mar-2007 2 Updated weight in Ordering information. 02-Sep-2010 3 Updated marking in Table 3. 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