EMIF03-SIM06F3

EMIF03-SIM06F3 3-line IPAD™, EMI filter including ESD protection Datasheet  production data Description The EMIF03-SIM06F3 chip is a highly integrated audio filter device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interface. The filter included ESD protection circuitry, which prevents damage to the protected device when subjected to ESD surges up to 15 kV. Flip-chip package (11 bumps) Figure 1. Pin configuration (bump side) 1 2 3 Features A  EMI symmetrical (I/O) low-pass filter  High efficiency in ESD protection  Lead-free package B  Very thin package  High reliability offered by monolithic integration C  High reduction of parasitic elements through integration and wafer level packaging D Complies with the following standards:  IEC 61000-4-2 level 4 – ± 15 kV (air discharge) – ± 8 kV (contact discharge) Figure 2. Functional schematic  IEC 61000-4-2 level 1 – ± 2 kV (air discharge) – ± 2 kV (contact discharge) B1 47 W C1 R2 100 W A3 B3 C3 R3 A2 GND  Mobile phones and communication systems This is information on a product in full production. D3 R1 Where EMI filtering in ESD sensitive equipment is required: December 2013 D2 R4 100 W A1 Application  Computers, printers and MCU boards D1 10000 W C2 GND A2 and C2 bumps must be conneced together on the PCB DocID024459 Rev 1 1/7 www.st.com 7 Characteristics 1 EMIF03-SIM06F3 Characteristics Table 1. Absolute maximum ratings (Tamb = 25 °C) Symbol Parameter Value Internal pins (A1, B1, C1): ESD discharge IEC 61000-4-2(1), level 1 Air discharge Contact discharge External pins (A3, B3, C3, D1, D2, D3): ESD discharge IEC 61000-4-2(1), level 4 Air discharge Contact discharge VPP Unit 2 2 kV 20 20 Top Operating temperature range - 40 to + 85 Tstg Storage temperature range - 55 to 150 1. Measurements done on IEC 61000-4-2 test bench. For further details see Application note AN3353, “IEC 61000-4-2 standard testing”. Figure 3. Electrical characteristics (definitions) Symbol VBR = I RM = V RM = V CL = I PP = Cline = RI/O = P arameter Breakdown voltage Leakage current @ VRM Stand-off voltage Clamping voltage Peak pulse current Line capacitance Series resistance between input and ouptput VCL PP Table 2. Electrical characteristics (Tamb = 25 °C) Symbol IRM VRM = 3 V VBR IR = 1 mA Min. Typ. Max. Unit 50 nA 6 V R1, R3 Tolerance ±20% 100 R2 Tolerance ±20% 47 R4 Tolerance ±20% 10 Cline 2/7 Test conditions Vline = 0 V, Vosc = 30 mV, F = 10 MHz (measured under zero light conditions) DocID024459 Rev 1 8 10  k 12 pF EMIF03-SIM06F3 Characteristics Figure 4. Attenuation versus frequency S21(dB) 0 Figure 5. Analog crosstalk versus frequency XTalk (dB) 0 -5 -10 -10 -20 -15 -30 -20 -40 -25 -50 -30 -60 -35 F(Hz) F(Hz) -70 -40 1M 3M Data Rst 10M 30M 100M 300M 1G 3G 1M 3M Figure 6. ESD response to IEC 61000-4-2 (+8 kV contact discharge) 10.0 V / Div 10M 30M 100M Data-D1 Data-Rst Rst-D3 Clk 300M 1G 3G Data-Clk Rst-D2 Figure 7. ESD response to IEC 61000-4-2 (-8 kV contact discharge) 20.0 V / Div 1 VCL: Peak clamping voltage 2 VCL :clamping voltage @ 30 ns 3 VCL :clamping voltage @ 60 ns 4 VCL :clamping voltage @ 100 ns 1 -21.1 V 4 -6.8 V 1 VCL: Peak clamping voltage 2 VCL :clamping voltage @ 30 ns 3 VCL :clamping voltage @ 60 ns 4 VCL :clamping voltage @ 100 ns 1 22.6 V 2 14.0 V 3 -9.9 V 2 -10.5 V 3 11.1 V 4 6.8 V 20 ns / Div 20 ns / Div Figure 8. Line capacitance versus applied voltage C(pF) 16 14 12 10 8 6 4 2 bias (V) 0 0 2 4 D2 GND DocID024459 Rev 1 6 8 3/7 Package information 2 EMIF03-SIM06F3 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Figure 9. Flip-Chip package dimensions Æ 255 ± 40 µm 500 µm ± 50 400 ± 30 µm 1140 ± 30 µm 170 µm 170 µm 400 ± 30 µm 1540 ± 30 µm Figure 10. Footprint recommendations Copper pad Diameter: 220 µm recommended 260 µm maximum Solder mask opening: 300 µm minimum Solder stencil opening: 220 µm recommended 4/7 Figure 11. Marking Dot, ST logo ECOPACK® grade xx = marking z = manufacturing location yww = datecode (y = year ww = week) DocID024459 Rev 1 x x z y ww EMIF03-SIM06F3 Package information Figure 12. Tape and reel specification Dot identifying Pin A1 location Ø 1.50 2.0 4.0 8.0 3.5 1.65 1.75 0.20 1.28 0.59 All dimensions are typical values in mm Note: 4.0 User direction of unreeling More information is available in the application notes: AN2348, “IPAD™ 400 µm Flip Chip: package description and recommendations for use” AN1751, “EMI filters: recommendations and measurements” DocID024459 Rev 1 5/7 Ordering information 3 EMIF03-SIM06F3 Ordering information Figure 13. Ordering information scheme EMIF 03 - SIM 06 F3 EMI filter Number of lines Information 3 letters = application 2 digits = version Package F = Flip chip x = 3: Lead-free pitch = 400 µm, bump = 255 µm Table 3.Ordering information 4 Order code Marking Package Weight Base qty Delivery mode EMIF03-SIM06F3 KP Flip Chip 2.3 mg 5000 Tape and reel (7”) Revision history Table 4.Document revision history 6/7 Date Revision 19-Dec-2013 1 Changes Initial release DocID024459 Rev 1 EMIF03-SIM06F3 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. 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The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2013 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com DocID024459 Rev 1 7/7