EMIF05-SK01F3

EMIF05-SK01F3 5 line IPAD™, EMI filter including ESD protection Datasheet − production data Description The EMIF05-SK01F3 chip is a highly integrated filter device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interference. This filter includes ESD protection circuitry, which prevents damage to the protected device when subjected to ESD surges up to 15 kV. Flip Chip 11 bumps Features Figure 1. Pin configuration (bump view) • EMI (I/O) low-pass filter • High efficiency in EMI/ESD protection 1 2 3 I1 I2 O2 A O1 B • Very thin package I3 • Lead-free package • High reliability offered by monolithic integration I4 GND I5 O5 C O3 • High reduction of parasitic elements through integration and wafer level packaging O4 D Complies with the following standards: • IEC 61000-4-2 level 4: – ±15 kV (air discharge) – ±8 kV (contact discharge) Figure 2. Functional schematic 4.7 kW INPUT I1 to I5 • IEC 61000-4-2 level 1: – ±2 kV (air discharge) – ±2 kV (contact discharge) ESD level 4 (8 kV contact) Applications Table 1. Pin name • Mobile phones and communication systems TM: IPAD is a trademark of STMicroelectronics July 2014 This is information on a product in full production. 1 nF C2 GND Where EMI filtering in ESD sensitive equipment is required: • Computers, printers and MCU boards. OUTPUT O1 to O5 INPUT OUTPUT I1 (A1) O1 (B3) I2 (A2) O2 (A3) I3 (B1) O3(C3) I4 (C1) O4 (D3) I5 (D1) O5 (D2) DocID024489 Rev 1 1/7 www.st.com Characteristics 1 EMIF05-SK01F3 Characteristics Table 2. Absolute maximum ratings (Tamb = 25 °C) Symbol VPP Parameter Value External pins (A1, A2, B1, C1, D1): ESD discharge IEC 61000-4-2, level 4 Air discharge Contact discharge Internal pins (A3, B3, C3, D3, D2): ESD discharge IEC 61000-4-2(1), level 1 Air discharge Contact discharge Unit 15 8 kV 2 2 Top Operating temperature range - 40 to + 85 Tstg Storage temperature range - 55 to 150 °C 1. Measurements done on IEC 61000-4-2 test bench.For further details see Application note AN3353, “IEC 61000-4-2 standard testing”. Figure 3. Electrical characteristics (definitions) Symbol VBR = I RM = V RM = CX = RX = P arameter Breakdown voltage Leakage current at VRM Stand-off voltage Line capacitance Series resistance between input and ouptput Table 3. Electrical characteristics (Tamb = 25 °C) Symbol 2/7 Test conditions IRM VRM = 3 V VBR IR = 1 mA Min. Typ. 6 Max. Unit 200 nA 10 V R1, R2, R3, R4, R5 Vline = 0 V, Vosc = 30 mV, F = 1 MHz 4.23 4.7 5.17 κΩ C1, C2, C3, C4, C5 Vline = 0 V, Vosc = 30 mV, F = 1 MHz (measured under zero light conditions) 0.8 1 1.2 nF DocID024489 Rev 1 EMIF05-SK01F3 Characteristics Figure 4. Attenuation versus frequency Figure 5. Analog crosstalk versus frequency S21(dB) XTalk (dB) 0 0 -5 -10 -10 -15 -20 -20 -25 -30 -30 -40 -35 -50 -40 -60 -45 -50 F (Hz) -55 -70 -80 -60 100k 1M 10M 100M I1-O1 I3-O3 I5-O5 1G -90 I2-O2 I4-O4 100k Figure 6. ESD response to IEC 61000-4-2 (+8 kV contact discharge) 1M I1-O2 10M 100M I1-O5 1G Figure 7. ESD response to IEC 61000-4-2 (-8 kV contact discharge) 2.0 V / Div 2.0 V / Div 4 -1.73 V 1 11.87 V 1 2 3 4 2 3.61 V VCL: Peak clamping voltage VCL :clamping voltage at 30 ns VCL :clamping voltage at 60 ns VCL :clamping voltage at 100 ns 3 3.16 V 3 -4.18 V 4 1.20 V 1 2 3 4 VCL: Peak clamping voltage VCL :clamping voltage @ 30 ns VCL :clamping voltage @ 60 ns VCL :clamping voltage @ 100 ns 2 -5.19 V 1 -10.88 V 20 ns / Div 20 ns / Div Figure 8. Line capacitance versus applied voltage 1.200 C(pF) 1.000 8 00 6 00 4 00 2 00 VBIAS (V) 0 0 1 2 3 4 DocID024489 Rev 1 5 6 7 3/7 7 Package information 2 EMIF05-SK01F3 Package information • Epoxy meets UL94, V0 • Lead-free package In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Figure 9. Package dimensions Æ 255 ± 40 µm 500 µm ± 50 400 ± 30 µm 1180 ± 30 µm 175 µm 175 µm 400 ± 30 µm 1580 ± 30 µm Figure 10. Footprint Copper pad Diameter: 220 µm recommended 260 µm maximum Figure 11. Marking Dot, ST logo Solder mask opening: 300 µm minimum ECOPACK® grade KN Solder stencil opening: 220 µm recommended 4/7 DocID024489 Rev 1 EMIF05-SK01F3 Package information Figure 12. Tape and reel specification 2.0± 0.05 Ø 1.50 ± 0.10 4.0 ± 0.1 1.75 ± 0.1 Dot identifying Pin A1 location 3.5 ±- 0.05 1.65 ± 0.05 1.28 ± 0.05 KN KN KN 8.0 +0.3 -0.10 0.20 ± 0.02 4.0 ± 0.1 0.59± 0.05 All dimensions are typical values in mm User direction of unreeling DocID024489 Rev 1 5/7 7 Ordering information 3 EMIF05-SK01F3 Ordering information Figure 13. Ordering information scheme EMIF 05 - SK 01 F3 EMI Filter Number of lines Application 2 letters = SK Version 2 digits = 01 Package F = Flip chip x = 3: Lead-free pitch = 400 µm, bump = 255 µm Table 4. Ordering information Note: Order code Marking Package Weight Base qty Delivery mode EMIF05-SK01F3 KN Flip Chip 2.0 mg 5000 Tape and reel 7” More information is available in the STMicroelectronics Application notes: AN2348: “Flip Chip: Package description and recommendations for use” AN1751: “EMI Filters: Recommendations and measurements” 4 Revision history Table 5. Document revision history 6/7 Date Revision 07-Jul-2014 1 Changes First issue. DocID024489 Rev 1 EMIF05-SK01F3 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. ST PRODUCTS ARE NOT DESIGNED OR AUTHORIZED FOR USE IN: (A) SAFETY CRITICAL APPLICATIONS SUCH AS LIFE SUPPORTING, ACTIVE IMPLANTED DEVICES OR SYSTEMS WITH PRODUCT FUNCTIONAL SAFETY REQUIREMENTS; (B) AERONAUTIC APPLICATIONS; (C) AUTOMOTIVE APPLICATIONS OR ENVIRONMENTS, AND/OR (D) AEROSPACE APPLICATIONS OR ENVIRONMENTS. WHERE ST PRODUCTS ARE NOT DESIGNED FOR SUCH USE, THE PURCHASER SHALL USE PRODUCTS AT PURCHASER’S SOLE RISK, EVEN IF ST HAS BEEN INFORMED IN WRITING OF SUCH USAGE, UNLESS A PRODUCT IS EXPRESSLY DESIGNATED BY ST AS BEING INTENDED FOR “AUTOMOTIVE, AUTOMOTIVE SAFETY OR MEDICAL” INDUSTRY DOMAINS ACCORDING TO ST PRODUCT DESIGN SPECIFICATIONS. PRODUCTS FORMALLY ESCC, QML OR JAN QUALIFIED ARE DEEMED SUITABLE FOR USE IN AEROSPACE BY THE CORRESPONDING GOVERNMENTAL AGENCY. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2014 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com DocID024489 Rev 1 7/7 7