EMIF06-10006F2

EMIF06-10006F2 IPAD™ 6 line EMI filter and ESD protection Main product characteristics Where EMI filtering in ESD sensitive equipment is required: ■ Mobile phones and communication systems ■ Computers, printers and MCU Boards ® Description Flip-Chip (15 Bumps) The EMIF06-10006F2 is a highly integrated device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interference. The EMIF06 Flip-Chip packaging means the package size is equal to the die size. This filter includes an ESD protection circuitry which prevents damage to the application when subjected to ESD surges up 15 kV. This device includes 6 EMIF filters. Benefits ■ EMI symmetrical (I/O) low-pass filter ■ High efficiency in EMI filtering ■ Lead free package ■ Very low PCB space consumption 2.92 mm x 1.29 mm ■ Very thin package: 0.65 mm ■ High efficiency in ESD suppression (IEC 61000-4-2 level 4) ■ High reliability offered by monolithic integration ■ High reduction of parasitic elements through integration and wafer level packaging Order code Part Number Marking EMIF06-10006F2 FT Figure 1. 9 Pin configuration (bump side) 8 I6 7 6 I5 I4 Gnd O6 O5 5 4 3 I3 I2 Gnd O4 2 1 I1 Gnd O3 O2 A B O1 C Complies with the following standards: IEC 61000-4-2 level 4: 15 kV (air discharge) 8 kV (contact discharge) MIL STD 883E - Method 3015-6 Class 3: 30 kV TM: IPAD is a trademeark of STMicroelectronics November 2006 Rev 4 1/9 www.st.com 9 Characteristics 1 EMIF06-10006F2 Characteristics Figure 2. Basic cell configuration 100 Ω Input 1 100 Ω Output 1 30 pF Input 4 30 pF Output 4 30 pF 100 Ω 100 Ω Input 2 Output 2 30 pF Input 5 Output 5 30 pF 30 pF 100 Ω Input 3 Table 1. Symbol Input 6 30 pF Output 6 30 pF 30 pF Absolute Ratings (limiting values) Parameter and test conditions Value Unit PR DC power per resistance 0.1 W PT Total DC power per package 0.6 W Tj Maximum junction temperature 125 °C - 40 to + 85 °C 125 °C Top Operating temperature range Tstg Storage temperature range Table 2. Electrical Characteristics (Tamb = 25 °C) Symbol Parameter VBR Breakdown voltage IRM Leakage current @ VRM VRM Stand-off voltage VCL Clamping voltage Rd Dynamic impedance IPP Peak pulse current RI/O Series resistance between Input and output Cline Capacitance per line Symbol 2/9 30 pF 100 Ω Output 3 30 pF 30 pF I IF VF VCL VBR VRM Test conditions V IRM IR IPP Min. Typ. Max. Unit 5.5 7 9 V 500 nA VBR IR = 1 mA IRM VRM = 3.3 V per line RI/O I = 10 mA 80 100 120 Ω Cline VR = 2.5 V, F = 1 MHz, 30 mV (on filter cells) 50 60 70 pF EMIF06-10006F2 Figure 3. Characteristics S21 (db) attenuation measurements Figure 4. and Aplac simulation Analog crosstalk measurements Aplac 7.62 User: ST Microelectronics 0.00 00 dB dB -12.50 -25 i3_o2.s2p -25.00 -50 -37.50 -75 Measurement Simulation f/Hz -50.00 100.0k 1.0M 10.0M 100.0M 1.0G f/Hz -100 100k 10M 1M 100M 1G Figure 5. Digital crosstalk measurements Figure 6. ESD response to IEC 61000-4-2 (+15 kV air discharge) on one imput (Vin) and one output (Vout) Figure 7. ESD response to IEC 61000-4-2 (–15 kV air discharge) on one imput (Vin) and one output (Vout) Figure 8. Line capacitance versus applied voltage for filter C(pF) 100 90 F=1MHz Vosc=30mVRMS Tj=25°C 80 70 60 50 40 30 20 10 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 VR(V) 3/9 Characteristics EMIF06-10006F2 Figure 9. Aplac model Rbump Lbump Rs=100 Lbump Rbump Ii* Oi* sub Cz=41pF@0V Cbump Rsub Rsub Cbump Cz=41pF@0V Rsub Rbump sub Oi * = Output of each filter cell Ii* = Input of each filter cell Lbump Cgnd Lgnd Rgnd EMIF06-10006F2 model Ground return for each GND bump Figure 10. Figure 10: Aplac parameters 4/9 aplacvar RS 100Ω aplacvar Cz 41 pF aplacvar Lbump 50 pH aplacvar Rbump 20 m aplacvar Cbump 1.2 pF aplacvar Rsub 100 m aplacvar Rgnd 100 m aplacvar Lgnd 100 pH aplacvar Cgnd 0.15 pF EMIF06-10006F2 2 Ordering Information Scheme Ordering Information Scheme EMIF yy - xxx zz Fx EMI Filter Number of lines Information x = resistance value (Ohms) z = capacitance value / 10(pF) or 3 letters = application 2 digits = version Package F = Flip-Chip x = 2: Lead free Pitch = 500 µm, Bump = 315 µm 5/9 Package information 3 EMIF06-10006F2 Package information Figure 11. Flip-Chip Package dimensions 650 µm ± 65 50 1µ m ±5 0 250 µm ± 50 1.29 mm ± 50 µm 500 µm ± 50 435 µm ± 50 315 µm ± 50 2.92 mm ± 50 µm Figure 12. Foot print recommendations Figure 13. Marking Copper pad Diameter: 250 µm recommended , 300 µm max Solder stencil opening: 330 µm Solder mask opening recommendation: 340 µm min for 300 µm copper pad diameter 6/9 Dot, ST logo xx = marking z = manufacturing location yww = datecode (y = year ww = week) E x x z y w w EMIF06-10006F2 Package information Figure 14. Flip-Chip Tape and reel specification Dot identifying Pin A1 location Ø 1.5 +/- 0.1 3.5 +/- 0.1 STE xxz yww STE xxz yww STE All dimensions in mm xxz yww 8 +/- 0.3 0.73 +/- 0.05 1.75 +/- 0.1 4 +/- 0.1 4 +/- 0.1 User direction of unreeling In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Note: Note: More packing information is available in the application notes: AN1235: “Flip-Chip: Package description and recommendations for use” AN1751: "EMI Filters: Recommendations and measurements" 7/9 Ordering Information 4 5 8/9 EMIF06-10006F2 Ordering Information Ordering code Marking Package Weight Base qty Delivery mode EMIF06-10006F2 FT Flip-Chip 5.4 mg 5000 Tape and reel 7” Revision History Date Revision Description of Changes Sep-2004 1 First issue 19-Nov-2004 2 Figure 2 on page 2: Basic cell configuration corrected for I/O5 and I/O6. 11-Apr-2006 3 Reformated to current standard. Marking corrected in ordering information. 17-Nov-2006 4 Ordering code in ordering information corrected. EMIF06-10006F2 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2006 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 9/9