EMIF06-MSD04F3

EMIF06-MSD04F3 6-line low capacitance IPAD™ for micro-SD card with EMI filtering and ESD protection Features ■ EMI low-pass filter ■ Integrated pull up resistors to prevent bus floating when no card is connected ■ 208 MHz clock frequency compatible with SDR104 mode (SD3.0) ■ Lead-free package Flip Chip (16 bumps) Benefits ■ Low power consumption ■ Easy layout thanks to smart pin-out configuration Figure 1. 4 ■ Very low PCB space consumption ■ High reliability offered by monolithic integration ■ Reduction of parasitic elements thanks to CSP integration 3 2 1 A B C D Complies with the following standards: ■ Pin configuration (bump side) IEC 61000-4-2 level 4: – 15 kV (air discharge) – 8 kV (contact discharge) Application Micro (T-Flash) secure digital memory card in: ■ Mobile phones ■ Communication systems Description The EMIF06-MSD04F3 is a highly integrated device based on IPAD technology offering two functions: ESD protection to comply with IEC standard, and EMI filtering to reject mobile phone frequencies. TM: IPAD is a trademark of STMicroelectronics July 2011 Doc ID 018849 Rev 1 1/9 www.st.com 9 Characteristics 1 EMIF06-MSD04F3 Characteristics Table 1. Absolute ratings (limiting values) Symbol VPP Tj Parameter Value Unit ESD discharge IEC 61000-4-2, level 4 Air discharge, card side Contact discharge, card side Air discharge, IC side Contact discharge, IC side 15 8 2 2 Maximum junction temperature 125 °C kV Top Operating temperature range - 40 to + 85 °C Tstg Storage temperature range - 55 to + 150 °C Figure 2. EMIF06-MSD04F3 configuration R7 R8 Host side Clk CMD Dat0 Dat1 Dat2 Dat3/CD R9 R10 R11 Vcc SDClk SDCMD SDDat0 SDDat1 SDDat2 SDDat3/CD R1 R2 R3 R4 R5 R6 Vss Table 2. 2/9 Pin configuration Pin Signal Pin Signal A1 Dat0 C1 CMD A2 Dat1 C2 Vss A3 SDDat1 C3 Vss A4 SDDda0 C4 SDCMD B1 Clk D1 Dat3/CD B2 Vcc D2 Dat2 B3 Vss D3 SDDat2 B4 SDClk D4 SDDat3/CD Doc ID 018849 Rev 1 Card side EMIF06-MSD04F3 Table 3. Characteristics Electrical characteristic Symbol Parameter Test conditions Min. Typ. 14 16 VBR Breakdown voltage IR = 1 mA IRM Leakage current at VRM VRM = 3 V R1, R2, R3, R4, R5, R6 Serial resistance Tolerance ±10 %, matching ±2 % 36 R7, R8, R9, R10, R11 Pull-up resistance Tolerance ±20 %, matching ±2 % 20 Unit V 0.1 µA 40 44 Ω 25 30 kΩ 7.5 10 pF V = 2.9 V, F = 10 MHz, VOSC = 30 mV 9 F0 Cut-off frequency S21 = -3 dB 550 MHz tR,tF Rise and fall time Cload = 10 pF, low-ref = 0.58 V, high-ref = 1.27 V 0.98 ns Figure 3. 0 V = 1.8 V, F = 10 MHz, VOSC = 30 mV Data line capacitance Cline Max. S21 attenuation measurements S21 (dB) Figure 4. 0 Analog crosstalk measurements dB -10 -5 -20 -30 -10 -40 -50 -15 -60 -20 -70 -80 -25 F (Hz) -90 -100 -30 100k 1M Clk Dat1 Dat3 10M 100M Dat0 Dat2 Cmd 1G F (Hz) -110 100k Clk-Dat0 Doc ID 018849 Rev 1 1M 10M 100M 1G Dat3-SDDat0 3/9 Characteristics Figure 5. 12 EMIF06-MSD04F3 Line capacitance versus applied voltage (typical values) Cline (pF) F=10 MHz VOSC=30 mVRMS TAMB=25 °C 11 10 Figure 6. 8 Line capacitance versus frequency (typical values) Cline (pF) 7 VBIAS=1.8 V 6 9 VBIAS=2.9 V 8 5 7 6 4 5 3 4 2 3 2 VBIAS(V) 1 0 0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 Figure 7. 4/9 VOSC=30 mVRMS TAMB=25 °C 1 1 Digital crosstalk measurements Doc ID 018849 Rev 1 F (MHz) 10 100 500 EMIF06-MSD04F3 Characteristics Figure 8. Host side response to IEC 61000-4-2 (+8 kV contact discharge) on card side Figure 9. Host side response to IEC 61000-4-2 (-8 kV contact discharge) on card side Doc ID 018849 Rev 1 5/9 Layout recommendations 2 EMIF06-MSD04F3 Layout recommendations Figure 10. Layout recommendations Dat1 Vcc Dat0 Vss Dat1 Clk Dat0 Vcc Clk NC CMD NC Dat3/CD Vss Dat2 Input CMD Output Dat3/CD Top level Dat2 Second level Top View 3 Ordering information scheme Figure 11. Ordering information scheme EMIF 06 EMI filter Number of lines Application MSD = micro SD card Version 04 = 7.5 pF line capacitance Package F = Flip Chip 3= lead-free, pitch = 400 µm, bump = 255 µm 6/9 Doc ID 018849 Rev 1 MSD 04 F3 EMIF06-MSD04F3 Package information ● Epoxy meets UL94, V0 ● Lead-free package In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 170 µm ± 10 Figure 12. Package dimensions 400 µm ± 40 605 µm ± 55 255 µm ± 40 1.54 mm ± 40 µm 400 µm ± 40 4 Package information 170 µm ± 10 1.54 mm ± 40 µm Figure 13. Footprint Copper pad Diameter: 220 µm recommended 260 µm maximum Solder mask opening: 300 µm minimum Solder stencil opening: 220 µm recommended Figure 14. Marking Dot, ST logo ECOPACK status xx = marking z = manufacturing location yww = datecode y = year, ww = week Doc ID 018849 Rev 1 x x z y w w 7/9 Ordering information EMIF06-MSD04F3 Figure 15. Tape and reel specification Dot identifying Pin A1 location Ø 1.55 2.0 4.0 xxz yww STE xxz yww 0.69 STE xxz yww STE 8.0 3.5 1.65 1.75 0.20 4.0 1.65 All dimensionsare typical values in mm User direction of unreeling 5 Ordering information Table 4. Ordering information Order code Marking Package Weight Base qty Delivery mode EMIF06-MSD04F3 JW Flip Chip 3.2 mg 5000 Tape and reel 7” Note: More information is available in the application notes: AN2348: “Flip Chip: Package description and recommendations for use” AN1751: "EMI Filters: Recommendations and measurements" 6 Revision history Table 5. 8/9 Document revision history Date Revision 12-July-2011 1 Changes First issue. Doc ID 018849 Rev 1 EMIF06-MSD04F3 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2011 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com Doc ID 018849 Rev 1 9/9