ESDA051-1JY

ESDA051-1JY Datasheet Automotive 5 V TVS in SOD323 Features • • • • • • • AEC-Q101 qualified Unidirectional devices ECOPACK2 compliant component ISO 10605 / IEC 61000-4-2: C = 150 pF, R = 330 Ω, exceeds level 4 – ±30 kV (air discharge) – ±30 kV (contact discharge) ISO 10605: C = 330 pF, R = 330 Ω, exceeds level 4 – ±30 kV (air discharge) – ±30 kV (contact discharge) IEC 61000-4-4 ISO 7637-3 – Fast transient pulse a: Vs = -150 V – Fast transient pulse b: Vs = +150 V – Slow transient negative pulse: Vs = -85 V – Slow transient positive pulse: Vs = +85 V Application Product status link ESDA051-1JY Protection of electronic circuits in ICE vehicles, electrical vehicle and hybrid electric vehicles such as e-bikes, cars and buses. The low clamping voltage during ESD and EOS surges provides an efficient protection of the equipment to ensure robustness and longevity of the vehicle. Description This ESDA051-1JY is unidirectional single TVS protection devices designed to protect sensitive equipement against ESD transients and EOS surges. This device is packaged in SOD323. DS13147 - Rev 1 - November 2019 For further information contact your local STMicroelectronics sales office. www.st.com ESDA051-1JY Characteristics 1 Characteristics Table 1. Absolute maximum ratings (Tamb = 25 °C) Symbol Parameter Value Unit ISO10605 / IEC 61000-4-2 (C = 150 pF, R = 330 Ω): VPP Peak pulse voltage Contact discharge 30 Air discharge 30 ISO10605 (C = 330 pF, R = 330 Ω) kV Contact discharge 30 Air discharge 30 ISO 10605 - C = 330 pF, R = 2 kΩ 30 8/20 µs 20 A IPP Peak pulse current Tj Operating junction temperature range -55 to +150 °C Storage temperature range -55 to +150 °C 260 °C Tstg TL Maximum lead temperature for soldering during 10 s Figure 1. Electrical characteristics - parameter definitions Table 2. Electrical characteristics - parameter values (Tamb = 25 °C, unless otherwise specified) ESDA051-1JY VCL(1) 10 mA Type Max. 8 / 20µs VF at VBR at 1 mA IRM at VRM Min. Typ. Max. Typ. Max. Max. IPP C at RD 0V Max. Typ. µA V V V V V V V A Ω pF 3 5 6.2 6.5 6.8 0.78 0.9 12.8 20 0.3 190 1. To calculate VCL max versus IPP appli: VCL max = VBR max + RD x IPPappli. DS13147 - Rev 1 page 2/11 ESDA051-1JY Characteristics (curves) 1.1 Characteristics (curves) Figure 2. Maximum peak current dissipation versus initial Figure 3. Maximum peak pulse current versus exponential junction temperature pulse duration IPP(A) 25 IPP(A) 30 Tj initial = 25 °C 25 20 20 15 15 10 10 5 5 Tj(°C) tp(ms) 0 0 25 50 75 100 125 150 0 0.01 175 Figure 4. Peak pulse current versus clamping voltage IPP(A) 20 1 Figure 5. Leakage current versus junction temperature IR(nA) 450 Tj = 25 °C 8/20 µs 18 0.1 400 VR = 5 V 16 350 14 300 12 250 10 200 8 150 6 100 4 2 50 VCL(V) 0 0 1 2 3 4 5 6 7 8 9 10 11 0 12 25 Figure 6. Leakage current versus reverse voltage 180 Tj(°C) IR(nA) 50 100 125 150 Figure 7. Forward current versus forward voltage drop IF(A) 25 8/20 µs Tj = 25 °C Single pulse Tj = 25 °C 160 75 20 140 120 15 100 80 10 60 40 5 20 VF(V) VR(V) 0 0 0 0,5 DS13147 - Rev 1 1 1,5 2 2,5 3 3,5 4 4,5 5 0 1 2 3 4 5 page 3/11 ESDA051-1JY Characteristics (curves) Figure 8. Response to ISO 10605 -C = 150 pF, R = 330 Ω (-8 kV contact) Figure 9. Response to ISO 10605 -C = 150 pF, R = 330 Ω (+8 kV contact) Figure 10. Response to ISO 7637-3 fast transient pulse a: -150 V Figure 11. Response to ISO 7637-3 fast transient pulse b: +150 V Figure 12. Response to ISO 7637-3 slow transient negative pulse: -85 V Figure 13. Response to ISO 7637-3 slow transient positive pulse: +85 V DS13147 - Rev 1 page 4/11 ESDA051-1JY Characteristics (curves) Figure 14. TLP I(A) 30 20 10 V(V) 0 -6 -5 -4 -3 -2 -1 0 1 2 3 4 5 6 7 8 9 10 11 12 -10 -20 -30 DS13147 - Rev 1 page 5/11 ESDA051-1JY Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 2.1 SOD323 package information Figure 15. SOD323 package outline L Table 3. SOD323 package mechanical data Dimensions Ref. Min. A A1 Inches(1) Millimeters Max. Min. 1.17 Max. 0.046 0.00 0.10 0.000 0.004 b 0.25 0.44 0.010 0.018 c 0.10 0.25 0.003 0.010 D 1.52 1.80 0.059 0.071 E 1.11 1.45 0.043 0.058 HD 2.30 2.70 0.090 0.107 L 0.10 0.46 0.003 0.019 Q1 0.10 0.41 0.003 0.017 A2 1. Values in inches are converted from mm and rounded to 3 decimal digits DS13147 - Rev 1 page 6/11 ESDA051-1JY Packing information 2.2 SOD323 packing information Figure 16. SOD323 footprint in mm Figure 17. SOD323 marking 3.00 XX 0.54 0.86 0.86 1.28 Figure 18. Package orientation in reel Figure 19. Tape and reel orientation Taped according to EIA-481 Note: Pocket dimensions are not on scale Pocket shape may vary depending on package Figure 20. 7'' reel dimension values Figure 21. Inner box dimension values 30 Ø 180 max 14.4 2±0.5 Ø 13 Ø 60 Ø 20.2 min 205 205 DS13147 - Rev 1 page 7/11 ESDA051-1JY Packing information Figure 22. Tape outline Table 4. Tape dimension values Dimensions Millimeters Ref. DS13147 - Rev 1 Min. Typ. Max. D0 1.50 1.55 1.6 D1 1.00 F 3.45 3.50 3.55 K0 1.12 1.22 1.32 P0 3.90 4.00 4.10 P1 3.90 4.00 4.10 P2 1.95 2.00 2.05 W 7.90 8.00 8.30 page 8/11 ESDA051-1JY Reflow profile 2.3 Reflow profile Figure 23. ST ECOPACK recommended soldering reflow profile for PCB mounting 250 240-245 °C Temperature (°C) -2 °C/s 2 - 3 °C/s 60 sec (90 max) 200 -3 °C/s 150 -6 °C/s 100 0.9 °C/s 50 Time (s) 0 30 60 90 120 150 180 210 240 270 300 Note: Minimize air convection currents in the reflow oven to avoid component movement. Maximum soldering profile corresponds to the latest IPC/JEDEC J-STD-020. 2.4 Ordering information Table 5. Ordering information DS13147 - Rev 1 Order code Marking Package Weight Base qty. Delivery mode ESDA051-1JY B5 SOD323 5.3 mg 3000 Tape and reel page 9/11 ESDA051-1JY Revision history Table 6. Document revision history DS13147 - Rev 1 Date Revision 05-Nov-2019 1 Changes Initial release. page 10/11 ESDA051-1JY IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. 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Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2019 STMicroelectronics – All rights reserved DS13147 - Rev 1 page 11/11