ESDA17P20-1F2

ESDA17P20-1F2 Datasheet 15 V, 25 A unidirectional TVS in 0402 CSP Features • • • • • Peak pulse power: 600 W (8/20 µs) Stand-off voltage: 15 V Unidirectional type Low leakage current: 80 nA at 25 °C Operating Tj max: 150 °C • Lead finishing: gold Complies with the following standards • • IPC7531 footprint and JEDEC registered package outline IEC 61000-4-2, C = 150 pF - R = 330 Ω exceeds level 4: – 30 kV (contact discharge) – 30 kV (air discharge) Description The ESDA17P20-1F2 is a unidirectional single line TVS diode designed to protect the power line against EOS and ESD transients. This ESD suppressor is ideal for applications where PCB space saving is required such as cellular handsets and accessories, wearable devices, USB buses, battery lines. Product status link ESDA17P20-1F2 DS13369 - Rev 2 - September 2022 For further information contact your local STMicroelectronics sales office. www.st.com ESDA17P20-1F2 Characteristics 1 Characteristics Table 1. Absolute maximum ratings (Tamb = 25 °C) Symbol Parameter Value ISO10605 (C = 330 pF, R = 330 Ω) Vpp Peak pulse voltage Unit 30 contact discharge kV 30 air discharge Ppp Peak pulse power (8/20 μs) 600 W Ipp Peak pulse current (8/20 μs) 25 A Top Operating junction temperature range -55 to 150 Tstg Storage junction temperature range -55 to 150 TL Maximum lead temperature for soldering during 10 s °C 260 Figure 1. Electrical characteristics (definitions) Table 2. Electrical characteristics (values) (Tamb = 25° C) Symbol Parameter Test condition Typ. Max. Unit 15 V 17.9 V nA VRM Stand-off voltage VBR Breakdown voltage IR = 1 mA IRM Leakage current VRM = 15 V 80 Ipp = 20 A - 8/20 µs 23 VCL Clamping voltage IEC 61000-4-2, 8 kV contact discharge measured at 30 ns RD CLINE DS13369 - Rev 2 Min. 15.6 16.7 20.6 V Dynamic resistance, pulse 8/20 µs 0.25 Ω Line capacitance f = 1 MHz, VLINE = 0 V, VOSC = 30 mV 190 pF page 2/11 ESDA17P20-1F2 Characteristics (curves) 1.1 Characteristics (curves) Figure 2. Maximum peak power dissipation versus initial junction temperature PPP (W) 800 Figure 3. Maximum peak pulse power versus exponential pulse duration PPP (W) 1000 Tj initial = 25 °C 8/20 µs 600 400 100 200 0 Tj (°C) 0 25 50 75 100 125 150 175 Figure 4. Maximum clamping voltage versus peak pulse current IPP (A) 10 tp (µs) 10 100 1000 Figure 5. Leakage current versus junction temperature 100 IR (nA) VR = VRM 8/20 µs 10 10 1 0.1 16 VCL (V) 17 18 19 20 21 22 23 24 25 1 26 Figure 6. ESD response to IEC 61000-4-2 (-8 kV contact discharge) DS13369 - Rev 2 Tj (°C) 25 50 75 100 125 150 Figure 7. ESD response to IEC 61000-4-2 (+8 kV contact discharge) page 3/11 ESDA17P20-1F2 Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 2.1 0402 CSP package information Figure 8. 0402 CSP package outline E L e D b A Table 3. 0402 CSP mechanical data Dimensions Millimeters Ref. Min. Typ. Max. A 0.330 0.350 0.370 b 0.230 0.250 0.270 D 0.970 1.000 1.030 E 0.570 0.600 0.630 e L DS13369 - Rev 2 0.650 0.480 0.500 0.520 page 4/11 ESDA17P20-1F2 0402 CSP package information Figure 9. Recommended footprint (mm) 0.35 Figure 10. Marking 0.35 Cathode bar 0.6 0.65 X X : refer to ordering table for marking 1 Figure 11. Package orientation in reel Figure 12. Tape and reel orientation Taped according to EIA-481 Note: Pocket dimensions are not on scale Pocket shape may vary depending on package On bidirectional devices, marking and logo may be not always in the same direction Figure 13. Reel dimension values (mm) Figure 14. Inner box dimension values (mm) 30 Ø 180 max 14.4 2±0.5 Ø 13 Ø 60 Ø 20.2 min 205 205 DS13369 - Rev 2 page 5/11 ESDA17P20-1F2 0402 CSP package information Figure 15. Tape outline Table 4. Tape dimension values Dimensions Millimeters Ref. DS13369 - Rev 2 Min. Typ. Max. D0 1.5 1.55 1.6 D1 0.195 0.2 0.205 F 3.45 3.5 3.55 K0 0.39 0.42 0.45 P0 3.9 4.0 4.1 P1 1.95 2.0 2.05 P2 1.95 2.0 2.05 W 7.9 8.0 8.3 page 6/11 ESDA17P20-1F2 PCB assembly recommendations 3 PCB assembly recommendations 3.1 Recommended stencil opening Figure 16. Recommended stencil opening (mm) 3.2 Solder paste 1. 2. 3. 4. DS13369 - Rev 2 Halide-free flux qualification ROL0 according to ANSI/J-STD-004. “No clean” solder paste is recommended. Offers a high tack force to resist component movement during high speed. Use solder paste with fine particles: powder particle size 20-38 µm. page 7/11 ESDA17P20-1F2 Reflow profile 3.3 Reflow profile Figure 17. ST ECOPACK recommended soldering reflow profile for PCB mounting 250 240-245 °C Temperature (°C) -2 °C/s 2 - 3 °C/s 60 sec (90 max) 200 -3 °C/s 150 -6 °C/s 100 0.9 °C/s 50 Time (s) 0 Note: DS13369 - Rev 2 30 60 90 120 150 180 210 240 270 300 Minimize air convection currents in the reflow oven to avoid component movement. Maximum soldering profile corresponds to the latest IPC/JEDEC J-STD-020. page 8/11 ESDA17P20-1F2 Ordering information 4 Ordering information Table 5. Ordering information DS13369 - Rev 2 Order code Marking Package Weight Base qty. Delivery mode ESDA17P20-1F2 A 0402 CSP 0.54 mg 10000 Tape and reel page 9/11 ESDA17P20-1F2 Revision history Table 6. Document revision history DS13369 - Rev 2 Date Version Changes 15-Jun-2020 1 Initial release. 16-Sep-2022 2 Updated package name. page 10/11 ESDA17P20-1F2 IMPORTANT NOTICE – READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgment. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. For additional information about ST trademarks, refer to www.st.com/trademarks. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2022 STMicroelectronics – All rights reserved DS13369 - Rev 2 page 11/11