ESDA22P150-1U3M

ESDA22P150-1U3M Datasheet High power transient voltage suppressor Features • • • • • • Low clamping voltage Peak pulse power: – 4500 W (8/20µs) Stand off voltage 20 V Unidirectional diode Low leakage current: – 0.25 µA at 25°C Complies with the following standards: IEC 61000-4-2 level 4 – ± 30 kV (air discharge) – ± 30 kV (contact discharge) Pin #1 ID 1 1 3 3 2 2 Top view Pin 3 Vbus (Vbus pin) Bottom view Pin 1, 2* GND (ground pin) *Pin 1 and Pin 2 must be connected together. Product status link ESDA22P150-1U3M Application Where transient over voltage protection in ESD sensitive equipment is required, such as: • Smartphones, mobile phones, tablets, portable multimedia • USB Vbus protection • • Power supply protection Battery protection Description The ESDA22P150-1U3M is a unidirectional single line TVS diode designed to protect the power line against EOS & ESD transients. The device is ideal for applications where high power TVS and board space saving is required. DS12572 - Rev 1 - May 2018 For further information contact your local STMicroelectronics sales office. www.st.com ESDA22P150-1U3M Characteristics 1 Characteristics Table 1. Absolute maximum ratings (Tamb = 25 °C) Symbol Parameter Value IEC 61000-4-2 contact discharge >30 IEC 61000-4-2 air discharge >30 Unit Vpp Peak pulse voltage Ppp Peak pulse power (8/20 μs) 4500 W Ipp Peak pulse current (8/20 μs) 150 A Ppp Peak pulse power (10/1000 μs) 330 W Ipp Peak pulse current (10/1000 μs) 11 A Top Operating junction temperature range -55 to 150 °C Tstg Storage junction temperature range -55 to 150 °C kV Figure 1. Electrical characteristics (definitions) I Symbol VBR VCL IRM VRM IPP = = = = = RD IR VF IF = = = = Parameter Breakdown voltage Clamping voltage Leakage current @ V RM Stand-off voltage Peak pulse current VCL V BR VRM IF V I V RM F IR Dynamic resistance Breakdown current Slope = 1/ R d Forward voltage Forward current I PP Table 2. Electrical characteristics (values) (Tamb = 25° C) Symbol Parameter Min. Typ. VRM VBR IR = 1 mA IRM VRM = 20 V VCL DS12572 - Rev 1 21 22 Max. Unit 20 V 23.5 V 250 nA IPP = 100 A 8/20µs 28 31 IPP = 150 A 8/20µs 31 34 V RD 8/20µs 0.06 VCL IPP = 9.2 A 10/1000 µs 27.5 RD 10/1000 µs 0.5 Ω VF IF = 10 mA 0.7 V Ω 30 V page 2/12 ESDA22P150-1U3M Characteristics (curves) 1.1 Characteristics (curves) Figure 2. Peak pulse power dissipation versus initial temperature (typical value) Figure 3. Peak pulse power versus exponential pulse duration (typical value) PPP (W) PPP (W) 10000 6000 Tj initial = 25 °C 8/20µs 5000 4000 1000 3000 2000 1000 t p (µs) T j ( °C) 0 25 50 75 100 125 150 100 175 10 Figure 4. Peak pulse current versus clamping voltage (max value, 8/20 µs) 100 1000 Figure 5. Peak pulse current versus clamping voltage (max value, 10/1000 µs) Ipp (A) Ipp (A) 100 10 8/20µs Tj initial = 25 °C 10/1000 µs Tj initial = 25 °C 10 1 1 0.1 VCL (V) 23 25 27 29 VCL (V) 0.1 23 31 25 27 29 31 Figure 6. Leakage current versus junction temperature (typical value) Ir (nA) 200 I rm at Vrm = 20 V 180 160 140 120 100 80 60 40 T (°C) j 20 0 20 DS12572 - Rev 1 40 60 80 100 120 140 160 page 3/12 ESDA22P150-1U3M Characteristics (curves) Figure 7. ESD response to IEC 61000-4-2 (+8 kV contact discharge) 5 V/div Figure 8. ESD response to IEC 61000-4-2 (-8 kV contact discharge) 5 V/div 32.8 V 1 23.4 V 2 23.3V 3 23.6 V 4 2 -820 mV 1 2 3 4 Peak clamping voltage Clamping voltage at 30 ns Clamping voltage at 60 ns Clamping voltage at 100 ns 20 ns/div DS12572 - Rev 1 1 -21.3 V 3 -1.1 V 4 -1.1 V 1 2 3 4 Peak clamping voltage Clamping voltage at 30 ns Clamping voltage at 60 ns Clamping voltage at 100 ns 20 ns/div page 4/12 ESDA22P150-1U3M Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 2.1 QFN package information Figure 9. QFN package outline D e 2 K 1 E2 E L Nxb L1 3 D2 Bottom view Sideview DS12572 - Rev 1 A1 A A2 Sideview page 5/12 ESDA22P150-1U3M QFN package information Table 3. QFN package mechanical data Dimensions Ref. Millimeters Min. Typ. Max. A 0.51 0.55 0.60 A1 0.00 0.02 0.05 A2 0.15 b 0.25 0.30 D 2.00 E 2.00 e 1.30 0.35 D2 1.40 1.50 1.60 E2 0.90 1.00 1.10 K 0.20 L1 0.25 L 0.35 N 0.40 0.45 3 Figure 10. Recommended footprint in mm Figure 11. Marking 1.5 22A 0.3 0.3 1.3 Pin1 0.6 DS12572 - Rev 1 0.35 1 0.45 page 6/12 ESDA22P150-1U3M QFN package information Figure 12. Tape outline Pin #1 P0 Ø D0 E1 F W P1 A0 P2 Ø D1 K0 User direction of unreeling Note: Pocket dimensions are not on scale Pocket shape may vary depending on package Table 4. Tape and reel dimensions Dimensions (milimeters) Ref. DS12572 - Rev 1 Millimeters Min. Typ. Max. P1 3.90 4.00 4.10 P0 3.90 4.00 4.10 Ø D0 1.50 1.55 1.60 Ø D1 1.00 F 3.40 3.50 3.60 E1 1.65 1.75 1.85 K0 0.65 0.75 0.85 P2 1.95 2.00 2.05 W 7.70 8.00 8.30 A0 2.15 2.25 2.35 page 7/12 ESDA22P150-1U3M Recommendation on PCB assembly 3 Recommendation on PCB assembly 3.1 Stencil opening design 1. General recommendation on stencil opening design Stencil opening dimensions: L (Length), W (Width), T (Thickness). a. Figure 13. Stencil opening recommendation L T b. General design rule ◦ Stencil thickness (T) = 75 ~ 125 μm ◦ ◦ 1. W W ≥ 1.5 T L  ×  W ≥ 0.66 2T L  + W Reference design Stencil opening thickness: 100 µm a. b. Stencil opening for leads: Opening to footprint ratio is 90% c. Stencil opening for expose pad: Opening to footprint ratio is 50% Figure 14. Recommended stencil window position in mm 0.43 0.71 0.51 0.57 0.29 1.3 0.29 1.06 DS12572 - Rev 1 page 8/12 ESDA22P150-1U3M Solder paste 3.2 Solder paste 1. 2. 3. 4. 3.3 Placement 1. 2. 3. 4. 5. 6. 3.4 Manual positioning is not recommended. It is recommended to use the lead recognition capabilities of the placement system, not the outline centering Standard tolerance of ±0.05 mm is recommended. 3.5 N placement force is recommended. Too much placement force can lead to squeezed out solder paste and cause solder joints to short. Too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. To improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool. For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools. PCB design preference 1. 2. 3.5 Halide-free flux qualification ROL0 according to ANSI/J-STD-004. “No clean” solder paste is recommended. Offers a high tack force to resist component movement during high speed. Use solder paste with fine particles: powder particle size 20-45 µm. To control the solder paste amount, the closed via is recommended instead of open vias. The position of tracks and open vias in the solder area should be well balanced. A symmetrical layout is recommended, to avoid any tilt phenomena caused by asymmetrical solder paste due to solder flow away. Reflow profile Figure 15. ST ECOPACK® recommended soldering reflow profile for PCB mounting 250 240-245 °C Temperature (°C) -2 °C/s 2 - 3 °C/s 60 sec (90 max) 200 -3 °C/s 150 -6 °C/s 100 0.9 °C/s 50 Time (s) 0 Note: DS12572 - Rev 1 30 60 90 120 150 180 210 240 270 300 Minimize air convection currents in the reflow oven to avoid component movement. page 9/12 ESDA22P150-1U3M Ordering information 4 Ordering information Figure 16. Ordering information scheme ESDA 22 P150 - 1U3 M ESD Array Breakdown voltage 22 = 22 V typ. IPP 8/20 µs P150 = 150 A Direction 1U3 = 1 unidirectional line Package M = QFN Table 5. Ordering information Order code Marking Weight Base qty. Delivery mode ESDA22P150-1U3M 22A 7 mg 5000 Tape and reel 1. The marking can be rotated by multiples of 90° to differentiate assembly location. DS12572 - Rev 1 page 10/12 ESDA22P150-1U3M Revision history Table 6. Document revision history DS12572 - Rev 1 Date Revision 24-May-2018 1 Changes First issue. page 11/12 ESDA22P150-1U3M IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2018 STMicroelectronics – All rights reserved DS12572 - Rev 1 page 12/12