ESDAL
Dual Transil™ array for ESD protection
Datasheet - production data
Applications
Where transient overvoltage protection in ESD
sensitive equipment is required, such as:
Description
SOT23-3L
This device is a diode array designed to protect 1
line or 2 lines against ESD transients.
The device is ideal for applications where both
reduced line capacitance and board space saving
are required.
Features
Entertainment
Signal communications
Connectivity
Comfort and convenience
Unidirectional device
Low leakage current (IR max. < 20 µA at
VBR)
300 W peak pulse power (8/20 µs)
It can also be used as bidirectional suppressor by
connecting only pin 1 and 2.
Figure 1: Functional diagram
Benefits
High ESD protection level: up to 30 kV
High integration
Suitable for high density boards
1
3
Complies with the following
standards
IEC 61000-4-2 (exceeds level 4) :
30 kV (air discharge)
30 kV (contact discharge)
July 2017
2
DocID7058 Rev 5
This is information on a product in full production.
1/11
www.st.com
Characteristics
1
ESDAL
Characteristics
Table 1: Absolute maximum ratings (Tamb = 25 °C)
Symbol
Parameter
Value
Unit
30
30
kV
300
W
25
18
14
7
6.3
A
IEC 61000-4-2:
Contact discharge
Air discharge
Vpp
Peak pulse voltage(1)
Ppp
Peak pulse power (8/20 μs)
ESDA5V3L
ESDA6V1L
ESDA14V2L
ESDA25L
ESDA37L
Ipp
Peak pulse current (8/20 μs)
Tj
Operating junction temperature range
-40 to 150
°C
Tstg
Storage junction temperature range
-65 to 150
°C
TL
Maximum lead temperature for soldering during 10 s at 5 mm from
case
260
°C
Notes:
(1)For
a surge greater than the maximum values, the diode will fail in short-circuit.
Figure 2: Electrical characteristics (definitions)
Symbol
VBR
VCL
VRM
IRM
IF
IPP
IR
VF
C
Rd
αT
2/11
=
=
=
=
=
=
=
=
=
=
=
Parameter
Breakdown voltage
Clamping voltage
Stand-off voltage
Leakage current
Forward current
Peak pulse current
Breakdown current
Forward voltage drop
Capacitance
Dynamic impedance
Voltage temperature
DocID7058 Rev 5
I
IF
VBR
Vcl
VF
VRM
IRM
Slope = 1/Rd
IPP
V
ESDAL
Characteristics
Table 2: Electrical characteristics (Tamb = 25 °C)
VBR at IR
Order code
Min.
Max.
V
V
IRM at VRM
Max.
mA
µA
V
Rd(1)
αT(2)
Cline
VF at IF
Typ.
Max.
Typ. at 0 V bias
Max.
mΩ
10-4/°C
pF
V
mA
ESDA5V3L
5.3
5.9
1
2
3
280
5
220
1.25
200
ESDA6V1L
6.1
7.2
1
20
5.25
350
6
140
1.25
200
ESDA14V2L
14.2
15.8
1
5
12
650
10
90
1.25
200
ESDA25L
25
30
1
1
24
1000
10
50
1.2
10
ESDA37L
37
43.3
1
1
36
2400
10
48
0.9
10
Notes:
(1)Square
(2)∆
pulse Ipp = 15 A, tp = 2.5 µs
VBR = αT x (Tamb -25 °C) x VBR (25 °C)
DocID7058 Rev 5
3/11
Characteristics
1.1
ESDAL
Characteristics (curves)
Figure 4: Peak pulse power versus exponential
pulse duration
Figure 3: Variation of peak pulse power versus
initial junction temperature
PPP(W)
PPP(W)
Tj initial = 25 °C
maximum value
350
1000
300
250
200
150
100
100
50
Tj(°C)
0
25
50
75
100
125
ESDA5V3L ESDA6V1L ESDA14V2L ESDA25L
150
ESDA37L
175
tp(µs)
10
10
Figure 5: Variation of clamping voltage versus
peak pulse current (max. values, 8/20 µs waveform)
100
1000
Figure 6: Relative variation of leakage current
at VR = VRM versus junction values
IPP(A)
Ir(nA)
100
Tj initial = 25 °C
8/20µs
10
10000
ESDA5V3L
ESDA6V1L
ESDA14V2L
ESDA25L
ESDA37L
1000
100
10
1
1
ESDA5V3L
ESDA6V1L
ESDA14V2L
ESDA25L
ESDA37L
0.1
VCL(V)
0.1
0
4/11
10
20
30
40
50
Tj(°C)
0.01
60
DocID7058 Rev 5
25
50
75
100
125
150
Application and design guidelines
ESDAL
2
Application and design guidelines
Refer to STMicroelectronics application note:
AN2689: Protection of automotive electronics from electrical hazards, guidelines for
design and component selection.
DocID7058 Rev 5
5/11
Package information
3
ESDAL
Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
3.1
Epoxy meets UL 94,V0
Lead-free package
SOT23-3L mechanical data
Figure 7: SOT23-3L package outline
005 3390_I
6/11
DocID7058 Rev 5
Package information
ESDAL
Table 3: SOT23-3L mechanical data
mm
Dim.
Min.
Typ.
Max.
A
0.89
1.40
A1
0
0.10
B
0.30
0.51
C
0.085
0.18
D
2.75
3.04
e
0.85
1.05
e1
1.70
2.10
E
1.20
1.75
H
2.10
3.00
L
0.60
S
0.35
0.65
L1
0.25
0.55
a
0°
8°
Figure 8: SOT23-3L recommended footprint
Dimensions are in mm.
DocID7058 Rev 5
7/11
Recommendation on PCB assembly
ESDAL
4
Recommendation on PCB assembly
4.1
Solder paste
1.
2.
3.
4.
4.2
Placement
1.
2.
3.
4.
5.
6.
4.3
Manual positioning is not recommended.
It is recommended to use the lead recognition capabilities of the placement system,
not the outline centering
Standard tolerance of ±0.05 mm is recommended.
3.5 N placement force is recommended. Too much placement force can lead to
squeezed out solder paste and cause solder joints to short. Too low placement force
can lead to insufficient contact between package and solder paste that could cause
open solder joints or badly centered packages.
To improve the package placement accuracy, a bottom side optical control should be
performed with a high resolution tool.
For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is
recommended during solder paste printing, pick and place and reflow soldering by
using optimized tools.
PCB design preference
1.
2.
8/11
Halide-free flux qualification ROL0 according to ANSI/J-STD-004.
“No clean” solder paste is recommended.
Offers a high tack force to resist component movement during high speed.
Use solder paste with fine particles: powder particle size 20-45 µm.
To control the solder paste amount, the closed via is recommended instead of open
vias.
The position of tracks and open vias in the solder area should be well balanced. A
symmetrical layout is recommended, to avoid any tilt phenomena caused by
asymmetrical solder paste due to solder flow away.
DocID7058 Rev 5
Recommendation on PCB assembly
ESDAL
4.4
Reflow profile
Figure 9: ST ECOPACK® recommended soldering reflow profile for PCB mounting
Minimize air convection currents in the reflow oven to avoid component
movement.
DocID7058 Rev 5
9/11
Ordering information
5
ESDAL
Ordering information
Figure 10: Ordering information scheme
ESDA
XXX L
ESD Array
Minimum breakdown voltage
Package
L = SOT23-3L
Table 3: Ordering information
Order code
Marking(1)
ESDA5V3L
EL53
ESDA6V1L
EL61
ESDA14V2L
EL15
ESDA25L
EL25
ESDA37L
EL37
Package
SOT23-3L
Weight
8.7 mg
Base qty.
Delivery mode
3000
Tape and reel
9.8 mg
Notes:
(1)The
6
marking can be rotated by multiples of 90° to differentiate assembly location.
Revision history
Table 4: Document revision history
10/11
Date
Revision
Changes
31-Jul-2012
4
First issue.
20-Jul-2017
5
Added ESDA37L package information.
DocID7058 Rev 5
ESDAL
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Information in this document supersedes and replaces information previously supplied in any prior versions of this document.
© 2017 STMicroelectronics – All rights reserved
DocID7058 Rev 5
11/11
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