0
登录后你可以
  • 下载海量资料
  • 学习在线课程
  • 观看技术视频
  • 写文章/发帖/加入社区
会员中心
创作中心
发布
  • 发文章

  • 发资料

  • 发帖

  • 提问

  • 发视频

创作活动
ESDA37L

ESDA37L

  • 厂商:

    STMICROELECTRONICS(意法半导体)

  • 封装:

    TO-236-3,SC-59,SOT-23-3

  • 描述:

    夹子 6.3A(8/20µs) Ipp TVS - 二极管 表面贴装型 SOT-23-3

  • 数据手册
  • 价格&库存
ESDA37L 数据手册
ESDAL Dual Transil™ array for ESD protection Datasheet - production data Applications Where transient overvoltage protection in ESD sensitive equipment is required, such as:     Description SOT23-3L This device is a diode array designed to protect 1 line or 2 lines against ESD transients. The device is ideal for applications where both reduced line capacitance and board space saving are required. Features    Entertainment Signal communications Connectivity Comfort and convenience Unidirectional device Low leakage current (IR max. < 20 µA at VBR) 300 W peak pulse power (8/20 µs) It can also be used as bidirectional suppressor by connecting only pin 1 and 2. Figure 1: Functional diagram Benefits    High ESD protection level: up to 30 kV High integration Suitable for high density boards 1 3 Complies with the following standards  IEC 61000-4-2 (exceeds level 4) :  30 kV (air discharge)  30 kV (contact discharge) July 2017 2 DocID7058 Rev 5 This is information on a product in full production. 1/11 www.st.com Characteristics 1 ESDAL Characteristics Table 1: Absolute maximum ratings (Tamb = 25 °C) Symbol Parameter Value Unit 30 30 kV 300 W 25 18 14 7 6.3 A IEC 61000-4-2: Contact discharge Air discharge Vpp Peak pulse voltage(1) Ppp Peak pulse power (8/20 μs) ESDA5V3L ESDA6V1L ESDA14V2L ESDA25L ESDA37L Ipp Peak pulse current (8/20 μs) Tj Operating junction temperature range -40 to 150 °C Tstg Storage junction temperature range -65 to 150 °C TL Maximum lead temperature for soldering during 10 s at 5 mm from case 260 °C Notes: (1)For a surge greater than the maximum values, the diode will fail in short-circuit. Figure 2: Electrical characteristics (definitions) Symbol VBR VCL VRM IRM IF IPP IR VF C Rd αT 2/11 = = = = = = = = = = = Parameter Breakdown voltage Clamping voltage Stand-off voltage Leakage current Forward current Peak pulse current Breakdown current Forward voltage drop Capacitance Dynamic impedance Voltage temperature DocID7058 Rev 5 I IF VBR Vcl VF VRM IRM Slope = 1/Rd IPP V ESDAL Characteristics Table 2: Electrical characteristics (Tamb = 25 °C) VBR at IR Order code Min. Max. V V IRM at VRM Max. mA µA V Rd(1) αT(2) Cline VF at IF Typ. Max. Typ. at 0 V bias Max. mΩ 10-4/°C pF V mA ESDA5V3L 5.3 5.9 1 2 3 280 5 220 1.25 200 ESDA6V1L 6.1 7.2 1 20 5.25 350 6 140 1.25 200 ESDA14V2L 14.2 15.8 1 5 12 650 10 90 1.25 200 ESDA25L 25 30 1 1 24 1000 10 50 1.2 10 ESDA37L 37 43.3 1 1 36 2400 10 48 0.9 10 Notes: (1)Square (2)∆ pulse Ipp = 15 A, tp = 2.5 µs VBR = αT x (Tamb -25 °C) x VBR (25 °C) DocID7058 Rev 5 3/11 Characteristics 1.1 ESDAL Characteristics (curves) Figure 4: Peak pulse power versus exponential pulse duration Figure 3: Variation of peak pulse power versus initial junction temperature PPP(W) PPP(W) Tj initial = 25 °C maximum value 350 1000 300 250 200 150 100 100 50 Tj(°C) 0 25 50 75 100 125 ESDA5V3L ESDA6V1L ESDA14V2L ESDA25L 150 ESDA37L 175 tp(µs) 10 10 Figure 5: Variation of clamping voltage versus peak pulse current (max. values, 8/20 µs waveform) 100 1000 Figure 6: Relative variation of leakage current at VR = VRM versus junction values IPP(A) Ir(nA) 100 Tj initial = 25 °C 8/20µs 10 10000 ESDA5V3L ESDA6V1L ESDA14V2L ESDA25L ESDA37L 1000 100 10 1 1 ESDA5V3L ESDA6V1L ESDA14V2L ESDA25L ESDA37L 0.1 VCL(V) 0.1 0 4/11 10 20 30 40 50 Tj(°C) 0.01 60 DocID7058 Rev 5 25 50 75 100 125 150 Application and design guidelines ESDAL 2 Application and design guidelines Refer to STMicroelectronics application note:  AN2689: Protection of automotive electronics from electrical hazards, guidelines for design and component selection. DocID7058 Rev 5 5/11 Package information 3 ESDAL Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark.   3.1 Epoxy meets UL 94,V0 Lead-free package SOT23-3L mechanical data Figure 7: SOT23-3L package outline 005 3390_I 6/11 DocID7058 Rev 5 Package information ESDAL Table 3: SOT23-3L mechanical data mm Dim. Min. Typ. Max. A 0.89 1.40 A1 0 0.10 B 0.30 0.51 C 0.085 0.18 D 2.75 3.04 e 0.85 1.05 e1 1.70 2.10 E 1.20 1.75 H 2.10 3.00 L 0.60 S 0.35 0.65 L1 0.25 0.55 a 0° 8° Figure 8: SOT23-3L recommended footprint Dimensions are in mm. DocID7058 Rev 5 7/11 Recommendation on PCB assembly ESDAL 4 Recommendation on PCB assembly 4.1 Solder paste 1. 2. 3. 4. 4.2 Placement 1. 2. 3. 4. 5. 6. 4.3 Manual positioning is not recommended. It is recommended to use the lead recognition capabilities of the placement system, not the outline centering Standard tolerance of ±0.05 mm is recommended. 3.5 N placement force is recommended. Too much placement force can lead to squeezed out solder paste and cause solder joints to short. Too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. To improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool. For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools. PCB design preference 1. 2. 8/11 Halide-free flux qualification ROL0 according to ANSI/J-STD-004. “No clean” solder paste is recommended. Offers a high tack force to resist component movement during high speed. Use solder paste with fine particles: powder particle size 20-45 µm. To control the solder paste amount, the closed via is recommended instead of open vias. The position of tracks and open vias in the solder area should be well balanced. A symmetrical layout is recommended, to avoid any tilt phenomena caused by asymmetrical solder paste due to solder flow away. DocID7058 Rev 5 Recommendation on PCB assembly ESDAL 4.4 Reflow profile Figure 9: ST ECOPACK® recommended soldering reflow profile for PCB mounting Minimize air convection currents in the reflow oven to avoid component movement. DocID7058 Rev 5 9/11 Ordering information 5 ESDAL Ordering information Figure 10: Ordering information scheme ESDA XXX L ESD Array Minimum breakdown voltage Package L = SOT23-3L Table 3: Ordering information Order code Marking(1) ESDA5V3L EL53 ESDA6V1L EL61 ESDA14V2L EL15 ESDA25L EL25 ESDA37L EL37 Package SOT23-3L Weight 8.7 mg Base qty. Delivery mode 3000 Tape and reel 9.8 mg Notes: (1)The 6 marking can be rotated by multiples of 90° to differentiate assembly location. Revision history Table 4: Document revision history 10/11 Date Revision Changes 31-Jul-2012 4 First issue. 20-Jul-2017 5 Added ESDA37L package information. DocID7058 Rev 5 ESDAL IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2017 STMicroelectronics – All rights reserved DocID7058 Rev 5 11/11
ESDA37L 价格&库存

很抱歉,暂时无法提供与“ESDA37L”相匹配的价格&库存,您可以联系我们找货

免费人工找货
ESDA37L
  •  国内价格
  • 5+0.89716
  • 50+0.87858
  • 150+0.86627

库存:23

ESDA37L
  •  国内价格 香港价格
  • 3000+0.697503000+0.08712
  • 6000+0.666886000+0.08329
  • 9000+0.576759000+0.07204
  • 30000+0.5659430000+0.07069
  • 75000+0.4686275000+0.05853
  • 150000+0.46141150000+0.05763

库存:29808