ESDA5-1F4

ESDA5-1F4 Low clamping single line unidirectional ESD Datasheet - production data Applications Where transient over voltage protection in ESD sensitive equipment is required, such as:      0201 package Smartphones, mobile phones and accessories Tablet, PC, netbooks and notebooks Portable multimedia devices and accessories Digital cameras and camcorders Communication and highly integrated systems Description Features      Low clamping voltage:  -3 V / +9 V (IEC 61000-4-2 contact discharge at 30 ns) Unidirectional device Low leakage current 0201 package ECOPACK®2 compliant component The ESDA5-1F4 is a unidirectional single line TVS diode designed to protect the data line or other I/O ports against ESD transients. The device is ideal for applications where both reduced line capacitance and board space saving are required. Figure 1: Functional diagram Complies with the following standards  IEC 61000-4-2, level 4 (exceed level 4)  ±30 kV (air discharge)  ±30 kV (contact discharge) May 2017 DocID030582 Rev 1 This is information on a product in full production. 1/9 www.st.com Characteristics 1 ESDA5-1F4 Characteristics Table 1: Absolute maximum ratings (Tamb = 25 °C) Symbol Parameter Value IEC61000-4-2 contact discharge ±30 IEC61000-4-2 air discharge ±30 Unit Vpp Peak pulse voltage kV Ppp Peak pulse power (8/20µs) 110 W Ipp Peak pulse current (8/20µs) 11 A Tj Operating junction temperature range -55 to +150 Tstg Storage junction temperature range -65 to +150 TL Maximum lead temperature for soldering during 10 s °C 260 Figure 2: Electrical characteristics (definitions) Table 2: Electrical characteristics (Tamb = 25 °C) Symbol Parameter VBR Breakdown voltage VRM Reverse working voltage IRM Leakage current VCL IR = 1 mA Dynamic resistance, pulse duration 100 ns(1) CLINE Line capacitance 2/9 Typ. Max. 5.8 Unit V 5.5 V 100 nA IEC 61000-4-2, +8 kV contact measured at 30 ns 9.0 V IEC 61000-4-2, -8 kV contact measured at 30 ns -3.0 V Direct 0.17 Forward 0.14 VLINE = 0 V, F = 1 MHz, VOSC = 30 mV 110 Notes: (1)More Min. VRM = 5.5 V Clamping voltage Rd Test condition information are available in ST application note: AN4022 DocID030582 Rev 1 Ω pF ESDA5-1F4 1.1 Characteristics Characteristics (curves) Figure 4: Junction capacitance versus frequency (typical values) Figure 3: Variation of leakage current versus junction temperature (typical values) 100 IR(nA) 140 90 T j = 25 °C F = 1 MHz V OSC = 30 mV 120 VR = VRM = 5.5 V 80 C (pF) 70 100 60 80 50 60 40 30 40 20 20 10 V R (V ) Tj(°C) 0 0 25 50 75 100 125 150 Figure 5: ESD response to IEC61000-4-2 (+8 kV contact discharge) Figure 7: Dynamic resistance (TLP conditions) 0 1 2 3 4 5 Figure 6: ESD response to IEC61000-4-2 (-8 kV contact discharge). Figure 8: S21 attenuation measurement result 0 dB -5 -10 -15 -20 -25 -30 -35 F(Hz) -40 300k 1M 3M Piece 1 DocID030582 Rev 1 10M 30M 100M 300M 1G 3G piece 2 3/9 Package information 2 ESDA5-1F4 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK ® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 2.1 0201 package information Figure 9: 0201 package outline Table 3: 0201 package mechanical data Dimensions Ref. Millimeters Min. Typ. Max. Min. Typ. Max. A 0.280 0.300 0.320 0.011 0.0118 0.0126 b 0.125 0.140 0.155 0.0049 0.0055 0.0061 D 0.570 0.600 0.630 0.0224 0.0236 0.0248 D1 4/9 Inches 0.350 0.0138 E 0.270 0.300 0.330 0.0106 0.0118 0.0130 E1 0.175 0.190 0.205 0.0069 0.0075 0.0081 fD 0.110 0.125 0.140 0.0043 0.0049 0.0055 fE 0.040 0.055 0.070 0.0016 0.0022 0.0028 DocID030582 Rev 1 ESDA5-1F4 Package information 6 Figure 10: Marking Product marking may be rotated by multiples of 90° for assembly plant differentiation. In no case should this product marking be used to orient the component for its placement on a PCB. Only pin 1 mark is to be used for this purpose. Figure 11: Tape and reel specification (in mm) Bar indicates Pin 1 DocID030582 Rev 1 5/9 Recommendation on PCB assembly ESDA5-1F4 3 Recommendation on PCB assembly 3.1 Footprint Figure 12: Footprint in mm 1. 3.2 SMD footprint design is recommended. Stencil opening design 1. Recommended design reference a. Stencil opening thickness: 75 μm / 3 mils Figure 13: Stencil opening recommendations 3.3 Solder paste 1. 2. 3. 4. 6/9 Halide-free flux qualification ROL0 according to ANSI/J-STD-004. “No clean” solder paste is recommended. Offers a high tack force to resist component movement during high speed. Solder paste with fine particles: powder particle size is 20-38 μm. DocID030582 Rev 1 ESDA5-1F4 3.4 Recommendation on PCB assembly Placement 1. 2. 3. 4. 5. 6. 3.5 PCB design preference 1. 2. 3.6 Manual positioning is not recommended. It is recommended to use the lead recognition capabilities of the placement system, not the outline centering Standard tolerance of ±0.05 mm is recommended. 1.0 N placement force is recommended. Too much placement force can lead to squeezed out solder paste and cause solder joints to short. Too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. To improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool. For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools. To control the solder paste amount, the closed via is recommended instead of open vias. The position of tracks and open vias in the solder area should be well balanced. The symmetrical layout is recommended, in case any tilt phenomena caused by asymmetrical solder paste amount due to the solder flow away. Reflow profile Figure 14: ST ECOPACK® recommended soldering reflow profile for PCB mounting Minimize air convection currents in the reflow oven to avoid component movement. Maximum soldering profile corresponds to the latest IPC/JEDEC J-STD-020. DocID030582 Rev 1 7/9 Ordering information 4 ESDA5-1F4 Ordering information Figure 15: Ordering information scheme ESDA 5 - 1 F4 ESD array Breakdown voltage 5 = 5.8 V min. Number of lines Package F4 = 0201 Table 4: Ordering information 5 Order code Marking Package Weight Base qty. Delivery mode ESDA5-1F4 6 ST0201 0.116 mg 15000 Tape and reel Revision history Table 5: Document revision history 8/9 Date Revision 02-May-2017 1 Changes Initial release. DocID030582 Rev 1 ESDA5-1F4 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2017 STMicroelectronics – All rights reserved DocID030582 Rev 1 9/9