ESDALY
Automotive dual Transil™ array for ESD protection
Datasheet - production data
Applications
Where transient overvoltage protection in ESD
sensitive equipment is required, such as:
Description
SOT23-3L
This device is a diode array designed to protect 1
line or 2 lines against ESD transients.
The device is ideal for applications where both
reduced line capacitance and board space saving
are required
Features
Entertainment
Signal communications
Connectivity
Comfort and convenience
AEC-Q101 qualified
Dual unidirectional Transil functions
Low leakage current: IR max. < 20 µA at VBR
300 W peak pulse power (8/20 µs)
It can also be used as bidirectional suppressor by
connecting only pin 1 and 2.
Figure 1: Functional diagram
Benefits
High ESD protection level: up to 25 kV
High integration
Suitable for high density boards
AEC-Q101 qualified
1
3
Complies with the following standards
ISO 10605: C = 330 pF, R = 330 Ω
30 kV (air discharge)
30 kV (contact discharge)
ISO 7637-3 fast transient
Pulse a: VS = -150 V
Pulse b: VS = +100 V
ISO 7637-3 slow transient
Positive pulse: VS = +85 V
Negative pulse : VS = -85 V
July 2017
2
DocID022075 Rev 2
This is information on a product in full production.
1/12
www.st.com
Characteristics
1
ESDALY
Characteristics
Table 1: Absolute maximum ratings (Tamb = 25 °C)
Symbol
Vpp
Ppp
Parameter
Value
ISO 10605 (C = 330 pF, R = 330 Ω):
Contact discharge
Air discharge
ISO 10605 (C = 150 pF, R = 330 Ω):
Contact discharge
Air discharge
Peak pulse voltage(1)
Peak pulse power (8/20 μs)
30
30
Unit
kV
30
30
300
W
25
18
14
7
6.3
A
ESDA5V3LY
ESDA6V1LY
ESDA14V2LY
ESDA25LY
ESDA37LY
Ipp
Peak pulse current (8/20 μs)
Tj
Operating junction temperature range
-40 to 150
°C
Tstg
Storage junction temperature range
-65 to 150
°C
TL
Maximum temperature for soldering during 10 s
260
°C
Notes:
(1)For
a surge greater than the maximum values, the diode will fail in short-circuit.
Figure 2: Electrical characteristics (definitions)
Symbol
VBR
VCL
VRM
IRM
IF
IPP
IR
VF
C
Rd
αT
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=
=
=
=
=
=
=
=
=
=
=
Parameter
Breakdown voltage
Clamping voltage
Stand-off voltage
Leakage current
Forward current
Peak pulse current
Breakdown current
Forward voltage drop
Capacitance
Dynamic impedance
Voltage temperature
DocID022075 Rev 2
I
IF
VBR
Vcl
VF
VRM
IRM
Slope = 1/Rd
IPP
V
ESDALY
Characteristics
Table 2: Electrical characteristics (Tamb = 25 °C)
VBR at IR
Order code
IRM at VRM
Min.
Max.
Max.
V
V
mA
µA
V
Rd(1)
αT(2)
Cline
VF at IF
Typ.
Max.
Typ. at 0 V bias
Max.
mΩ
10-4/°C
pF
V
mA
ESDA5V3LY
5.3
5.9
1
2
3
280
5
220
1.25
200
ESDA6V1LY
6.1
7.2
1
20
5.25
350
6
140
1.25
200
ESDA14V2LY
14.2
15.8
1
5
12
650
11
90
1.25
200
ESDA25LY
25
30
1
1
24
1000
11
50
1.2
10
ESDA37LY
37
43.3
1
1
36
2400
11
48
0.9
10
Notes:
(1)Square
(2)∆
pulse Ipp = 15 A, tp = 2.5 µs
VBR = αT x (Tamb -25 °C) x VBR (25 °C)
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3/12
Characteristics
1.1
ESDALY
Characteristics (curves)
Figure 3: Variation of peak pulse power versus
initial junction temperature
Figure 4: Peak pulse power versus exponential
pulse duration
PPP(W)
PPP(W)
350
Tj initial = 25 °C
maximum value
1000
300
250
200
150
100
100
50
Tj(°C)
0
25
50
75
100
125
ESDA5V3LY ESDA6V1LY ESDA14V2LY ESDA25LY
150
ESDA37LY
175
tp(µs)
10
10
Figure 5: Variation of clamping voltage versus
peak pulse current (max. values, 8/20 µs waveform)
100
1000
Figure 6: Relative variation of leakage current
at VR = VRM versus junction values
IPP(A)
Ir(nA)
100
Tj initial = 25 °C
8/20µs
10
10000
ESDA5V3LY
ESDA6V1LY
ESDA14V2LY
ESDA25LY
ESDA37LY
1000
100
10
1
1
ESDA5V3LY
ESDA6V1L
ESDA14V2LY
ESDA25LY
ESDA37LY
0.1
VCL(V)
0.1
0
4/12
10
20
30
40
50
Tj(°C)
0.01
60
DocID022075 Rev 2
25
50
75
100
125
150
ESDALY
Characteristics
Figure 7: ISO 7637-3 fast transient pulse a
response (VS = -150 V)
0.5 V/div
500 mA/div
Figure 8: ISO 7637-3 fast transient pulse b
response (VS = +100 V)
10 V/div
50 ns/div
500 mA/div
50 ns/div
50 ns/div
Figure 9: ISO 7637-3 slow transient positive
pulse(VS = +85 V)
10 V/div
2 A/div
50 ns/div
Figure 10: ISO 7637-3 slow transient negative
pulse(VS = -85 V)
10 V/div
5 µs/div
5 A/div
5 µs/div
DocID022075 Rev 2
5 µs/div
5 µs/div
5/12
Application and design guidelines
2
ESDALY
Application and design guidelines
Refer to STMicroelectronics application note:
6/12
AN2689: Protection of automotive electronics from electrical hazards, guidelines for
design and component selection.
DocID022075 Rev 2
Package information
ESDALY
3
Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
3.1
Epoxy meets UL 94,V0
Lead-free package
SOT23-3L mechanical data
Figure 11: SOT23-3L package outline
005 3390_I
DocID022075 Rev 2
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Package information
ESDALY
Table 3: SOT23-3L mechanical data
mm
Dim.
Min.
Typ.
Max.
A
0.89
1.40
A1
0
0.10
B
0.30
0.51
C
0.085
0.18
D
2.75
3.04
e
0.85
1.05
e1
1.70
2.10
E
1.20
1.75
H
2.10
3.00
L
0.60
S
0.35
0.65
L1
0.25
0.55
a
0°
8°
Figure 12: SOT23-3L recommended footprint
0.48
0.95
2.89
0.97
0.99
SOT-23 footp_I
Dimensions are in mm.
8/12
DocID022075 Rev 2
Recommendation on PCB assembly
ESDALY
4
Recommendation on PCB assembly
4.1
Solder paste
1.
2.
3.
4.
4.2
Placement
1.
2.
3.
4.
5.
6.
4.3
Halide-free flux qualification ROL0 according to ANSI/J-STD-004.
“No clean” solder paste is recommended.
Offers a high tack force to resist component movement during high speed.
Use solder paste with fine particles: powder particle size 20-45 µm.
Manual positioning is not recommended.
It is recommended to use the lead recognition capabilities of the placement system,
not the outline centering
Standard tolerance of ±0.05 mm is recommended.
3.5 N placement force is recommended. Too much placement force can lead to
squeezed out solder paste and cause solder joints to short. Too low placement force
can lead to insufficient contact between package and solder paste that could cause
open solder joints or badly centered packages.
To improve the package placement accuracy, a bottom side optical control should be
performed with a high resolution tool.
For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is
recommended during solder paste printing, pick and place and reflow soldering by
using optimized tools.
PCB design preference
1.
2.
To control the solder paste amount, the closed via is recommended instead of open
vias.
The position of tracks and open vias in the solder area should be well balanced. A
symmetrical layout is recommended, to avoid any tilt phenomena caused by
asymmetrical solder paste due to solder flow away.
DocID022075 Rev 2
9/12
Recommendation on PCB assembly
4.4
ESDALY
Reflow profile
Figure 13: ST ECOPACK® recommended soldering reflow profile for PCB mounting
Minimize air convection currents in the reflow oven to avoid component
movement.
10/12
DocID022075 Rev 2
Ordering information
ESDALY
5
Ordering information
Figure 14: Ordering information scheme
ESDA
XXX
LY
ESD Array
Minimum breakdown voltage
Package
L = SOT23-3L
Y = Automotive grade
Table 4: Ordering information
Order code
Marking(1)
ESDA5V3LY
EL5Y
ESDA6V1LY
EL6Y
ESDA14V2LY
EL1Y
ESDA25LY
EL2Y
ESDA37LY
EL3Y
Package
SOT23-3L
Weight
Base qty.
Delivery mode
3000
Tape and reel
8.7 mg
9.8 mg
Notes:
(1)The
6
marking can be rotated by multiples of 90° to differentiate assembly location.
Revision history
Table 5: Document revision history
Date
Revision
Changes
16-Feb-2012
1
Initial version. This document merges and updates the content of
the datasheet ESDA25LY Revision 1, 01-Feb-2010.
20-Jul-2017
2
Added ESDA37LY package information.
DocID022075 Rev 2
11/12
ESDALY
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Information in this document supersedes and replaces information previously supplied in any prior versions of this document.
© 2017 STMicroelectronics – All rights reserved
12/12
DocID022075 Rev 2
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