ESDARF01-1BM2

ESDARF01-1BM2 ESD protection for AM and FM antenna Datasheet − production data Features ■ Single line bidirectional protection ■ Very low capacitance (3 pF typical) ■ Lead-free package ■ Very low capacitance, line to ground, for optimized data integrity ■ Low PCB space consumption: 0.6 mm2 max ■ No insertion loss in AM and FM band ■ High reliability offered by monolithic integration 2 1 SOD-882 Complies with the following standards Figure 1. ■ IEC 61000-4-2: – 15 kV (air discharge) – 8 kV (contact discharge) ■ MIL STD 883G- Method 3015-7: class 3B: Functional diagram 1 Applications Where transient over voltage protection in ESD sensitive equipment is required, such as: ■ Portable audio systems ■ Communication systems ■ Cellular phone handsets and accessories ■ Audio and video equipment 2 Description The ESDARF01-1BM2 is a monolithic application specific device dedicated to ESD protection of the AM and FM antenna in cell phones and portable equipment. The device is ideal for applications where both reduced printed circuit board space and power absorption capability are required. June 2012 This is information on a product in full production. Doc ID 13462 Rev 3 1/11 www.st.com 11 Characteristics ESDARF01-1BM2 1 Characteristics Table 1. Absolute maximum ratings Symbol VPP (1) Tj Tstg TL Parameter Peak pulse voltage Value Unit 8 15 kV 125 °C - 55 to +150 °C 260 °C IEC 61000-4-2 contact discharge IEC 61000-4-2 air discharge Maximum operating junction temperature Storage temperature range Maximum lead temperature for soldering during 10 s at 5 mm for case 1. For a surge greater than the maximum values, the diode will fail in short-circuit. Figure 2. Electrical characteristics (definitions) I Symbol VBR VRM VCL IRM IPP = = = = = Parameter Breakdown voltage Stand-off voltage Clamping voltage Leakage current @ VRM Peak pulse current VCL VBR VRM Slope: 1/Rd Table 2. V VRM VBR VCL IRM IPP Electrical characteristics (values, Tamb = 25 °C) Value Symbol Unit Test conditions VBR Breakdown voltage IR = 1 mA IRM Leakage Current VRM = 100 mV Capacitance between I/O and GND VR = 0 V, F = 1 MHz, any I/O pin to GND Ci/o-i/o 2/11 Parameter Doc ID 13462 Rev 3 Min. Typ. Max. 0.7 1.0 1.3 V 0.3 µA 3.5 pF 3 ESDARF01-1BM2 Figure 3. Characteristics Relative variation of leakage current versus junction temperature (typical values) Figure 4. IR [T j] / IR [Tj=25°C] 10 0 S21 attenuation measurements (50 Ω / 50 Ω) dB VR =100 mV -2 -4 -6 -8 -10 -12 -14 -16 T j(°C) F (Hz) -18 1 75 100 -20 125 ESD response to IEC 61000-4-2 (+15 kV air discharge) 20 V/div Figure 5. 50 100k Figure 6. 1M 10M 1G 6G ESD response to IEC 61000-4-2 (-15 kV air discharge) 50 ns/div Figure 7. 100M 20 V/div 25 50 ns/div Junction capacitance versus frequency (typical values) C (pF) 8.00 6.00 4.00 2.00 F (MHz) 0.00 1 10 100 Doc ID 13462 Rev 3 1000 3/11 Application schematics 2 ESDARF01-1BM2 Application schematics Figure 8. Application schematics When the reference of earpieces (audio amplifier) is different from 0 V To bottom connector, reference of the earpieces and FM antenna ESDARF01-1BM2 To reference of earpieces (audio amplifier) 100 nF 270 nH To FM RF input of the FM module FM Receiver When the reference of earpieces (audio amplifier) is 0 V To bottom connector, reference of the earpieces and FM antenna 270 nH ESDARF01-1BM2 To FM RF input of the FM module FM Receiver Whatever the reference of earpieces (audio amplifier) 270 nH To reference of earpieces (audio amplifier) 100 nF To bottom connector, reference of the earpieces and FM antenna ESDARF01-1BM2 To FM RF input of the FM module 4/11 Doc ID 13462 Rev 3 FM Receiver ESDARF01-1BM2 3 Ordering information scheme Ordering information scheme Figure 9. Ordering information scheme ESDA RF 01 - 1B M2 ESD protection device Application RF Antenna Number of lines Directional B = Bidirectional Package M2 = SOD-882 Doc ID 13462 Rev 3 5/11 Package information 4 ESDARF01-1BM2 Package information ● Epoxy meets UL94, V0 ● Lead-free packages In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Figure 10. SOD882 dimension definitions L1 L2 b1 b2 PIN # 1 ID e A A1 E D Table 3. SOD882 dimension values Dimensions Ref. 6/11 Millimeters Inches Min. Typ. Max. Min. Typ. Max. A 0.40 0.47 0.50 0.016 0.019 0.020 A1 0.00 0.05 0.000 b1 0.45 0.50 0.55 0.018 0.020 0.022 b2 0.45 0.50 0.55 0.018 0.020 0.022 D 0.55 0.60 0.65 0.022 0.024 0.026 E 0.95 1.00 1.05 0.037 0.039 0.041 e 0.60 0.65 0.70 0.024 0.026 0.028 L1 0.20 0.25 0.30 0.008 0.010 0.012 L2 0.20 0.25 0.30 0.008 0.010 0.012 Doc ID 13462 Rev 3 0.002 ESDARF01-1BM2 Package information Figure 11. SOD882 footprint in mm (inches) 0.55 (0.022) Figure 12. Marking 0.55 (0.022) 0.50 0.020 IN Pin1 0.40 (0.016) Note: Pin 2 Product marking may be rotated by 90° for assembly plant differentiation. In no case should this product marking be used to orient the component for its placement on a PCB. Only pin 1 mark is to be used for this purpose. Figure 13. Tape and reel specifications Cathode bar Ø 1.55 2.0 4.0 1.75 0.20 3.5 1.10 8.0 D D D 0.68 D D All dimensions in mm D D 0.6 2.0 User direction of unreeling Doc ID 13462 Rev 3 7/11 Recommendation on PCB assembly ESDARF01-1BM2 5 Recommendation on PCB assembly 5.1 Stencil opening design 1. General recommendation on stencil opening design a) Stencil Opening Dimensions: L (Length), W (Width), T (Thickness). L T b) W General Design Rule Stencil thickness (T) = 75 ~ 125 µm W Aspect Ratio = ----- ≥ 1.5 T L×W Aspect Area = ---------------------------- ≥ 0.66 2T ( L + W ) 2. 5.2 8/11 Reference design a) Stencil opening thickness: 100 µm b) Stencil opening for leads: Opening to footprint ratio is 60% to 75%. Solder paste 1. Halide-free flux qualification ROL0 according to ANSI/J-STD-004. 2. “No clean” solder paste is recommended. 3. Offers a high tack force to resist component movement during high speed 4. Solder paste with fine particles: powder particle size is 20-45 µm. Doc ID 13462 Rev 3 ESDARF01-1BM2 5.3 5.4 5.5 Recommendation on PCB assembly Placement 1. Manual positioning is not recommended. 2. It is recommended to use the lead recognition capabilities of the placement system, not the outline centering 3. Standard tolerance of ± 0.05 mm is recommended. 4. 3.5 N placement force is recommended. Too much placement force can lead to squeezed out solder paste and cause solder joints to short. Too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. 5. To improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool. 6. For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools. PCB design preference 1. To control the solder paste amount, the closed via is recommended instead of open vias. 2. The position of tracks and open vias in the solder area should be well balanced. The symmetrical layout is recommended, in case any tilt phenomena caused by asymmetrical solder paste amount due to the solder flow away. Reflow profile Figure 14. ST ECOPACK® recommended soldering reflow profile for PCB mounting 240-245 °C Temperature (°C) 250 -2 °C/s to -3 °C/s -6 °C/s max 2 - 3 °C/s 60 sec (90 max) 200 150 100 0.9 °C/s 50 Time (s) 0 Note: 30 60 90 120 150 180 210 240 270 300 Minimize air convection currents in the reflow oven to avoid component movement. Doc ID 13462 Rev 3 9/11 Ordering information 6 ESDARF01-1BM2 Ordering information Table 4. Ordering information Order code Marking Package Weight Base qty Delivery mode ESDARF01-1BM2 D(1) SOD882 0.9 mg 12000 Tape and reel 1. The marking can be rotated by multiples of 90° to differentiate assembly location 7 Revision history Table 5. Document revision history Date Revision Changes 17-Apr-2007 1 First issue 17-Nov-2010 2 Updated Figure 4. and updated opening to footprint ratio to 60% 75% in Section 5: Recommendation on PCB assembly. Updated base qty in Table 4. 13-Jun-2012 10/11 3 Updated Table 3 and added Figure 10. Doc ID 13462 Rev 3 ESDARF01-1BM2 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. 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