ESDAXLC6-1BT2Y

ESDAXLC6-1BT2Y Datasheet Automotive single line ESD protection for high speed lines in 0402 Features • • • • • • • • • AEC-Q101 qualified Flow-through routing to keep signal integrity Ultra large bandwidth: 12 GHz Ultra low capacitance: 0.4 pF Extended operating junction temperature range: -55 °C to 150 °C RoHS compliant Complies with ISO 10605 - C = 150 pF, R = 330 Ω – ±16 kV (contact discharge) – ±30 kV (air discharge) Complies with ISO 10605 - C = 330 pF, R = 330 Ω – ±12 kV (contact discharge) – ±30 kV (air discharge) Complies with ISO 7637-3: – pulse 3a: Vs = -150 V – pulse 3b: Vs = +150 V – pulse 2a: Vs = ±85 V Application Product status link ESDAXLC6-1BT2Y The ESDAXLC6-1BT2Y is designed to protect against electrostatic discharge on automotive circuits such as: • APIX • LVDS & digital video interface • Ethernet and BroadrReach • USB 2.0 and USB 3.0 • High speed communication buses • RF front-end Description The ESDAXLC6-1BT2Y is an ESD device designed for high-speed lines protection. DS10560 - Rev 2 - May 2021 For further information contact your local STMicroelectronics sales office. www.st.com ESDAXLC6-1BT2Y Characteristics 1 Characteristics Table 1. Absolute maximum ratings (Tamb = 25 °C) Symbol Parameter Value Unit ISO10605 / IEC 61000-4-2 (C = 150 pF, R = 330 Ω): VPP Peak pulse voltage Contact discharge 16 Air discharge 30 kV ISO10605 (C = 330 pF, R = 330 Ω) Contact discharge 12 Air discharge 30 PPP Peak pulse power dissipation (8/20 µs) 40 W IPP Peak Pulse current (8/20 µs) 1.3 A Tstg Storage temperature range -65 to +150 °C Tj Operating junction temperature range -55 to +150 °C TL Maximum lead temperature for soldering during 10 s 260 °C Figure 1. Electrical characteristics (definitions) Ipp Stand-off voltage Table 2. Electrical characteristics (values) (Tamb = 25° C) Symbol Min. Typ. Max. Unit 6 9 11 V nA VBR IR = 1 mA IR VR = 3 V 50 IPP = 1 A, 8/20 µs 17 VCL Rd CI/O-GND fC DS10560 - Rev 2 Test conditions ISO 10605- C = 150 pF, R = 330 Ω +8 kV contact discharge, measured at 30 ns V 37 TLP, pulse duration 100 ns, 16 A 41 TLP, pulse duration 100 ns, 16 A 2 VI/O = 0 V, 200 MHz < f < 3 GHz, VOSC = 30 mV 0.4 S21 = -3 dB 12 Ω 0.5 pF GHz page 2/13 ESDAXLC6-1BT2Y Characteristics (curves) 1.1 Characteristics (curves) Figure 2. Leakage current versus junction temperature Figure 3. Junction capacitance versus reverse applied voltage IR(nA) C(pF) 10 0.8 0.7 0.6 1 0.5 0.4 0.1 0.3 0.2 Tj(°C) 0.01 25 125 100 75 50 150 0.1 0 VR(V) 0 1 Figure 4. TLP 2 3 4 5 Figure 5. S21 attenuation I(A) 0 30 S 21 ( d B ) -1 20 -2 10 -3 0 -4 -10 -5 -20 -6 V(V) -30 -60 -40 -20 0 20 40 60 Figure 6. ESD response to ISO 10605 - C = 150 pF, R = 330 Ω (-8 kV contact discharge) DS10560 - Rev 2 F( H z) -7 100 M 300 M 1G 3G 10 G 30 G Figure 7. ESD response to ISO 10605 C = 150 pF, R = 330 Ω (+8 kV contact discharge) page 3/13 ESDAXLC6-1BT2Y Characteristics (curves) Figure 8. ESD response to ISO 7637-3 pulse 3a: -150 V Figure 9. ESD response to ISO 7637-3 pulse 3b: +150 V Figure 10. ESD response to ISO 7637-3 pulse 2a: -85 V Figure 11. ESD response to ISO 7637-3 pulse 2a: +85 V Figure 12. H2 harmonic versus input power at 710 MHz Figure 13. H3 harmonic versus input power at 710 MHz DS10560 - Rev 2 page 4/13 ESDAXLC6-1BT2Y Characteristics (curves) Figure 14. H2 harmonic versus input power at 824 MHz Figure 15. H3 harmonic versus input power at 824 MHz Figure 16. H2 harmonic versus input power at 2400 MHz Figure 17. H3 harmonic versus input power at 2400 MHz DS10560 - Rev 2 page 5/13 ESDAXLC6-1BT2Y Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 2.1 Package information Figure 18. Package outline A L1 b2 e D b1 E A1 L2 Table 3. Package mechanical data Dimensions Millimeters Ref. Min. DS10560 - Rev 2 Typ. Max. A 0.30 0.40 A1 0.00 0.05 L1 0.45 0.50 0.55 L2 0.45 0.50 0.55 D 0.95 1.00 1.05 E 0.55 0.60 0.65 e 0.60 0.65 0.70 b1 0.20 0.25 0.30 b2 0.20 0.25 0.30 page 6/13 ESDAXLC6-1BT2Y Packing and marking information 2.2 Packing and marking information Figure 19. Marking layout Figure 20. Package orientation in reel X Pin1 Pin2 Taped according to EIA-481 Note: X: Refer to ordering information table for marking. Pocket dimensions are not on scale Pocket shape may vary depending on package On bidirectional devices, marking and logo may be not always in the same direction Figure 21. Tape leader and trailer dimensions End Carrier tape Top cover tape Figure 22. Tape and reel orientation Start 100 mm min 400 mm min 160 mm min Trailer Components Leader Figure 23. Reel dimensions (mm) Ø 180 max Figure 24. Inner box dimensions (mm) 30 14.4 2±0.5 Ø 13 205 Ø 60 Ø 20.2 min 205 DS10560 - Rev 2 page 7/13 ESDAXLC6-1BT2Y Packing and marking information Figure 25. Tape outline Table 4. Tape and reel mechanical data Dimensions Millimeters Ref. DS10560 - Rev 2 Min. Typ. Max. D0 1.45 1.5 1.6 D1 0.35 F 3.45 3.5 3.55 K0 0.42 0.47 0.52 P0 3.9 4 4.1 P1 1.95 2 2.05 P2 1.95 2 2.05 W 7.9 8 8.3 page 8/13 ESDAXLC6-1BT2Y Assembly recommendations 3 Assembly recommendations 3.1 Recommended footprint Figure 26. Recommended footprint in mm 0.4 0.55 0.5 0.55 1.5 Note: 3.2 Solder mask defined (SMD) recommended. Stencil opening design Stencil opening thickness: 75 μm / 3 mils Figure 27. Stencil opening recommendations 0.428 0.522 0.474 0.522 3.3 Solder paste 1. 2. 3. 4. DS10560 - Rev 2 Halide-free flux, qualification ROL0 according to ANSI/J-STD-004. “No clean” solder paste recommended. Tack force high enough to resist component displacement during PCB movement. Particles size 20-38 µm per IPCJ STD-005. page 9/13 ESDAXLC6-1BT2Y Placement 3.4 Placement 1. 2. 3. 4. 3.5 PCB design preference 1. 2. 3.6 It is recommended to use leads recognition instead of package outline for accurate placement on footprint with adequate resolution tool. Tolerance of ±50 µm (25% offset allowed on the smallest dimension of the smallest pad) is recommended. 1.0 N placement force is recommended. Too much placement force can lead to squeezed out solder paste and cause solder joints to short. Too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools. Any via around or inside the footprint area must be closed to avoid solderpaste migration in the via. Position and dimensions of the tracks should be well balanced. A symmetrical layout is recommended to prevent assembly troubles. Reflow profile Figure 28. ST ECOPACK recommended soldering reflow profile for PCB mounting 250 240-245 °C Temperature (°C) -2 °C/s 2 - 3 °C/s 60 sec (90 max) 200 -3 °C/s 150 -6 °C/s 100 0.9 °C/s 50 Time (s) 0 Note: DS10560 - Rev 2 30 60 90 120 150 180 210 240 270 300 Minimize air convection currents in the reflow oven to avoid component movement. O2 rate inside the oven must be below 500 ppm. Maximum soldering profile corresponds to the latest IPC/JEDEC J-STD-020. page 10/13 ESDAXLC6-1BT2Y Ordering information 4 Ordering information Figure 29. Ordering information scheme ESDA XLC 6 - 1 B T2 Y ESD array Extra low capacitance Breakdown voltage 6 = 6 Volts min Number of lines Directional B = Bidirectional Package T2 = Thin SOD882 (0402) Automotive Table 5. Ordering information Order code Marking(1) Package Weight Base qty. Delivery mode ESDAXLC6-1BT2Y U SOD882T (0402) 0.80 mg 12000 Tape and reel 1. The marking can be rotated by multiples of 90° to differentiate assembly location DS10560 - Rev 2 page 11/13 ESDAXLC6-1BT2Y Revision history Table 6. Document revision history DS10560 - Rev 2 Date Version 03-Nov-2014 1 03-May-2021 2 Changes Initial release. Updated SOD882T (0402) package information. Minor text changes. page 12/13 ESDAXLC6-1BT2Y IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. 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Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2021 STMicroelectronics – All rights reserved DS10560 - Rev 2 page 13/13