ESDLIN03-1BWY

ESDLIN03-1BWY Automotive single-line Transil™, transient voltage suppressor (TVS) for LIN bus Datasheet - production data Complies with the following standards  ISO 10605 - C = 150 pF, R = 330 Ω  – ±30 kV (air discharge) – ±30 kV (contact discharge)     ISO 10605 - C = 330 pF, R = 330 Ω  – ±30 kV (air discharge) – ±30 kV (contact discharge)  ISO 7637-3: – Pulse 3a: Vs = -150 V – Pulse 3b: Vs = +100 V 627/ Application Figure 1. Functional schematic LIN bus lines where electrostatic discharge and other transients must be suppressed. This product is compliant with most of automotive interfaces.  Description   1& The ESDLIN03-1BWY is a single-line Transil specifically designed for the protection of the automotive LIN bus lines against electrostatic discharge (ESD) and transient voltages. 7RSYLHZ Features  Single-line ESD and EOS protection  Stand-off voltage: 26.5 V  Bidirectional device  Max pulse power: 250 W (8/20 µs)  Low clamping factor VCL / VBR  Low leakage current  ECOPACK®2 compliant component  AEC-Q101 qualified January 2016 This is information on a product in full production. TM: Transil is a trademark of STMicroelectronics DocID028224 Rev 1 1/10 www.st.com Characteristics 1 ESDLIN03-1BWY Characteristics Table 1. Absolute maximum ratings (Tamb = 25°C) Symbol VPP Parameter Electrostatic discharge capability ISO 10605 - C = 150 pF, R = 330 Ω : Contact discharge Air discharge 30 30 ISO 10605 - C = 330 pF, R = 330 Ω  Contact discharge Air discharge 30 30 HBM MIL STD 883 30 PPP Peak pulse power dissipation (8/20 µs) IPP Peak pulse current (8/20 µs) Tj Tstg Value Tj initial = Tamb kV 250 W 3.7 A Operating junction temperature range -55 to +175 °C Storage temperature range -55 to +175 °C Figure 2. Electrical characteristics (definitions) 6\PERO 9%5 950 9&/ ,50 ,33 5G 3DUDPHWHU %UHDNGRZQYROWDJH 6WDQGRI YROWDJH &ODPSLQJYROWDJH /HDNDJHFXUUHQW DW 950 3HDNSXOVHFXUUHQW '\QDPLFLPSHGDQFH ,UU 9&/ 9%5 950 ,50 ,5 ,33 2/10 Unit DocID028224 Rev 1 9&/ ESDLIN03-1BWY Characteristics Table 2. Electrical characteristics (values, Tamb = 25 °C) Symbol Test conditions VRM ESDLIN03-1BWY VBR IR = 1 mA Min. VRM = 5V V VRM = 24 V 1 nA 50 Tj = 125 °C 10 -39 ISO 7637-3 Pulse 3b (Us = +100 V) 39 IEC 61000-4-5 (8/20 µs), IPP = 1 A 37 IEC 61000-4-5 (8/20 µs), IPP = 3A 44 VR = 0 V DC, f = 1 MHz T(1) 26.5 10 ISO 7637-3 Pulse 3a (Us = -150 V) C Unit V Tj = 25 °C VRM = 5V VCL Max. 28.5 VRM = 24 V IRM Typ. 3 V 3.5 pF 9 10-4/°C Voltage temperature coefficient 1. VBR at Tj = VBR at 25°C x (1 + αT x (Tj – 25)) Figure 3. Peak pulse current versus initial junction temperature (maximum values)  Figure 4. Junction capacitance versus reverse voltage applied &S) , 33 $  I  0+] 9RVF P9506 7M ƒ&  —V                7Mƒ&        959    DocID028224 Rev 1             3/10 10 Characteristics ESDLIN03-1BWY Figure 5. Peak pulse current versus clamping voltage Figure 6. Leakage current versus junction temperature ,33 $   —V 7MLQLWLDO ƒ& ,5Q$ —V 7MLQLWLDO ƒ& 950 9  —V 7MLQLWLDO ƒ&  950 9  9&/ 9       6G%         Figure 7. S21 attenuation measurement  7 ƒ& M   Figure 8. ESD response to ISO 10605 C = 150 pF, R = 330 Ω (+8 kV contact) 6GG 9GLY        QVGLY I+]  0 0 0 0 * * Figure 9. ESD response to ISO 10605 C = 150 pF, R = 330 Ω (-8 kV contact) Figure 10. Response to ISO 7637-3 Pulse 3a (Us = -150 V) 9GLY 9GLY P$GLY QVGLY 4/10 DocID028224 Rev 1 QVGLY ESDLIN03-1BWY Characteristics Figure 11. Response to ISO 7637-3 Pulse 3b (Us = +100 V) Figure 12. TLP measurements  ,33$ 9GLY  ,33 I9&/  P$GLY   QVGLY 9&/9   DocID028224 Rev 1       5/10 10 Package information 2 ESDLIN03-1BWY Package information  Epoxy meets UL94, V0  Lead-free packages In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 2.1 SOT323-3L package information Figure 13. SOT323-3L package outline $ ( H ' E $ F ș / + 6/10 DocID028224 Rev 1 ESDLIN03-1BWY Package information Table 3. SOT323-3L package mechanical data Dimensions Ref. Inches(1) Millimeters Min. Typ. Max. Min. Typ. Max. A 0.8 1.1 0.031 0.043 A1 0.0 0.1 0.0 0.004 b 0.25 0.4 0.01 0.016 c 0.1 0.26 0.004 0.01 D 1.8 2.0 2.2 0.071 0.079 0.086 E 1.15 1.25 1.35 0.045 0.049 0.053 e 0.65 0.026 H 1.8 2.1 2.4 0.071 0.083 0.094 L 0.1 0.2 0.3 0.004 0.008 0.012 ϴ 0 30° 0 30° 1. Values in inches are converted from mm and rounded to 4 decimal digits. Figure 14. SOT323-3L footprint dimensions in mm (inches)       DocID028224 Rev 1     7/10 10 Package information 2.2 2.3 ESDLIN03-1BWY PCB design preference 1. To control the solder paste amount, the closed via is recommended instead of open vias. 2. The position of tracks and open vias in the solder area should be well balanced. The symmetrical layout is recommended, in case any tilt phenomena caused by asymmetrical solder paste amount due to the solder flow away. Reflow profile Figure 15. ST ECOPACK® recommended soldering reflow profile for PCB mounting ƒ& 7HPSHUDWXUHƒ&   ƒ&V ƒ&V  VHF  PD[   ƒ&V   ƒ&V  ƒ&V  7LPHV            Minimize air convection currents in the reflow oven to avoid component movement. Maximum soldering profile corresponds to the latest IPC/JEDEC J-STD-020. 8/10 DocID028224 Rev 1 ESDLIN03-1BWY 3 Ordering information Ordering information Figure 16. Ordering information scheme (6'/ ,1 [ %:< (6'SURWHFWLRQ /,1 'HVLJQHGIRU/,1EXV [ 9HUVLRQ  6LQJOHOLQH % %LGLUHFWLRQDO : 627