ESDV5-1BF4

ESDV5-1BF4 Low clamping, very low capacitance bidirectional single line ESD protection Datasheet - production data Description The ESDV5-1BF4 is a bidirectional single line TVS diode designed to protect the data line or other I/O ports against ESD transients. The device is ideal for applications where both reduced line capacitance and board space saving are required. Figure 1: Functional diagram Features        Low clamping voltage Bidirectional device Low leakage current 0201 package Ultralow PCB area: 0.18 mm2 ECOPACK®2 compliant component Exceeds the IEC 61000-4-2 level 4 standard:  ±30 kV (air discharge)  ±12 kV (contact discharge) Applications Where transient overvoltage protection in ESD sensitive equipment is required, such as:      Smartphones, mobile phones and accessories Tablets and notebooks Portable multimedia devices and accessories Wearable, home automation, healthcare Highly integrated systems November 2016 DocID029509 Rev 1 This is information on a product in full production. 1/10 www.st.com Characteristics 1 ESDV5-1BF4 Characteristics Table 1: Absolute ratings (Tamb = 25 °C) Symbol Parameter Value Unit 12 30 kV IEC 61000-4-2 Contact discharge Air discharge VPP Peak pulse voltage PPP Peak pulse power dissipation (8/20 μs) 20 W IPP Peak pulse current (8/20 μs) 1.7 A Tj Operating junction temperature range -55 to +150 °C Tstg Storage temperature range -65 to +150 °C TL Maximum lead temperature for soldering during 10 s 260 °C Figure 2: Electrical characteristics (definitions) Table 2: Electrical characteristics (Tamb = 25 °C) Symbol VBR IR = 1 mA IRM VRM = 5.5 V VCL 8 kV contact discharge after 30 ns, IEC 61000-4-2 CLINE RD 2/10 Test condition Min. Typ. 5.8 1 F = 1 MHz, VLINE = 0 V, VOSC = 30 mV Pulse duration 100 ns DocID029509 Rev 1 Max. Unit 8.5 V 100 nA 16.3 5 0.67 V 7 pF Ω ESDV5-1BF4 1.1 Characteristics Characteristics (curves) Figure 3: Leakage current versus junction temperature (typical values) Figure 4: Junction capacitance versus reverse voltage applied (typical values) IR(nA) 40 C(pF) 6 35 VR = VRM = 5 V Forward and Reverse 30 5 4 25 3 20 15 2 10 1 5 0 0 0 0 25 50 75 Tj(°C) 100 125 1 2 150 3 4 5 VR(V) Figure 5: ESD response to IEC 61000-4-2 (+8 kV contact discharge) Figure 6: ESD response to IEC 61000-4-2 (-8 kV contact discharge) 5 V/div 5 V/div 30 V 1 1 2 3 4 16 V 2 Peak clamping voltage Clamping voltage at 30 ns Clamping voltage at 60 ns Clamping voltage at 100 ns 15 V 3 11 V 4 -11 V 4 3 2 -16 V -15 V 1 2 3 4 20 ns/div Figure 7: TLP characteristic 24 22 20 18 16 14 12 10 8 6 4 2 0 -30 V 20 ns/div Figure 8: S21 attenuation measurement result S21 (dB) IPP(A) 0 1 Peak clamping voltage Clamping voltage at 30 ns Clamping voltage at 60 ns Clamping voltage at 100 ns 10 20 30 VCL (V) DocID029509 Rev 1 3/10 Package information 2 ESDV5-1BF4 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 2.1 0201 package information Figure 9: ST0201 package outline 4/10 DocID029509 Rev 1 Package information ESDV5-1BF4 Table 3: ST0201 package mechanical data Dimensions Ref. Millimeters Min. Typ. A 0.270 0.300 0.330 b 0.1675 0.1875 0.2075 D 0.56 0.58 0.60 D1 2.2 Max. 0.3375 E 0.260 0.280 0.300 E1 0.205 0.225 0.245 fD 0.0175 0.0275 0.0375 fE 0.0175 0.0275 0.0375 ESDV5-1BF4 marking and tape and reel Figure 10: Marking M Product marking may be rotated by multiples of 90° for assembly plant differentiation. In no case should this product marking be used to orient the component for its placement on a PCB. Only pin 1 mark is to be used for this purpose. DocID029509 Rev 1 5/10 Package information ESDV5-1BF4 Figure 11: Tape and reel specification (in mm) Bar indicates Pin 1 4.0 ± 0.1 Ø 1.5 ± 0.1 1.75 ± 0.1 2.0 ± 0.05 0.36 ± 0.03 3.5 ± 0.05 0.68 ± 0.03 8.0 + 0.03 - 0.01 0.22 0.38 ± 0.03 2.0 ± 0.05 All dimensions in mm 6/10 User direction of unreeling DocID029509 Rev 1 Recommendation on PCB assembly ESDV5-1BF4 3 Recommendation on PCB assembly 3.1 Footprint 1. Footprint in mm a. SMD footprint design is recommended. Figure 12: Footprint in mm 3.2 Stencil opening design 1. Reference design a. Stencil opening thickness: 75 μm / 3 mils Figure 13: Recommended stencil window position in mm (inches) 3.3 Solder paste 1. 2. 3. 4. Halide-free flux qualification ROL0 according to ANSI/J-STD-004. “No clean” solder paste is recommended. Offers a high tack force to resist component movement during high speed. Solder paste with fine particles: powder particle size is 20-38 μm. DocID029509 Rev 1 7/10 Recommendation on PCB assembly 3.4 Placement 1. 2. 3. 4. 5. 6. 3.5 Manual positioning is not recommended. It is recommended to use the lead recognition capabilities of the placement system, not the outline centering Standard tolerance of ±0.05 mm is recommended. 3.5 N placement force is recommended. Too much placement force can lead to squeezed out solder paste and cause solder joints to short. Too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. To improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool. For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools. PCB design preference 1. 2. 3.6 ESDV5-1BF4 To control the solder paste amount, the closed via is recommended instead of open vias. The position of tracks and open vias in the solder area should be well balanced. A symmetrical layout is recommended, to avoid any tilt phenomena caused by asymmetrical solder paste due to solder flow away. Reflow profile Figure 14: ST ECOPACK® recommended soldering reflow profile for PCB mounting Minimize air convection currents in the reflow oven to avoid component movement. Maximum soldering profile corresponds to the latest IPC/JEDEC JSTD-020. 8/10 DocID029509 Rev 1 Ordering information ESDV5-1BF4 4 Ordering information Figure 15: Ordering information scheme ESD V 5 - 1 B F4 ESD protection Very low capacitance Stand-off voltage at 5.5 V max. Number of lines Directional B = Bi-directional Package F4 = ST0201 Table 4: Ordering information Order code Marking Package Weight Base qty. Delivery mode ESDV5-1BF4 M(1) ST0201 0.116 mg 15000 Tape and reel Notes: (1)The 5 marking can be rotated by multiples of 90° to differentiate assembly location Revision history Table 5: Document revision history Date Revision 30-Nov-2016 1 Changes First issue. DocID029509 Rev 1 9/10 ESDV5-1BF4 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2016 STMicroelectronics – All rights reserved 10/10 DocID029509 Rev 1