ESDZV5-1BF4

ESDZV5-1BF4 Datasheet Ultra low clamping single line bidirectional ESD protection Features • • • • • • 0201 package Figure 1. Functional diagram Ultra low clamping voltage: 7 V (IEC 61000-4-2 contact discharge 8 kV at 30 ns / 16 A TLP) Bidirectional device Low leakage current 0201 package ECOPACK2 compliant component Exceeds the followig standard: – IEC 61000-4-2 level 4 = ±30 kV (air discharge) and ±18 kV (contact discharge) Application Where transient over voltage protection in ESD sensitive equipment is required, such as: • Smartphones, mobile phones and accessories • Tablets and notebooks • Portable multimedia devices and accessories • Wearable, home automation, healthcare • Highly integrated systems Description The ESDZV5-1BF4 is a bidirectional single line TVS diode designed to protect the data line or other I/O ports against ESD transients. The device is ideal for applications where both reduced line capacitance and board space saving are required. Product status ESDZV5-1BF4 DS11928 - Rev 3 - January 2022 For further information contact your local STMicroelectronics sales office. www.st.com ESDZV5-1BF4 Characteristics 1 Characteristics Table 1. Absolute ratings (Tamb = 25 °C) Symbol Parameter Value Contact discharge 18 Air discharge 30 Unit VPP Peak pulse voltage PPP Peak pulse power dissipation (8/20 μs) 70 W IPP Peak pulse current (8/20 μs) 7 A Tj Operating junction temperature range -55 to +150 °C Storage temperature range -65 to +150 °C 260 °C Tstg TL Maximum lead temperature for soldering during 10 s kV Figure 2. Electrical characteristics (definitions) I Symbol VTrig VCL IRM VRM IPP = = = = = Parameter Trigger voltage Clamping voltage Leakage current @ V RM Stand-off voltage Peak pulse current RD VH = = Dynamic resistance Holding voltage CLINE = Input capacitance per line RD VRM VCL VTrig VH V IRM IPP Table 2. Electrical characteristics (Tamb = 25 °C) Symbol VTrig Test condition Higher voltage than VTrig guarantees the protection turn-on VH Lower voltage than VH guarantees the protection turn-off IRM VRM = 5.5 V(1) VCL 8 kV contact discharge after 30 ns, IEC 61000-4-2 VCL 8/20 µs waveform, IPP = 7 A CLINE RD F = 1 MHz, VLINE = 0 V, VOSC = 30 mV Pulse duration 100 ns Min. Typ. 5.8 4 Max. Unit 10 V 100 nA 4.6 7 6 0.18 V 10 V 7.5 pF Ω 1. Application note: when used to protect a line connected to a DC source, the DC voltage must be lower than the minimum VH to enable the diode to return to its non-conducting state after the transient. DS11928 - Rev 3 page 2/10 ESDZV5-1BF4 Characteristics (curves) 1.1 Characteristics (curves) Figure 3. Leakage current versus junction temperature (typical values) Figure 4. Junction capacitance versus reverse voltage applied (typical values) C (pF ) 7 Ir(nA) 120 6 100 5 80 4 60 3 40 2 20 1 0 25 50 75 100 125 150 0 Tj(°C) 0 Figure 5. ESD response to IEC 61000-4-2 (+8 kV contact discharge) 5 V/div 1 2 3 Vbias(V) 4 5 6 Figure 6. ESD response to IEC 61000-4-2 (-8 kV contact discharge) 5 V/div 1 2 3 4 22 V 1 Peak clamping voltage Clamping voltage at 30 ns Clamping voltage at 60 ns Clamping voltage at 100 ns 4 3 2 7V 6V 2 -7 V -6 V 5V 3 -5 V 4 1 2 3 4 1 -22 V Peak clamping voltage Clamping voltage at 30 ns Clamping voltage at 60 ns Clamping voltage at 100 ns 20 ns/div 20 ns/div Figure 7. TLP characteristic 18 Figure 8. S21 attenuation measurement result I(A) 0 S21(dB) 16 -5 14 12 10 -10 8 6 -15 4 2 -20 0 0 1 2 3 4 V(V) DS11928 - Rev 3 5 6 7 8 9 10 MHz 100 MHz Frequency 1 GHz 10 GHz page 3/10 ESDZV5-1BF4 Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 2.1 0201 package information Figure 9. 0201 package outline Note: DS11928 - Rev 3 The marking codes can be rotated by 90 ° or 180° to differentiate assembly location. In no case should this product marking be used to orient the component for its placement on a PCB. Only pin 1 mark is to be used for this purpose. page 4/10 ESDZV5-1BF4 0201 package information Table 3. 0201 package mechanical data Dimensions Millimeters Ref. Min. Typ. Max. A 0.270 0.300 0.330 b 0.1675 0.1875 0.2075 D 0.560 0.580 0.600 D1 0.3375 E 0.260 0.280 0.300 E1 0.205 0.225 0.245 fD 0.0175 0.0275 0.0375 fE 0.0175 0.0275 0.0375 Figure 10. Marking A Note: The marking can be rotated by multiples of 90° to differentiate assembly location. Figure 11. Tape and reel specification (in mm) Bar indicates Pin 1 4.0 ± 0.1 Ø 1.5 ± 0.1 1.75 ± 0.1 2.0 ± 0.05 0.36 ± 0.03 3.5 ± 0.05 0.67 ± 0.03 8.0 + 0.03 - 0.01 0.22 0.38 ± 0.03 2.0 ± 0.05 All dimensions in mm DS11928 - Rev 3 User direction of unreeling page 5/10 ESDZV5-1BF4 Recommendation on PCB assembly 3 Recommendation on PCB assembly 3.1 Footprint Figure 12. Recommended footprint in mm 0.150 0.225 0.187 Solder mask opening 3.2 Stencil opening design 1. Reference design a. Stencil opening thickness: 75 μm / 3 mils Figure 13. Recommended stencil window position in mm 0.167 0.210 0.170 Stencil apertures DS11928 - Rev 3 page 6/10 ESDZV5-1BF4 Solder paste 3.3 Solder paste 1. 2. 3. 4. 3.4 Placement 1. 2. 3. 4. 5. 6. 3.5 Manual positioning is not recommended. It is recommended to use the lead recognition capabilities of the placement system, not the outline centering Standard tolerance of ±0.05 mm is recommended. 1.0 N placement force is recommended. Too much placement force can lead to squeezed out solder paste and cause solder joints to short. Too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. To improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool. For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools. PCB design preference 1. 2. 3.6 Halide-free flux qualification ROL0 according to ANSI/J-STD-004. “No clean” solder paste is recommended. Offers a high tack force to resist component movement during high speed. Use solder paste with fine particles: powder particle size 20-38 µm. To control the solder paste amount, the closed via is recommended instead of open vias. The position of tracks and open vias in the solder area should be well balanced. A symmetrical layout is recommended, to avoid any tilt phenomena caused by asymmetrical solder paste due to solder flow away. Reflow profile Figure 14. ST ECOPACK recommended soldering reflow profile for PCB mounting 250 240-245 °C Temperature (°C) -2 °C/s 2 - 3 °C/s 60 sec (90 max) 200 -3 °C/s 150 -6 °C/s 100 0.9 °C/s 50 Time (s) 0 Note: DS11928 - Rev 3 30 60 90 120 150 180 210 240 270 300 Minimize air convection currents in the reflow oven to avoid component movement. Maximum soldering profile corresponds to the latest IPC/JEDEC J-STD-020. page 7/10 ESDZV5-1BF4 Ordering information 4 Ordering information Figure 15. Ordering information scheme ESD Z V 5 - 1 B F4 ESD protection Z : Ultra low Clamping snapback effect V : Very Low Capacitance 5 : Stand-off voltage at 5.5 V max. Number of lines B = Bi-directional Package F4 = 0201 Table 4. Ordering information Order code Marking Package Weight Base qty. Delivery mode ESDZV5-1BF4 A(1) 0201 0.116 mg 15000 Tape and reel 1. The marking can be rotated by multiples of 90° to differentiate assembly location DS11928 - Rev 3 page 8/10 ESDZV5-1BF4 Revision history Table 5. Document revision history DS11928 - Rev 3 Date Revision Changes 06-Apr-2017 1 First issue. 28-Jul-2017 2 Updated footprint title. 19-Jan-2022 3 Updated Figure 12. Minor text changes. page 9/10 ESDZV5-1BF4 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. 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