ESDZV5H-1BU2

ESDZV5H-1BU2 Datasheet Ultra low clamping single line bidirectional ESD protection Features • 0201 package • • • • • Ultra low clamping voltage: – 10 V (IEC 61000-4-2 contact discharge 8 kV at 30 ns/ 16 A TLP) Bidirectional and symmetrical device High holding voltage for DC line protection 0201 package ECOPACK2 compliant component Complies with IEC 61000-4-2 level 4 – ±30 kV (air discharge) – ±14 kV (contact discharge) Applications Where transient over voltage protection in ESD sensitive equipment is required, such as: • Smartphones, mobile phones and accessories • Tablets and notebooks • Portable multimedia devices and accessories • Wearable, home automation, healthcare • Highly integrated systems Product status link Description ESDZV5H-1BU2 The ESDZV5H-1BU2 is a bidirectional single line TVS diode designed to protect the data line or other I/O ports against ESD transients. Product summary The device is ideal for applications where reduced line capacitance and board space saving are required. Order code ESDZV5H-1BU2 Package ST0201 Packing Tape and reel DS12237 - Rev 5 - March 2020 For further information contact your local STMicroelectronics sales office. www.st.com ESDZV5H-1BU2 Characteristics 1 Characteristics Table 1. Absolute maximum ratings (Tamb = 25 °C) Symbol Parameter Value IEC 61000-4-2 contact discharge 14 IEC 61000-4-2 air discharge 30 Unit VPP Peak pulse voltage PPP Peak pulse power dissipation (8/20 μs) 40 W IPP Peak pulse current (8/20 μs) 4 A Tj Operating junction temperature range -55 to +150 °C Storage temperature range -65 to +150 °C 260 °C Tstg TL Maximum lead temperature for soldering during 10 s kV Figure 1. Electrical characteristics (definitions) I Symbol VTrig VCL IRM VRM IPP = = = = = Parameter Trigger voltage Clamping voltage Leakage current @ V RM Stand-off voltage Peak pulse current RD VH = = Dynamic resistance Holding voltage CLINE = Input capacitance per line RD VRM VCL VTrig VH V IRM IPP Table 2. Electrical characteristics (Tamb = 25 °C) Symbol VTrig VH Test condition Min. Higher voltage than VTrig guarantees the protection turn-on 6.5 Lower voltage than VH guarantees the protection turn-off 5.5 Typ. VCL CLINE RD DS12237 - Rev 5 VRM = 5.5 V 10 8 kV contact discharge after 30 ns, IEC 61000-4-2 10 8/20 µs waveform, IPP = 4 A F = 1 MHz, VLINE = 0 V, VOSC = 30 mV Pulse duration 100 ns Unit 10 V 5.9 VRM IRM Max. 4 0.18 V 5.5 V 50 nA V 11 V 5 pF Ω page 2/12 ESDZV5H-1BU2 Characteristics (curves) 1.1 Characteristics (curves) Figure 2. Leakage current versus junction temperature (typical values) 120 Figure 3. Junction capacitance versus applied voltage (typical values) IR(nA) C (pF ) 4 IR at VRM 5.5 V F = 1MHz Vosc= 30mVRMS Tj = 25 °C 3.5 100 3 80 2.5 60 2 1.5 40 1 20 0 0.5 Tj(°C) 0 50 100 VR(V) 0 0 150 Figure 4. ESD response to IEC 61000-4-2 (+8 kV contact discharge) 10 V/div 1 2 3 4 5 6 Figure 5. ESD response to IEC 61000-4-2 (-8 kV contact discharge) 10V/div Peak clamping voltage Clamping voltage at 30 ns Clamping voltage at 60 ns Clamping voltage at 100 ns 1 2 3 4 39.5 V 1 10 V -8.7 V -9.4 V 9.5 V 9.9 V 2 4 3 2 -10 V 4 3 1 2 3 4 1 - 40.7 V Peak clamping voltage Clamping voltage at 30 ns Clamping voltage at 60 ns Clamping voltage at 100 ns 20 ns/div 20 ns/div Figure 6. Positive TLP characteristic Figure 7. Negative TLP characteristic TLP current (A) TLP current (A) 20 20 18 18 16 16 14 14 12 12 10 10 8 8 6 6 4 4 2 0 Voltage (V) 0 1 DS12237 - Rev 5 2 3 4 5 6 7 8 9 10 11 Voltage (V) 2 12 0 0 1 2 3 4 5 6 7 8 9 10 11 12 page 3/12 ESDZV5H-1BU2 Characteristics (curves) Figure 8. S21 attenuation measurement result S21(dB) f(Hz) DS12237 - Rev 5 page 4/12 ESDZV5H-1BU2 Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 2.1 ST0201 package information Figure 9. ST0201 package outline D E Top A Side fD D1 fE E1 Bottom Note: DS12237 - Rev 5 b Note: The marking codes can be rotated by 90 ° or 180° to differentiate assembly location. In no case should this product marking be used to orient the component for its placement on a PCB. Only pin 1 mark is to be used for this purpose. page 5/12 ESDZV5H-1BU2 ST0201 package information Table 3. ST0201 package mechanical data Dimensions Ref. Millimeters Min. Typ. Max. A 0.210 0.240 0.270 b 0.140 0.170 0.200 D 0.550 0.580 0.610 D1 0.330 E 0.250 0.280 0.310 E1 0.170 0.200 0.230 fD 0.040 fE 0.040 Figure 10. Marking Pin1 Note: DS12237 - Rev 5 Pin2 Product marking may be rotated by multiples of 90° for assembly plant differentiation. In no case should this product marking be used to orient the component for its placement on a PCB. Only pin 1 mark is to be used for this purpose. page 6/12 ESDZV5H-1BU2 ST0201 package information Figure 11. Tape and reel specification (in mm) Dot indicates Pin 1 Ø 1.5 ±0.1 1.75 ±0.1 4.0 ±0.1 2.0 ±0.05 3.5 ±0.05 0.64 ±0.03 ! ! ! ! ! ! 0.27 ±0.03 ! 8.0 +0.03 -0.01 0.2 ±0.02 0.34 ±0.03 2.0 ±0.05 All dimensions in mm DS12237 - Rev 5 User direction of unreeling page 7/12 ESDZV5H-1BU2 Recommendation on PCB assembly 3 Recommendation on PCB assembly 3.1 Footprint 1. Footprint in mm a. SMD footprint design is recommended. Figure 12. Footprint in mm 0.187 0.225 0.150 Solder mask opening 3.2 Stencil opening design 1. Reference design a. Stencil opening thickness: 75 μm / 3 mils b. Stencil aperture ratio : 100% Figure 13. Recommended stencil window position in mm 0.167 0.210 0.170 Stencil apertures 3.3 Solder paste 1. 2. 3. 4. DS12237 - Rev 5 Halide-free flux qualification ROL0 according to ANSI/J-STD-004. “No clean” solder paste is recommended. Offers a high tack force to resist component movement during high speed. Use solder paste with fine particles: powder particle size 20-38 µm. page 8/12 ESDZV5H-1BU2 Placement 3.4 Placement 1. 2. 3. 4. 5. 6. 3.5 Manual positioning is not recommended. It is recommended to use the lead recognition capabilities of the placement system, not the outline centering Standard tolerance of ±0.05 mm is recommended. 1.0 N placement force is recommended. Too much placement force can lead to squeezed out solder paste and cause solder joints to short. Too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. To improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool. For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools. Reflow profile Figure 14. ST ECOPACK® recommended soldering reflow profile for PCB mounting 250 240-245 °C Temperature (°C) -2 °C/s 2 - 3 °C/s 60 sec (90 max) 200 -3 °C/s 150 -6 °C/s 100 0.9 °C/s 50 Time (s) 0 Note: DS12237 - Rev 5 30 60 90 120 150 180 210 240 270 300 Minimize air convection currents in the reflow oven to avoid component movement. Maximum soldering profile corresponds to the latest IPC/JEDEC J-STD-020. page 9/12 ESDZV5H-1BU2 Ordering information 4 Ordering information Figure 15. Ordering information scheme ESD Z V 5H - 1 B U2 ESD protection Z : Ultra low Clamping snapback effect V : Very Low Capacitance 5 : Stand-off voltage at 5.5 V max. H = Higher holding voltage Number of lines B = Bi-directional Package U2 = 0201 Table 4. Ordering information Order code Marking Package Weight Base qty. Delivery mode ESDZV5H-1BU2 L 0201 0.116 mg 15000 Tape and reel 1. The marking can be rotated by multiples of 90° to differentiate assembly location DS12237 - Rev 5 page 10/12 ESDZV5H-1BU2 Revision history Table 5. Document revision history DS12237 - Rev 5 Date Revision Changes 18-Jul-2017 1 First issue. 05-Jan-2018 2 Updated Figure 11: "Marking". 10-Sep-2018 3 Updated Table 1. Absolute maximum ratings (Tamb = 25 °C). 17-Jul-2019 4 Updated Section 3.1 Footprint. 31-Mar-2020 5 Updated Figure 9 and Table 3. page 11/12 ESDZV5H-1BU2 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2020 STMicroelectronics – All rights reserved DS12237 - Rev 5 page 12/12