EV-VN7003AH

EV-VN7003AH VN7003AH Evaluation Board Data brief – Compatible with 3 V and 5 V CMOS outputs – Extreme low voltage operation for deep cold cranking applications (compliant with LV124, revision 2013)  Diagnostic functions – Dedicated high precision proportional load current sense – Overload and short to ground (power limitation) indication – Thermal shutdown indication – OFF-state open-load detection – Output short to VCC detection – Sense enable/ disable Features Max transient supply voltage VCC 40 V Operating voltage range VCC 4 to 28 V Typ. on-state resistance (per Ch) RON 3.5 mΩ Current limitation (typ) ILIMH 135 A Stand-by current (max) ISTBY 0.5 µA VUSD_Cr 3V Minimum cranking supply voltage (VCC decreasing) anking  Simple single IC application board dedicated for VN7003AH  Provides electrical connectivity and thermal heat-sinking for easy prototyping  General device features – Single channel smart high-side driver with CurrentSense analog feedback – Very low standby current October 2016  Protections – Undervoltage shutdown – Overvoltage clamp – Load current limitation – Self limiting of fast thermal transients – Loss of ground and loss of VCC – Reverse battery – Electrostatic discharge protection Applications Specially intended for Automotive Smart Power Distribution, Glow Plug, Heating Systems, DC Motors, Relay replacement and high power resistive and inductive actuators. Description This board provides you an easy way to connect STMicroelectronics® VIPower® M0-7 technology into your existing system. Table 1. Device summary Order Code Reference EV-VN7003AH VN7003AH Evaluation Board DocID029869 Rev 1 For further information contact your local STMicroelectronics sales office. 1/8 www.st.com Overview 1 EV-VN7003AH Overview The board comes pre-assembled with VN7003AH high-side driver. On board minimum set of electrical components (as for device datasheet recommendation) is enabling the user to directly connect the load, the power supply and the microcontroller without any additional effort in external component design and connection. The VN7003AH is a single channel high-side driver manufactured using ST proprietary VIPower technology and housed in the Octapak package. The device is designed to drive 12 V automotive grounded loads through a 3 V and 5 V CMOS-compatible interface, providing protection and diagnostics. The device integrates advanced protective functions such as load current limitation, overload active management by power limitation and overtemperature shutdown. A sense enable pin allows OFF-state diagnosis to be disabled during the module low-power mode as well as external sense resistor sharing among similar devices. Figure 1. EV-VN7003AH schematic 2/8 DocID029869 Rev 1 EV-VN7003AH 2 Board connections Board connections Figure 2 shows the placement of the connectors to be used for supplying the evaluation board, connecting the load and controlling the functionality and diagnostic of the device. Figure 2. Evaluation board connections Table 2. J3 connector: pin functions Connector Pin number Pin name Pin function J3 1…4 N/A J3 5 IN_PullUP J3 6 +5V 5V Power Supply J3 7 N/A Not connected J3 8 MultiSense Analog current sense output pin delivers a current proportional to the load current. J3 9 S_EN Active high compatible with 3 V and 5 V CMOS outputs pin; it enables the CurrentSense diagnostic pin. J3 10...11 N/A Not connected J3 12 N/A Not connected J3 13 IN0 Voltage controlled input pin with hysteresis, compatible with 3 V and 5 V CMOS outputs. It controls OUT0 switch state. Not connected Connection to optional external pull-up resistor for open load detection in off-state. J3 14 IN1 Voltage controlled input pin with hysteresis, compatible with 3 V and 5 V CMOS outputs. It controls OUT1 switch state (Input not available for single channel) J3 15…18 N/A Not connected DocID029869 Rev 1 3/8 6 Board connections EV-VN7003AH In case the user wishes to utilize the Current Sense / MultiSense function of the device, it is necessary to plug a sense resistor in Rsense. The package includes a through-hole resistor, to be mounted on TP1-TP2 - see Figure 4. Different Rsense values can be adopted based on user preference. Another option is soldering an SMD resistor on the dedicated PCB pad, as shown in Figure 5. Figure 3. No sense resistor Figure 4. Mounting through-hole sense resistor 4/8 DocID029869 Rev 1 EV-VN7003AH Board connections Figure 5. Pads for soldering SMD resistor DocID029869 Rev 1 5/8 6 Thermal data 3 EV-VN7003AH Thermal data Table 3. EV-VN7003AH thermal data Symbol Parameter Max Unit Rthj-amb Thermal resistance junction-ambient (MAX) 39° °C/W Table 4. PCB specifications 6/8 Parameter Value Board dimensions 25 mm x 41.5 mm Number of Cu layer 2 Layer Cu thickness 35 μm Board finish thickness 1.6 mm +/- 10% Board Material FR4 Thermal vias separation 1.1 mm Thermal vias diameter 0.5 mm DocID029869 Rev 1 EV-VN7003AH 4 Revision history Revision history Table 5. Document revision history Date Revision 14-Oct-2016 1 Changes Initial release. DocID029869 Rev 1 7/8 7 EV-VN7003AH IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2016 STMicroelectronics – All rights reserved 8/8 DocID029869 Rev 1