EV-VND7030AJ

EV-VND7030AJ VND7030AJ evaluation board Data brief   Features Max transient supply voltage VCC 40 V Operating voltage range VCC 4 to 28 V Typ. on-state resistance (per Ch) RON 31 mΩ Current limitation (typ) ILIMH 56 A Stand-by current (max) ISTBY 0.5 µA    Simple single IC application board dedicated for VND7030AJ Provides electrical connectivity and thermal heat-sinking for easy prototyping General device features  Double channel smart high-side driver with MultiSense analog feedback  Very low standby current  Compatible with 3 V and 5 V CMOS outputs September 2015 Diagnostic functions  Multiplexed analog feedback of: load current with high precision proportional current mirror, VCC supply voltage and TCHIP device temperature  Overload and short to ground (power limitation) indication  Thermal shutdown indication  OFF-state open-load detection  Output short to VCC detection  Sense enable/disable Protections  Undervoltage shutdown  Overvoltage clamp  Load current limitation  Self limiting of fast thermal transients  Configurable latch-off on overtemperature or power limitation with dedicated fault reset pin  Loss of ground and loss of VCC  Reverse battery with external components  Electrostatic discharge protection Applications Typical applications are all types of automotive resistive, inductive and capacitive loads. Table 1: Device summary Order code EV-VND7030AJ DocID026359 Rev 3 Reference VND7030AJ evaluation board 1/7 www.st.com Description 1 EV-VND7030AJ Description ® ® This board provides you an easy way to connect STMicroelectronics VIPower M0-7 technology into your existing system. The board comes pre-assembled with VND7030AJ high-side driver. On board minimum set of electrical components (as for device datasheet recommendation) is enabling the user to directly connect the load, the power supply and the microcontroller without any additional effort in external component design and connection. The VND7030AJ is a double channel high-side driver manufactured using ST proprietary VIPower technology and housed in PowerSSO-16 package. The device is designed to drive 12 V automotive grounded loads through a 3 V and 5 V CMOS-compatible interface and to provide protection and diagnostics. The device integrates advanced protective functions such as load current limitation, overload active management by power limitation and overtemperature shutdown with configurable latch-off. A FaultRST pin unlatches the output in case of fault or disables the latch-off functionality. A dedicated multifunction multiplexed analog output pin delivers sophisticated diagnostic functions including high precision proportional load current sense, supply voltage feedback and chip temperature sense, in addition to the detection of overload and short circuit to ground, short to VCC and OFF-state open-load. A sense enable pin allows OFF-state diagnosis to be disabled during the module low-power mode as well as external sense resistor sharing among similar devices. Figure 1: Evaluation board schematic Vbat Vbat J1 1 2 3 4 5 6 7 8 9 10 C1 100nF In_PullU P 0 R_UP1 J3 In_PullU P FaultRS T MultiSense S_EN SEL0 SEL1 IN0 IN1 +5V 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 IN0 IN1 R1 15K R2 15K FaultRS T MultiSense S_EN R5 15K C3 10nF 1 Rsense TP1 SEL0 SEL1 PGND R4 15K R6 15K R7 15K 1 PGND 1 8 R3 15K TP2 2 3 7 5 6 4 INPUT0 INPUT1 FaultRS T SEn MultiSense SEL0 SEL1 J2 R_UP2 1 VB ATT U1 OUTPUT0 OUTPUT0 OUTPUT0 OUTPUT0 OUTPUT1 OUTPUT1 OUTPUT1 OUTPUT1 16 15 14 13 2 PGND Vbat Out0 12 11 10 9 Out1 GND PSS0-16 D1 R8 4K7 ES1D L CON18 PGND LED1 LED2 C2 10n F 1 2 3 4 5 6 7 8 9 10 C4 10n F R9 2k2 PGND R10 2k2 J4 PGND PGND GAPG1704141132CFT 2/7 DocID026359 Rev 3 EV-VND7030AJ 2 Board connections Board connections Figure 2: "Evaluation board connections" shows the placement of the connectors to be used for supplying the evaluation board, connecting the load and controlling the functionality and diagnostic of the device. Figure 2: Evaluation board connections Table 2: J3 connector: pin functions Connector Pin number Pin name J3 1…4 N/A J3 5 IN_PullUP J3 6 +5V J3 7 FaultRST Active low compatible with 3 V and 5 V CMOS outputs pin; it unlatches the output in case of fault; If kept low, sets the outputs in auto-restart J3 8 MultiSense Multiplexed analog sense output pin; it delivers a current proportional to the selected diagnostic: load current, supply voltage or chip temperature J3 9 S_EN Active high compatible with 3 V and 5 V CMOS outputs pin; it enables the MultiSense diagnostic pin. J3 10 SEL0 Active high compatible with 3 V and 5 V CMOS outputs pin; together with SEL1, it addresses the MultiSense multiplexer J3 11 SEL1 Active high compatible with 3 V and 5 V CMOS outputs pin; together with SEL0, it addresses the MultiSense multiplexer J3 12 N/A Not connected J3 13 IN0 Voltage controlled input pin with hysteresis, compatible with 3 V and 5 V CMOS outputs. It controls OUT0 switch state J3 14 IN1 Voltage controlled input pin with hysteresis, compatible with 3 V and 5 V CMOS outputs. It controls OUT1 switch state J3 15…18 N/A Not connected Pin function Not connected Connection to optional external pull-up resistor for open load detection in off-state. 5 V Power Supply DocID026359 Rev 3 3/7 Board connections EV-VND7030AJ In case the user wishes to utilize the Current Sense/MultiSense function of the device, it is necessary to plug a sense resistor in RSENSE. The package includes a through-hole resistor, to be mounted on TP1-TP2 (see Figure 4: "Mounting through-hole sense resistor"). Different RSENSE values can be adopted based on user preference. Another option is soldering an SMD resistor on the dedicated PCB pad, as shown in Figure 5: "Pads for soldering SMD resistor". Figure 3: No sense resistor Figure 4: Mounting through-hole sense resistor Figure 5: Pads for soldering SMD resistor 4/7 DocID026359 Rev 3 EV-VND7030AJ 3 Thermal data Thermal data Table 3: Thermal data Symbol Rthj-amb Parameter Thermal resistance junction-ambient (MAX) Max Unit 39 °C/W Table 4: PCB specifications Parameter Value Board dimensions 25 mm x 41.5 mm Number of Cu layer 2 Layer Cu thickness 35 μm Board finish thickness 1.6 mm +/- 10% Board Material FR4 Thermal vias separation 1.1 mm Thermal vias diameter 0.5 mm DocID026359 Rev 3 5/7 Revision history 4 EV-VND7030AJ Revision history Table 5: Revision history 6/7 Date Revis ion 15-May-2014 1 Initial release. 21-Jul-2014 2 Updated Figure 1: "Evaluation board schematic" 01-Sep-2015 3 Changed EV-VND7030AJ-E in EV-VND7030AJ. Updated Section "Features" and Section 1: "Description" Changes DocID026359 Rev 3 EV-VND7030AJ IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2015 STMicroelectronics – All rights reserved DocID026359 Rev 3 7/7