EV-VND7E050AJ

EV-VND7E050AJ Data brief VND7E050AJ evaluation board Features Max transient supply voltage VCC 40 V Operating voltage range VCC 4 to 28 V Typ. on-state resistance (per Ch) RON 50 mΩ Current limitation (typ) ILIMH 40 A Standby current (max) ISTBY 0.5 µA VUSD_cranking 2.85 V Minimum cranking supply voltage (VCC decreasing) • • • • Product status link EV-VND7E050AJ Order code EV-VND7E050AJ References EV-VND7E050AJ evaluation board • Simple single IC application board dedicated for VND7E050AJ Provides electrical connectivity and thermal heat-sinking for easy prototyping General device features – Double channel smart high-side driver with CurrentSense analog feedback – Very low standby current – Compatible with 3 V and 5 V CMOS outputs – Extreme low voltage operation for deep cold cranking applications (compliant to LV124, revision 2013) Diagnostic functions – Analog feedback of load current with high precision proportional current mirror – Overload and short to ground (power limitation) indication – Thermal shutdown indication – OFF-state open-load detection – Output short to VCC detection – Sense enable/disable Protections – Undervoltage shutdown – Overvoltage clamp – Load current limitation – Self limiting of fast thermal transients – Configurable latch-off on overtemperature or power limitation with dedicated fault reset pin – Loss of ground and loss of VCC – – Reverse battery with external components Electrostatic discharge protection Application • • • Automotive resistive, inductive and capacitive loads Protected supply for ADAS systems: radars and sensors Automotive headlamp DB4006 - Rev 1 - August 2019 For further information contact your local STMicroelectronics sales office. www.st.com EV-VND7E050AJ Description This board provides you an easy way to connect STMicroelectronics VIPower M0-7 technology into your existing system. The board comes pre-assembled with VND7E050AJ high-side driver. On board minimum set of electrical components (as for device datasheet recommendation) is enabling the user to directly connect the load, the power supply and the microcontroller without any additional effort in external component design and connection. The VND7E050AJ is a double channel high-side driver manufactured using ST proprietary VIPower technology and housed in PowerSSO-16 package. The device is designed to drive 12 V automotive grounded loads through a 3 V and 5 V CMOScompatible interface and to provide protection and diagnostics. The device integrates advanced protective functions such as load current limitation, overload active management by power limitation and overtemperature shutdown with configurable latch-off. A FaultRST pin unlatches the output in case of fault or disables the latch-off functionality. A dedicated multifunction multiplexed analog output pin delivers sophisticated diagnostic functions including high precision proportional load current sense, supply voltage feedback and chip temperature sense, in addition to the detection of overload and short-circuit to ground, short to VCC and OFF-state open-load. A sense enable pin allows OFF-state diagnosis to be disabled during the module low-power mode as well as external sense resistor sharing among similar devices. Figure 1. Evaluation board schematic Vbat Vbat J1 IN0 IN1 +5V R1 15K R2 15K IN0 IN1 FaultRST S_EN R5 15K CurrentSense C3 10nF 1 Rsense TP1 SEL0 SEL1 R4 15K R6 15K R7 15K 1 PGND R3 15K PGND TP2 1 INPUT0 8 INPUT1 2 FaultRST 3 SEn 7 CurrentSense 5 SEL0 6 SEL1 4 R_UP1 U1 J2 R_UP2 1 0 In_PullUP FaultRST CurrentSense S_EN SEL0 SEL1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 VBATT J3 In_PullUP PGND Vbat OUTPUT0 OUTPUT0 OUTPUT0 OUTPUT0 OUTPUT1 OUTPUT1 OUTPUT1 OUTPUT1 2 1 2 3 4 5 6 7 8 9 10 C1 100nF Out0 16 15 14 13 12 11 10 9 Out1 GND PSS0-16 D1 R8 4K7 ES1DL CON18 PGND LED1 LED2 C2 10nF 1 2 3 4 5 6 7 8 9 10 C4 10nF R9 2k2 PGND R10 2k2 J4 PGND PGND GADG300920191004FSR DB4006 - Rev 1 page 2/7 EV-VND7E050AJ Board connections 1 Board connections The figure below shows the placement of the connectors to be used for supplying the evaluation board, connecting the load and controlling the functionality and diagnostic of the device. Figure 2. Evaluation board connections Table 1. J3 connector: pin functions Connector Pin number Pin name Pin function J3 1…4 N/A Not connected J3 5 IN_PullUP J3 6 +5V J3 7 FaultRST J3 8 CurrentSense J3 9 S_EN Active high compatible with 3 V and 5 V CMOS outputs pin; it enables the CurrentSense diagnostic pin. J3 10 SEL0 Active high compatible with 3 V and 5 V CMOS outputs pin; together with SEL1, it addresses the CurrentSense multiplexer J3 11 SEL1 Active high compatible with 3 V and 5 V CMOS outputs pin; together with SEL0, it addresses the CurrentSense multiplexer J3 12 N/A Not connected J3 13 IN0 Voltage controlled input pin with hysteresis, compatible with 3 V and 5 V CMOS outputs. It controls OUT0 switch state J3 14 IN1 Voltage controlled input pin with hysteresis, compatible with 3 V and 5 V CMOS outputs. It controls OUT1 switch state. (1) J3 15…18 N/A Not connected Connection to optional external pull-up resistor for open load detection in off-state. 5 V Power Supply Active low compatible with 3 V and 5 V CMOS outputs pin; it unlatches the output in case of fault; If kept low, sets the outputs in auto-restart Analog current sense output pin; delivers a current proportional to the selected load current. 1. Input not available for single channel. In case the user wishes to utilize the CurrentSense/MultiSense function of the device, it is necessary to plug a sense resistor in RSENSE. The package includes a through-hole resistor, to be mounted on TP1-TP2 (see Figure 4. Mounting through-hole sense resistor). DB4006 - Rev 1 page 3/7 EV-VND7E050AJ Board connections Different RSENSE values can be adopted based on user preference. Another option is soldering an SMD resistor on the dedicated PCB pad, as shown in Figure 5. Pads for soldering SMD resistor. Figure 3. No sense resistor Figure 4. Mounting through-hole sense resistor Figure 5. Pads for soldering SMD resistor DB4006 - Rev 1 page 4/7 EV-VND7E050AJ Thermal data 2 Thermal data Table 2. Thermal data Symbol Rthj-amb Parameter Thermal resistance junction-ambient (max) Max Unit 39 °C/W Table 3. PCB specifications DB4006 - Rev 1 Parameter Value Board dimensions 25 mm x 41.5 mm Number of Cu layer 2 Layer Cu thickness 35 μm Board finish thickness 1.6 mm +/- 10% Board Material FR4 Thermal vias separation 1.1 mm Thermal vias diameter 0.5 mm page 5/7 EV-VND7E050AJ Revision history Table 4. Document revision history DB4006 - Rev 1 Date Version 29-Aug-2019 1 Changes Initial release. page 6/7 EV-VND7E050AJ IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2019 STMicroelectronics – All rights reserved DB4006 - Rev 1 page 7/7