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EV-VNH7040AY

EV-VNH7040AY

  • 厂商:

    STMICROELECTRONICS(意法半导体)

  • 封装:

  • 描述:

    VNH7040AY 电机控制器/驱动器 电源管理 评估板

  • 数据手册
  • 价格&库存
EV-VNH7040AY 数据手册
EV-VNH7040AY EV-VNH7040AY Evaluation Board Data brief connect the load, the power supply and the microcontroller without any additional effort in external component design and connection. VNH7040AY is a full bridge motor driver intended for a wide range of automotive applications. The device incorporates a dual monolithic high-side driver and two low-side switches. Both switches are designed using ST proprietary VIPower® M0 technology that allows to efficiently integrate on the same die a true Power MOSFET with an intelligent signal/protection circuitry. The three dies are assembled in a PowerSSO-36 package equipped with three exposed islands for optimized dissipation performances. Features Parameter Symbol Value Unit Max transient supply voltage VCC 38 V Operating voltage range VCC 4 to 28 V Typ. on-state resistance (per Ch) RON 40 mΩ Current limitation (typ) ILIMH 35 A Stand-by current (max) ISTBY 1 µA  Simple single IC application board dedicated for VNH7040AY  Provides electrical connectivity and thermal heat-sinking for easy prototyping Description This package is specifically designed for the harsh automotive environment and offers improved thermal performance thanks to exposed die pads. A Multisense_EN pin is available to enable the MultiSense diagnostic. The input signals INA and INB can directly interface the microcontroller to select the motor direction and the brake condition. Two selection pins (SEL0 and SEL1) are available to address the information available on the Multisense to the microcontroller. The Multisense pin allows to monitor the motor current by delivering a current proportional to the motor current value and also provides the diagnostic feedback. The PWM, up to 20 KHz, allows to control the speed of the motor in all possible conditions. Table 1. Device summary Order Code Reference EV-VNH7040AY VNH7040AY Evaluation Board EV-VNH7040AY provides you an easy way to connect ST VIPower M0-7 HBridge drivers into your existing prototype circuitry. This evaluation board comes preassembled with VNH7040AY  H-Bridge. The on-board minimum set of electrical components (as for device datasheet recommendation) enables the user to directly June 2017 DocID030659 Rev 1 For further information contact your local STMicroelectronics sales office. 1/8 www.st.com Design recommendation 1 EV-VNH7040AY Design recommendation This evaluation board provides mounting and some heat sinking capability for prototype development. Figure 1. VNH7040AY evaluation board schematic 2/8 DocID030659 Rev 1 EV-VNH7040AY Design recommendation Figure 2. VNH7040AY evaluation board top layout Figure 3. VNH7040AY evaluation board bottom layout DocID030659 Rev 1 3/8 5 Board connections 2 EV-VNH7040AY Board connections Table 2. Pin connection and function Connector Board lead number Device pin function J1 1, 2 GND J1 3, 4, 5, 6 OUTA J1 7 INA J1 8 GND J1 9 INB J1 10, 11, 12, 13 OUTB J1 14, 15 GND J2 1, 2 GND J2 3 SENSE_EN J2 4 SEL0 J2 5 GND J2 6 M_SENSE J2 7, 8, 9, 10, 11 VCC J2 12 GND J2 13 PWM J2 14, 15 GND Table 3. BOM 4/8 Component Value C1 33 nF C2 470 uF 50V R1, R2,R3, R4, R7, R8 1K Ohm R5, R9 10K Ohm R6 1.5k Ohm DocID030659 Rev 1 EV-VNH7040AY 3 Thermal data Thermal data Table 4. EV-VNH7040AY thermal data Symbol Parameter Max Unit Rthj-amb Thermal resistance junction-ambient HSD (MAX) 40 °C/W Rthj-amb Thermal resistance junction-ambient LSD (MAX) 45 °C/W Table 5. PCB specifications Parameter Value Unit 41 x 47 mm Number of Cu layer 2 - Layer Cu thickness 35 μm 1.6 +/- 10% mm FR4 - Board dimensions Board finish thickness Board Material Thermal vias separation 1.1 mm Thermal vias diameter 0.5 mm DocID030659 Rev 1 5/8 5 ECOPACK® 4 EV-VNH7040AY ECOPACK® In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 6/8 DocID030659 Rev 1 EV-VNH7040AY 5 Revision history Revision history Table 6. Document revision history Date Revision 06-Jun-2017 1 Changes Initial release. DocID030659 Rev 1 7/8 7 EV-VNH7040AY IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2017 STMicroelectronics – All rights reserved 8/8 DocID030659 Rev 1
EV-VNH7040AY 价格&库存

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