EV-VNH7070AS

EV-VNH7070AS VNH7070AS Evaluation Board Data brief recommendation) is enabling the user to directly connect the load, the power supply and the microcontroller without any additional effort in external component design and connection. VNH7070AS is a full bridge motor driver intended for a wide range of automotive applications. The device incorporates a dual monolithic high-side driver and two low-side switches. Both switches are designed using ST proprietary VIPower® M0 technology that allows to efficiently integrate on the same die a true Power MOSFET with an intelligent signal/protection circuitry. The three dies are assembled in SO-16N package on electrically isolated leadframes. Moreover, its fully symmetrical mechanical design allows superior manufacturability at board level. Features Max transient supply voltage VCC 41 V Operating voltage range VCC 4 to 28 V Typ. on-state resistance (per Ch) RON 70 mΩ Current limitation (typ) ILIMH 15 A Stand-by current (max) ISTBY 1 µA  Simple single IC application board dedicated for VNH7070AS  Provides electrical connectivity and thermal heat-sinking for easy prototyping The input signals INA and INB can directly interface the microcontroller to select the motor direction and the brake condition. A SEL0 pin is available to address the information available on the MultiSense to the microcontroller. The MultiSense pin allows to monitor the motor current by delivering a current proportional to the motor current value. The PWM, up to 20 kHz, allows to control the speed of the motor in all possible conditions.. Table 1. Device summary Order Code Reference EV- VN7070AS VN7070AS Evaluation Board Description EV-VNH7070AS provides you an easy way to connect STMicroelectronics® VIPower® M0-7  H-Bridge drivers into your existing prototype circuity. This evaluation board comes preassembled with VNH7070AS  H-Bridge. On board minimum set of electrical components (as for device datasheet October 2016 DocID029936 Rev 1 For further information contact your local STMicroelectronics sales office. 1/8 www.st.com Design recommendation 1 EV-VNH7070AS Design recommendation This evaluation board provides mounting and some heat sinking capability for prototype development. Figure 1. VNH7070AS evaluation board schematic Figure 2. VNH7070AS evaluation board top layout 2/8 DocID029936 Rev 1 EV-VNH7070AS Design recommendation Figure 3. VNH7070AS evaluation board bottom layout DocID029936 Rev 1 3/8 5 Board connections 2 EV-VNH7070AS Board connections Table 2. Pin connection and function Connector Board lead number Device pin function J1 1, 2 GND J1 3, 4, 5, 6 OUTA J1 7 INA J1 8 GND J1 9 INB J1 10, 11, 12, 13 OUTB J1 14, 15 GND J2 1, 2 GND J2 4 SEL0 J2 5 GND J2 6 CS J2 7, 8, 9, 10, 11 VCC J2 12 GND J2 13 PWM J2 14, 15 GND Table 3. BOM 4/8 Component Value C1 33 nF C2 220 uF 35V R1, R2,R3, R4 1k Ohm R5 10K Ohm R6 1.5k Ohm DocID029936 Rev 1 EV-VNH7070AS 3 Thermal data Thermal data Table 4. EV-VNH7070AS thermal data Symbol Parameter Max Unit Rthj-amb Thermal resistance junction-ambient HSD (MAX) 55 °C/W Rthj-amb Thermal resistance junction-ambient HSD (MAX) 75 °C/W Table 5. PCB specifications Parameter Value Unit 47 x 41 mm Number of Cu layer 2 - Layer Cu thickness 35 μm 1.6 +/- 10% mm FR4 - Board dimensions Board finish thickness Board Material Thermal vias separation 1.1 mm Thermal vias diameter 0.5 mm DocID029936 Rev 1 5/8 5 Package information EV-VNH7070AS 4 Package information 4.1 ECOPACK® packages In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 6/8 DocID029936 Rev 1 EV-VNH7070AS 5 Revision history Revision history Table 6. Document revision history Date Revision 26-Oct-2016 1 Changes Initial release. DocID029936 Rev 1 7/8 7 EV-VNH7070AS IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2016 STMicroelectronics – All rights reserved 8/8 DocID029936 Rev 1